LQG21
Abstract: LQN2A LQP21 coil LQP21A LQS33N LQS33 lqp21
Contextual Info: SURFACE MOUNT INDUCTORS SOLDERING SOLDERING METHOD RECOMMENDED SOLDERING CONDITIONS 2. Soldering Conditions Chip coils can be flow or reflow soldered. LQS33N, LQM32C, LQP21A/31A should be reflow soldered only. Please contact Murata Electronics regarding other
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lqs33nlqm32clqp21a/31alqg21+6lqg21n/clqs33lqp21alqn2alqp21 coillqp21
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LQH3C221k04
Abstract: LQH3C220K04 MURATA LQ marking k04 LQH3C470K04 H3C2 3C561 lqh3c marking .h3c h3c220
Contextual Info: SURFACE MOUNT INDUCTORS LQH1C/3C/LQM32C Series The LQ H 1C, L Q G 21C , L Q H 3 C and L Q M 3 2 C S eries are subminiature chip coils with low D C resistance, high current capacity and high im pedance characteristics. T hese features are made possible by the development of Murata Electronics’
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lqh1c/3c/lqm32c12/jh970ma32c1d+12lqm32c100phlqh3c221k04lqh3c220k04murata lqmarking k04lqh3c470k04h3c23c561lqh3cmarking .h3ch3c220
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LQS33N
Abstract: LQN2A JIS C 0806
Contextual Info: SURFACE MOUNT INDUCTORS PACKAGING 8c STORAGE Packaging Units L W T Reflow Taping W idth Appearance Flow Product Na m e 2.0 1.25 0.9 1.25 O O 8 4,000 — 1,000 3.2 1.6 1.8 O o 8 2,000 — — LQH3N/3C 3.2 2.5 2.0 o o 8 2,000 — — LQH N 4N 4.5 3.2 2.6 o
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0330mlqg21m/clqm32clqs33n+6lqp21alqp31alqg21nlqp21a/31alqn2ajis c 0806
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tzbx4n100bc110
Abstract: MA2810-1 tz03p450fr LQH3NR27M92 kf 470 replacements transistors RPE110COG2R2C100V LQH3N220K04 DE1410E 1022R DE7100F222MVA1-KC
Contextual Info: DESIGN ENGINEERING KITS ★ KIT-GRM39 CAPACITORS— CHIB M O N O LITH IC • ■ ■ ■ ■ ■ muFfntn Part No. Miniature size Wide capacitance, TC, voltage and tolerance range Industry standard sizes 8mm and 12mm tape and reel for auto-placements Barrier layer termination systems for wave, reflow or vapor phase solder
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kit-grm39kit-grm36grm36cog0r5c53500k+163900k4250k4050k3650k4100k4200ktzbx4n100bc110ma2810-1tz03p450frlqh3nr27m92kf 470 replacements transistorsrpe110cog2r2c100vlqh3n220k04de1410e1022rde7100f222mva1-kc
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LDC33
Contextual Info: CIRCUIT MODULE H ybrid 1C C O M P O N E N T S F O R M O U N T IN G O N H Y B R ID IC ’S: FEATURES A h ig h ly fu n c tio n a l a n d in te g ra te d c irc u it c a n be re a liz e d by in te g ra tin g v a rio u s c h ip c o m p o n e n ts and s e m ic o n d u c to rs on o n e s u b s tra te . M u ra ta E le c tro n ic s
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LQS33N
Contextual Info: CHIP INDUCTORS m u ffn tn These ultra small, high performance chip inductors feature a low direct current resistance and outstanding high frequency characteristics. Each series has a unique structure specifically designed with a wide range of values suitable for various appli
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eiaj-rc-1009bn1a/lqh1n/lqh1c/lqh3n/lqh3c/lqp31a/lqp21a180mm330mm+3lqm32clqs33nlqg21n
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LEM3225
Abstract: murata mci
Contextual Info: A COMPANY OF CROSS REFERENCE GUIDE Molded Wirewound Chip Inductors | ISC-1210 ABC Taiwan ACT CM453232 IC1812 C C M M fE M TS CM322522 AIC1812 IC1210 AIS1812 AIC1210 Bourns CM453232 Chllisin C1453232T, NL453232T Coilcraft 1812LS, 1812CS Non-Molded Style 1611FS
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isc-1210cm453232ic1812cm322522+7aic1812ic1210ais1812aic1210c1453232tlem3225murata mci
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