LQFP PACKAGE TRAY Search Results

LQFP Package tray

Abstract: 128-PIN nec 144 pin LQFP LQFP Package 128-pin LQFP 144 tray
Contextual Info: TRAY CONTAINER UNIT : mm 17.55 135°C MAX 22.63 25.40 17.80 22.63 100.8 A' LQFP 20x20×1.4 25.20 135.9 NEC A 279.4 315.0 322.6 SECTION A-A' 22.63 6.02 (6.35) 7.62 19.85 Applied Package Quantity (pcs) Material 128-pin Plastic LQFP (Fine Pitch) (1.4mm thick)

LQFP Package tray

Abstract: TQFP14X14X1 LQFP "100 pin" PACKAGE LQFP Package 128-pin 128-PIN tray container dimensions TRAY CONTAINER LQFP14 100-PIN PLASTIC LQFP NEC tqfp14x14x1.4
Contextual Info: TRAY CONTAINER 7 15.45 16.7 6x15=90 21.00 A' A 150°C MAX. PPE 105.0 TQFP14X14X1.4 15.40 16.7 20.30 284.2 315.0 322.6 Section A – A' 16.7 5.62 (6.35) 13.85 7.62 135.9 UNIT : mm Applied Package Quantity (pcs) 80-pin Plastic LQFP (1.4mm thick) 100-pin Plastic LQFP (1.4mm thick)

LQFP Package tray

Abstract: 128-PIN ST-TQ142014TJ-1 NEC 87 tray dimensions
Contextual Info: TRAY CONTAINER A' 15.45 16.64 21.00 150°C MAX. 7 A PPE ST-TQ142014TJ-1 135.9 105 UNIT : mm 22.64 25.40 17.80 279.4 315 322.6 SECTION A-A' 22.64 Applied Package 100-pin Plastic LQFP 1.4mm thick 128-pin Plastic LQFP (1.4mm thick) 5.62 6.35 7.62 19.87 Quantity (pcs)

LQFP1414-8bt Package tray

Abstract: LQFP Package tray h658 LQFP1414-8BT
Contextual Info: TRAY CONTAINER HEAT PROOF 7 A' 15.45 18.0 6x15=90 21.00 A 135°CMAXPPE 105.0 NEC LQFP1414−8BT 15.40 18.0 20.30 284.2 315.0 322.6 < SECTION A – A' > 18.0 5.62 (6.35) 13.85 7.62 135.9 UNIT : mm Applied Package 64-pin Plastic LQFP (1.4mm thick) 80-pin Plastic LQFP (1.4mm thick)

LQFP Package tray

Abstract: JEDEC TRAY DIMENSIONS
Contextual Info: TRAY CONTAINER UNIT : mm 7 x 17=119 NEC 135° C MAX. A' 14.60 17.90 14.30 14.60 108.0 13.95 18.00 LQFP12 × 12× 1.4 135.9 PPE A 286.4 315.0 322.6 SECTION A-A' 14.60 5.62 (6.35) 7.62 11.82 Applied Package 64-pin Plastic LQFP (1.4mm thick) 80-pin Plastic LQFP (Fine Pitch)(1.4mm thick)

LQFP Package tray

Abstract: JEDEC TRAY DIMENSIONS tray container dimensions
Contextual Info: TRAY CONTAINER UNIT : mm 10 x 25=250 113.4 135.9 PPE NEC 135° C MAX. A' 9.60 11.25 12.60 LQFP7 × 7× 1.4 A 9.60 12.20 11.10 292.8 315.0 322.6 SECTION A-A' 9.60 5.62 (6.35) 7.62 6.82 Applied Package 48-pin Plastic LQFP (Fine Pitch)(1.4mm thick) 64-pin Plastic LQFP (Fine Pitch)(1.4mm thick)

LQFP Package tray

Abstract: TQFP 1414 1.4mm JEDEC tray standard TQFP 1414
Contextual Info: HEAT PROOF 16.7 15.45 21.00 A' 6x15=90 A 150°CMAXPPE 7 105.0 TQFP 14×14×1.4 135.9 UNIT : mm 15.40 16.7 20.30 284.2 315.0 322.6 < SECTION A – A' > 16.7 5.62 6.35 7.62 13.85 Applied Package Quantity (pcs) 100-pin Plastic LQFP (1.4mm thick) MAX. 90 Tray

QFP JEDEC tray

Abstract: nec 44 pin LQFP LQFP Package tray NEC lqfp 52 JEDEC TRAY QFP JEDEC tray standard qfp tray standard nec 44pin QFp Package tray tray qfp 160 jedec
Contextual Info: TRAY CONTAINER HEAT PROOF 7 A' 15.20 13.10 12.5 PPE 135°C MAX NEC 15.70 A 8x20 = 160 13.00 109.9 LQFP 10×10×1.4 12.5 288.8 315.0 322.6 SECTION A-A' 12.50 Applied Package 6.12 (6.35) 9.90 7.62 135.9 UNIT : mm Quantity (pcs) 64-pin Plastic QFP (1.4mm thick)

ST-TQ142014TJ-1

Abstract: LQFP Package tray
Contextual Info: A' 15.45 16.64 21.00 150°C MAX. 7 A PPE ST-TQ142014TJ-1 135.9 105 UNIT : mm 22.64 25.40 17.80 279.4 315 322.6 SECTION A – A' 22.64 Applied Package 100-pin Plastic LQFP 1.4mm thick 5.62 6.35 7.62 19.87 Quantity (pcs) MAX. 72 Tray Material Heat Proof Temp.

LQFP Package tray

Abstract: fine pitch LQFP24 JEDEC TRAY DIMENSIONS tray container dimensions LQFP-24
Contextual Info: TRAY CONTAINER HEAT PROOF 30.40 20.70 26.4 7 135°C MAX NEC PPE A' 20.70 A 4x10=40 31.50 94.5 LQFP24×24×1.4 135.9 UNIT : mm 26.4 273.6 315.0 322.6 SECTION A – A' 26.4 6.12 7.62 (6.35) 23.9 Applied Package Quantity (pcs) 160-pin • Plastic LQFP(Fine Pitch)(1.4mm thick)

3510A

Abstract: LA10A LQFP Package tray
Contextual Info: Unit : mm 335±1.0 23.5±0.5 288±0.5 27.5±0.1 13.85 A' A 137.5±0.5 180±1.0 21.25±0.5 32±0.1 NEC LA–3510A–1 HEAT PROOF 19.85 SECTION A – A' 22.2 6.8 5.8 8.8 19.85 Applied Package Quantity pcs 100pin Plastic LQFP (1.4mm thick) MAX. 60 Tray LA-3510A-1

Marking Code 2K

Contextual Info: EEPROM & Memory Card Code Information 1/2 Last Updated : August 2009 S5XXXXXXXX - XXXX 1 2 3 4 5 6 7 8 1. System LSI (S) 12. Package Type 1 : TEBGA A : SDIP C : CHIP BIZ E : LQFP G : CLCC J : ELP L : CERDIP N : COB Q : QFP S : SOP V : SSOP Y : FBGA 2. Large Classfication : MOS (5)

Contextual Info: Packing Instruction Page:1/1 Tube and Tray Unit Quantity Update: June 3,2015 Description SRAM Product / Package 28 SOJ 25 ea / Tube 2,500 ea / 100 Tube / Box 10,000 ea / 4 Box / CTN 32 SOJ 22 ea / Tube 2,200 ea / 100 Tube / Box 8,800 ea / 4 Box / CTN 28 SOP

mp 9141 es

Abstract: MC33662 MPXY8600 MPC5673F MPC56xx fet e300 MPC5606B MC33905 mpxy8500 MPC5643L
Contextual Info: Automotive Quarter 4, 2010 SG187Q42010 Rev 40 FREESCALE SEMICONDUCTOR ANALOG AND MIXED SIGNAL PRODUCTS The product categories range from Power Actuation and Network Transceivers to Signal Conditioning and Embedded MCU + Power. Power Actuation covers a broad range of

MPXY8600

Abstract: MPC5674 MPC5603 MPC56xx MPC5668G MPC55XX JTAG MPXY8600A MC33730 MPC5516E MPC5517E
Contextual Info: Automotive Quarter 4, 2009 SG187Q42009 Rev 37 Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: i.MX and MPC5668G product families; S12XE, MPC551x, MPC560xS, MPC563xM, MPC560xB, MPC5533, MPC5534 and MPC5553 products in 208 MAPBGA packages.

9s08dz32

Abstract: 9s12xeq384 144 QFP 908QY1 9S12XDT256 manual 9S12XHZ256 9s08sg32 9S08DZ128 NEXUS iso MC33810 MC33882
Contextual Info: Automotive Quarter 4, 2007 SG187Q42007 Rev 29 FREESCALE SEMICONDUCTOR ANALOG AND MIXED SIGNAL PRODUCTS The product categories range from Power Actuation and Network Transceivers to Signal Conditioning and Embedded MCU + Power. Power Actuation covers a broad

MC908LJ24

Abstract: MC908Lk24 MC908MR16 mc908mr32 MC3PHAC xc912bc32 MC68376 bdm programming MC9S08SH4 xc912dg128 USBMULTILINKBDME
Contextual Info: Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: DSP56852VFE, DSP56F807VF80, DSP56F807VF80E, MC56F8357VVFE, MC56F8367VVFE

OBD II Protocol ISO 9141

Abstract: SC510727 advantages of microcontroller mc9s08aw16 sg2023 relay K-line interface mc9s12dg256 code example assembly electric assisted power steering system motor circuit diagram obd diagnostic SG187 Common rail injector service manuals
Contextual Info: Automotive Quarter 4, 2005 SG187 Rev 22 About This Revision–Q4/2005 When new products are introduced, a summary of the new products will be provided in this section. However, the New Product section will only appear on this page when new products have been introduced during the quarter.

MS-026 lqfp 80

Abstract: DS170G MS-026 JEDEC Matrix Tray outlines LQFPPOWERQUAD2 CS-007
Contextual Info: LEADFRAME data sheet LQFP PowerQuad 2 Features: LQFP PowerQuad® 2 Packages: LQFP PowerQuad® 2 PQ2 is the same Amkor patented, advanced IC packaging technology used in plastic QFPs but applied to Low Profile 1.4 mm QFPs (LQFP). This breakthrough in IC packaging

QFN tray

Abstract: 7x7x1.4 tray tray datasheet bga MKT71C1176-00 qfn 5 x 5 TRAY PS007229-1010 lqfp 7x7 tray BGA package tray 64 BGA 31 x 31 tray LQFP Package tray
Contextual Info: Packaging Product Specification PS007229-1010 Copyright 2010 by Zilog , Inc. All rights reserved. www.zilog.com Packaging Product Specification Warning: DO NOT USE IN LIFE SUPPORT LIFE SUPPORT POLICY ZILOG'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE

MS-026

Abstract: JEDEC Matrix Tray outlines CS-007 MS-026 lqfp 80 MS026 tray 20 x 14 LQFPPOWERQUAD4 MS-026 lqfp 128
Contextual Info: LEADFRAME data sheet LQFP PowerQuad 4 Features: LQFP PowerQuad® 4 Packages: LQFP PowerQuad® 4 PQ4 is the same Amkor patented, advanced IC packaging technology used in MQFP PQ4s but applied to Low Profile 1.4 mm QFPs (LQFP). Improved power dissipation is

OBD II Protocol ISO 9141

Abstract: SC510727 Common rail injector service manuals MC9S12XDP384 electric assisted power steering system motor LED DRIVER 16pin QFP circuit diagram obd diagnostic Common rail injector driver SG187 switch circuit diagram af remote control door lock
Contextual Info: Automotive Quarter 3, 2005 SG187 Rev 21 About This Revision–Q3/2005 When new products are introduced, a summary of the new products will be provided in this section. However, the New Product section will only appear on this page when new products have been introduced during the quarter.

Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5604BC Rev. 10, 11/2012 MPC5604B/C MAPBGA–225 QFN12 144 LQFP ##_mm_x_##mm 208 MAPBGA 15 mm x 15 mm 17 x 17 x 1.7 mm MPC5604B/C SOT-343R ##_mm_x_##mm 100 LQFP (14 x 14 x 1.4 mm)

antistatic epe foam

Abstract: mark JS sot-25 V7100 sot89 MARK JB 150MIL 300MIL 600MIL SOT-25 JB QFP Shipping Trays TTO-220
Contextual Info: The Operation Instruction of Packing Materials PURPOSE Warehouse and Subcontractors according to the instruction for purchaseing and incoming inspection, formulate the Operation Instruction of Packing Materials. SCOPE Related all packing materials in warehouse.