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    LQFP PACKAGE TRAY Search Results

    LQFP PACKAGE TRAY Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    54ACT825/QKA
    Rochester Electronics LLC 54ACT825/QKA - Dual marked (5962-9161101MKA), D-Type Flip-Flop, 5V, 24-CFP PDF Buy
    TPH1R306PL
    Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N) Datasheet
    TPH9R00CQH
    Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Datasheet
    TPH9R00CQ5
    Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) Datasheet
    TPHR8504PL
    Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N) Datasheet

    LQFP PACKAGE TRAY Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    LQFP Package tray

    Abstract: fine pitch LQFP24 JEDEC TRAY DIMENSIONS tray container dimensions LQFP-24
    Contextual Info: TRAY CONTAINER HEAT PROOF 30.40 20.70 26.4 7 135°C MAX NEC PPE A' 20.70 A 4x10=40 31.50 94.5 LQFP24×24×1.4 135.9 UNIT : mm 26.4 273.6 315.0 322.6 SECTION A – A' 26.4 6.12 7.62 (6.35) 23.9 Applied Package Quantity (pcs) 160-pin • Plastic LQFP(Fine Pitch)(1.4mm thick)


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    LQFP24 160-pin 176-pin 216-pin SSD-A-H6569 LQFP Package tray fine pitch JEDEC TRAY DIMENSIONS tray container dimensions LQFP-24 PDF

    Contextual Info: Packing Instruction Page:1/1 Tube and Tray Unit Quantity Update: June 3,2015 Description SRAM Product / Package 28 SOJ 25 ea / Tube 2,500 ea / 100 Tube / Box 10,000 ea / 4 Box / CTN 32 SOJ 22 ea / Tube 2,200 ea / 100 Tube / Box 8,800 ea / 4 Box / CTN 28 SOP


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    9B/18B PDF

    MC908LJ24

    Abstract: MC908mr16 mc908mr32 xc912dg128 MC908Lk24 mc9s08dz32 reference manual MC9S08SH4 MC3PHAC MC9S08AW32 dsp56f803bu80e
    Contextual Info: 8/16/32 Bit Microcontrollers Quarter 1, 2008 SG1006Q12008 Rev 0 FREESCALE’S 8-BIT PRODUCTS SUMMARY For complete part number information and temperature definitions, refer to Product Numbering System on page SG1006-9. General Purpose Products Product Flash


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    SG1006Q12008 SG1006-9. 10-Bit HCS08 MC9S08AW60 MC9S08AW32 MC908LJ24 MC908mr16 mc908mr32 xc912dg128 MC908Lk24 mc9s08dz32 reference manual MC9S08SH4 MC3PHAC MC9S08AW32 dsp56f803bu80e PDF

    9s08dz32

    Abstract: 9s12xeq384 144 QFP 908QY1 9S12XDT256 manual 9S12XHZ256 9s08sg32 9S08DZ128 NEXUS iso MC33810 MC33882
    Contextual Info: Automotive Quarter 4, 2007 SG187Q42007 Rev 29 FREESCALE SEMICONDUCTOR ANALOG AND MIXED SIGNAL PRODUCTS The product categories range from Power Actuation and Network Transceivers to Signal Conditioning and Embedded MCU + Power. Power Actuation covers a broad


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    SG187Q42007 9s08dz32 9s12xeq384 144 QFP 908QY1 9S12XDT256 manual 9S12XHZ256 9s08sg32 9S08DZ128 NEXUS iso MC33810 MC33882 PDF

    OBD II Protocol ISO 9141

    Abstract: SC510727 advantages of microcontroller mc9s08aw16 sg2023 relay K-line interface mc9s12dg256 code example assembly electric assisted power steering system motor circuit diagram obd diagnostic SG187 Common rail injector service manuals
    Contextual Info: Automotive Quarter 4, 2005 SG187 Rev 22 About This Revision–Q4/2005 When new products are introduced, a summary of the new products will be provided in this section. However, the New Product section will only appear on this page when new products have been introduced during the quarter.


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    SG187 Q4/2005 MC68HC908QC4 MC68HC908QC8 MC68HC908QC16 MC9S08AW1e SG187 OBD II Protocol ISO 9141 SC510727 advantages of microcontroller mc9s08aw16 sg2023 relay K-line interface mc9s12dg256 code example assembly electric assisted power steering system motor circuit diagram obd diagnostic Common rail injector service manuals PDF

    OBD II Protocol ISO 9141

    Abstract: SC510727 Common rail injector service manuals MC9S12XDP384 electric assisted power steering system motor LED DRIVER 16pin QFP circuit diagram obd diagnostic Common rail injector driver SG187 switch circuit diagram af remote control door lock
    Contextual Info: Automotive Quarter 3, 2005 SG187 Rev 21 About This Revision–Q3/2005 When new products are introduced, a summary of the new products will be provided in this section. However, the New Product section will only appear on this page when new products have been introduced during the quarter.


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    SG187 Q3/2005 MMA7260Q MC56F8335VFG60 MC56F8335MFG60 MAC7101 SG187 OBD II Protocol ISO 9141 SC510727 Common rail injector service manuals MC9S12XDP384 electric assisted power steering system motor LED DRIVER 16pin QFP circuit diagram obd diagnostic Common rail injector driver switch circuit diagram af remote control door lock PDF

    mpc5604

    Abstract: mpc5604 reference design MPC5604B MPC5603B sPC560 MPC5604 spi example
    Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5604BC Rev. 11, 12/2012 MPC5604B/C MAPBGA–225 QFN12 144 LQFP ##_mm_x_##mm 208 MAPBGA 15 mm x 15 mm 17 x 17 x 1.7 mm MPC5604B/C Microcontroller Data Sheet Features • • • •


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    MPC5604BC MPC5604B/C QFN12 MPC5604B/C OT-343R 32-bit e200z0) 16-bit mpc5604 mpc5604 reference design MPC5604B MPC5603B sPC560 MPC5604 spi example PDF

    mpc5604 reference design

    Abstract: mpc5604 MPC5604 FlexCAN mpc560xb errata MPC5603B package MPC5607 2-PE-12 MPC5604 spi example
    Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5604BC Rev. 9, 06/2011 MPC5604B/C MAPBGA–225 QFN12 144 LQFP ##_mm_x_##mm 208 MAPBGA 15 mm x 15 mm 17 x 17 x 1.7 mm MPC5604B/C Microcontroller Data Sheet • • • • • •


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    MPC5604BC MPC5604B/C QFN12 MPC5604B/C 32-bit e200z0) 16-bit mpc5604 reference design mpc5604 MPC5604 FlexCAN mpc560xb errata MPC5603B package MPC5607 2-PE-12 MPC5604 spi example PDF

    tray 20 x 14

    Abstract: BGA 31 x 31 tray bga trays tray bga 17 bga tray
    Contextual Info: Tube and Tray Packing TUBE PACKING STANDARDS Tubes are made from clear, rigid polyvinyl chloride PVC or clear polycarbonate (PC). Tubes are dipped in antistatic solution to increase surface resistivity. Tube quantities are specified below. Table I. Tube Quantities by Package Type


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    E04102 tray 20 x 14 BGA 31 x 31 tray bga trays tray bga 17 bga tray PDF

    LQFP-48 thermal pad

    Abstract: CS-007 TQFP 100 pin ic pcb design 0,5 mm pitch 5x5 matrix LD176 tqfp 7x7 tqfp 7x7 1.4 tray tqfp 7x7 tray LD48
    Contextual Info: LEADFRAME data sheet ExposedPad LQFP / TQFP Features ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /


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    PDF

    mpc5605

    Abstract: MPC5605B MPC5606B CC 4093 N MPC5607 MPC5607B pj 88 LV IC 4093 pin configuration ic lm 4704 sdc 7500 pwm control
    Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: MPC5607B Rev. 5, 08/2010 MPC5607B 100 LQFP 14 mm x 14 mm MPC5607B Microcontroller Data Sheet • Single issue, 32-bit CPU core complex e200z0h – Compliant with the Power Architecture technology


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    MPC5607B MPC5607B 32-bit e200z0h) 16-bit 32-bit mpc5605 MPC5605B MPC5606B CC 4093 N MPC5607 pj 88 LV IC 4093 pin configuration ic lm 4704 sdc 7500 pwm control PDF

    Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5604BC Rev. 12, 04/2014 MPC5604B/C MAPBGA–225 QFN12 144 LQFP ##_mm_x_##mm 208 MAPBGA 15 mm x 15 mm 17 x 17 x 1.7 mm MPC5604B/C SOT-343R ##_mm_x_##mm 100 LQFP (14 x 14 x 1.4 mm)


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    MPC5604BC MPC5604B/C QFN12 OT-343R 32-bit e200z0) 16-bit 32-bit PDF

    JESD51-8

    Abstract: JESD51-2 JEDEC JESD51-8 qfn 44 PACKAGE footprint 9mm surface mount package dimensions FREESCALE PACKING jesd51 8 JEDEC-STD-020 JEDEC-STD020 tqfp 44 PACKAGE footprint
    Contextual Info: Freescale Semiconductor, Inc. ANALOG ICs INTEGRATED SOLUTIONS Freescale Semiconductor, Inc. PACKAGING Robust packaging is a key technology component of Analog Products. Motorola puts solutions together in single packages to accomodate power and high voltages.


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    BR1568/D JESD51-8 JESD51-2 JEDEC JESD51-8 qfn 44 PACKAGE footprint 9mm surface mount package dimensions FREESCALE PACKING jesd51 8 JEDEC-STD-020 JEDEC-STD020 tqfp 44 PACKAGE footprint PDF

    tray lqfp

    Abstract: JEDEC qfn tray QFn Package tray JEDEC TRAY DIMENSIONS QFN
    Contextual Info: ARM-based Flash MCU SAM4S Series SUMMARY DATASHEET Description The Atmel SAM4S series is a member of a family of Flash microcontrollers based on the high-performance 32-bit ARM Cortex ® -M4 RISC processor. It operates at a maximum speed of 120 MHz and features up to 2048 Kbytes of Flash, with optional


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    32-bit tray lqfp JEDEC qfn tray QFn Package tray JEDEC TRAY DIMENSIONS QFN PDF

    Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: MPC5607B Rev. 8, 04/2014 MPC5607B 100 LQFP 14 mm x 14 mm MPC5607B Microcontroller Data Sheet • • • • • • • • • • • • • Single issue, 32-bit CPU core complex e200z0h


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    MPC5607B MPC5607B 32-bit e200z0h) 16-bit PDF

    LQFP100 tray dimension

    Abstract: JESD97 Classification E3
    Contextual Info: ARM-based Flash MCU SAM4E16E SAM4E8E SAM4E16C SAM4E8C SUMMARY DATASHEET Description The Atmel SAM4E series of Flash microcontrollers is based on the high-performance 32-bit ARM Cortex®-M4 RISC processor and includes a floating point unit FPU . It operates at a maximum speed of 120 MHz and features up to 1024 Kbytes of Flash,


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    SAM4E16E SAM4E16C 32-bit LQFP100 tray dimension JESD97 Classification E3 PDF

    Contextual Info: SPC560B54x SPC560B60x, SPC560B64x 32-bit MCU family built on the Power Architecture for automotive body electronics applications Features • ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ High performance 64 MHz e200z0h CPU – 32-bit Power Architecture® technology CPU


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    SPC560B54x SPC560B60x, SPC560B64x 32-bit e200z0h 16-channel LQFP100) PDF

    MC100EP111

    Abstract: MPC9109 MPC940L MPC940LAC MPC940LFA MPC940LFAR2 MPC942
    Contextual Info: LOW VOLTAGE 1:18 CLOCK DISTRIBUTION CHIP The MPC940L is a 1:18 low voltage clock distribution chip with 2.5 V or 3.3 V LVCMOS output capabilities. The device features the capability to select either a differential LVPECL or an LVCMOS compatible input. The 18 outputs are 2.5 V or 3.3 V LVCMOS


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    MPC940L 199707558G MC100EP111 MPC9109 MPC940LAC MPC940LFA MPC940LFAR2 MPC942 PDF

    09nc

    Abstract: MPC5603B package
    Contextual Info: Document Number: MPC5604BC Rev. 7, 07/2010 MPC5604B/C MAPBGA–225 QFN12 144 LQFP ##_mm_x_##mm 208 15 MAPBGA mm x 15 mm 17 x 17 x 1.7 mm MPC5604B/C Microcontroller Data Sheet 32-bit MCU family built on the Power Architecture for automotive body electronics applications


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    MPC5604B/C QFN12 MPC5604B/C 32-bit e200z0) 16-bit MPC5604BC MPC5604BxMG 09nc MPC5603B package PDF

    MOTOROLA LOT MARKINGS

    Abstract: On semiconductor date Code IC Lot Code Identification marking code 6L QFN tray qfn 4x4 AND8002 ase qfn unisem QFN marking code onsemi Diode on alpha year and work week
    Contextual Info: AND8002/D Clock Generation and Clock and Data Marking and Ordering Information Guide http://onsemi.com Prepared by: Paul Shockman ON Semiconductor APPLICATION NOTE Introduction This application note describes the device markings and ordering information for the following ON Semiconductor


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    AND8002/D MOTOROLA LOT MARKINGS On semiconductor date Code IC Lot Code Identification marking code 6L QFN tray qfn 4x4 AND8002 ase qfn unisem QFN marking code onsemi Diode on alpha year and work week PDF

    KLT20

    Abstract: k1648 klt22 KEL32 MC100 HEP64 KLT21 LP17 KEP32 HEP139
    Contextual Info: AND8002/D ECLinPS, ECLinPS Lite, ECLinPS Plus, ECLinPS MAX, and GigaComm Marking and Ordering Information Guide http://onsemi.com APPLICATION NOTE Prepared by: Paul Shockman ON Semiconductor HFPD Applications Engineer Introduction This application note describes the device markings and


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    AND8002/D KLT20 k1648 klt22 KEL32 MC100 HEP64 KLT21 LP17 KEP32 HEP139 PDF

    MPC5645

    Abstract: MPC5646 mpc5646c MPC5644B PJ6N e200z4d e200z0 LQPF176 PCR130 MPC5645B
    Contextual Info: Freescale Data Sheet: Technical Data Document Number: MPC5646C Rev. 5.1, 08/2012 MPC5646C 176-pin LQFP 24 mm x 24 mm MPC5646C Microcontroller Datasheet On-chip modules available within the family include the following features: • e200z4d dual issue, 32-bit core Power Architecture


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    MPC5646C MPC5646C 176-pin 208-pin e200z4d 32-bit e200z0h MPC5645 MPC5646 MPC5644B PJ6N e200z0 LQPF176 PCR130 MPC5645B PDF

    MPC5606B

    Abstract: PCR110 MPC560xB mpc560x PCR111
    Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5607B Rev. 4, 08/2010 MAPBGA–225 15 mm x 15 mm MPC5607B Microcontroller Data Sheet Features • • • • • • • • • • • • SOT-343R ##_mm_x_##mm 144 LQFP 20 x 20 x 1.4 mm


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    MPC5607B MPC5607B QFN12 32-bit e200z0h) 16-bit MPC560xB MPC5606B PCR110 mpc560x PCR111 PDF

    Atmel MARKING CODE

    Abstract: ATPL210A ADD1321 ADD8051C3A ATPL210A-A1U-Y ATPL210 ADD1221 atmel 8051 OFDM program CODES ATMEL 118
    Contextual Info: Atmel ATPL210A PRIME compliant Power Line Communications SoC SUMMARY DATASHEET Features • Core • ADD8051C3A enhanced 8051 core • Speedups up to x5 vs. standard 8051 microcontroller • Modem • • • • • Power Line Carrier Modem for 50 and 60 Hz mains


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    ATPL210A ADD8051C3A 97-carrier 32Kbytes 256Kbytes 128-bit Atmel MARKING CODE ATPL210A ADD1321 ATPL210A-A1U-Y ATPL210 ADD1221 atmel 8051 OFDM program CODES ATMEL 118 PDF