LQFP 208 Search Results

LQFP-48 thermal pad

Abstract: CS-007 TQFP 100 pin ic pcb design 0,5 mm pitch 5x5 matrix LD176 tqfp 7x7 tqfp 7x7 1.4 tray tqfp 7x7 tray LD48
Contextual Info: LEADFRAME data sheet ExposedPad LQFP / TQFP Features ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /

TQFP 100 pin ic

Abstract: 208ld
Contextual Info: LEADFRAME data sheet ExposedPad LQFP / TQFP Features: ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /

MS-026 lqfp 80

Abstract: DS170G MS-026 JEDEC Matrix Tray outlines LQFPPOWERQUAD2 CS-007
Contextual Info: LEADFRAME data sheet LQFP PowerQuad 2 Features: LQFP PowerQuad® 2 Packages: LQFP PowerQuad® 2 PQ2 is the same Amkor patented, advanced IC packaging technology used in plastic QFPs but applied to Low Profile 1.4 mm QFPs (LQFP). This breakthrough in IC packaging

CX20493

Abstract: conexant cx20493 reference design msr 900 reader TRANSISTOR C940
Contextual Info: CX81801-7x/8x SmartV.XX V.92/V.34/V.32bis Modem in 128-Pin LQFP with CX20493 SmartDAA in 32-Pin LQFP and Optional CX20442 Voice Codec Data Sheet Doc. No. 102247B October 30, 2003 CX81801-7x/8x SmartV.XX Modem in 128-Pin LQFP with CX20493 in 32-Pin LQFP Data Sheet

LQFP 208

Abstract: ZL3806 LQFP208 LBGA-100
Contextual Info: Voice Echo Cancellation VOICE PROCESSING VOICE/DATA 8 4 64(128) 0.056 100 pin LQFP, 208 ball LBGA ZL50235 16(8) 64(128) 0.088 100 pin LQFP, 208 ball LBGA MT9300B 32(16) 64(128) 1 160 pin MQFP, 208 ball LBGA MT93L00 32(16) 64(128) 0.15 100 pin LQFP, 208 ball LBGA

JEDEC MS-026

Abstract: MS-026 Amkor mold compound lqfp 7x7 tray jedec MS-026-A
Contextual Info: LEADFRAME data sheet LQFP Features: Low Profile Quad Flat Pack LQFP Packages: Amkor offers a broad line of LQFP IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness. This allows IC packaging engineers, component specifiers and systems designers

lqfp 7x7 tray

Abstract: MS-026 7X748LD amkor
Contextual Info: LEADFRAME data sheet LQFP Features: Low Profile Quad Flat Pack LQFP Packages: Amkor offers a broad line of LQFP IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness. This allows IC packaging engineers, component specifiers and systems designers

Techpoint

Abstract: 100L JESD51-2 JESD51-7 lqfp 7x7 tray QFP 128 bonding
Contextual Info: LQFP Low Profile Quad Flat Pack • 7 x 7mm to 28 x 28mm body sizes • 32 to 208 lead counts • Lead pitch range from 0.80mm to 0.40mm FEATURES DESCRIPTION • Body Sizes: 7 x 7mm to 28 x 28mm STATS ChipPAC’s LQFP is a low profile 1.4mm version of the QFP. The LQFP is a leadframe based, plastic encapsulated

NQPACK100SD-ND

Abstract: SS01-71039-1E NQPACK100SD-ND-SL
Contextual Info: FUJITSU SEMICONDUCTOR SUPPORT SYSTEM SS01-71039-1E DSU-FR EMULATOR LQFP-100P HEADER TYPE 4 MB2198-126 OPERATION MANUAL PREFACE Thank you for purchasing the LQFP-100P header type 4 MB2198-126 for the DSU-FR emulator. The LQFP-100P header type 4 is used to connect the DSU-FR emulator (MB2198-01, referred to as

8012-X

Abstract: dd136
Contextual Info: AMI A M I SE M IC O N D U C TO R s Packaging Capabilities LQFP Description Surface Mount The Low Profile Quad Flatpack LQFP plastic package family is a reduced thickness plastic surface mount package. The LQFP package is constructed using the latest wire bonding and molding technology to provide

NQPACK100SD-ND-SL

Abstract: NQPACK100 LQFP-100P MB91270 PGA-401P 134b25 66A46
Contextual Info: FUJITSU SEMICONDUCTOR SUPPORT SYSTEM SS01-71048-1E DSU-FR EMULATOR LQFP-100P HEADER TYPE5 MB2198-129 OPERATION MANUAL PREFACE Thank you for purchasing the LQFP-100P header type5 MB2198-129 for the DSU-FR emulator. The LQFP-100P header type5 is used to connect the DSU-FR emulator (MB2198-01*3) and the

MB2147-01

Abstract: F2MC-16 Socket IC 80 pin LQFP MB90820
Contextual Info: FUJITSU SEMICONDUCTOR SUPPORT SYSTEM SS01-71037-1E F2MC-16 Family EMULATOR LQFP-80P PROBE HEADER TYPE2 MB2147-561 OPERATION MANUAL PREFACE Thank you for purchasing the LQFP-80P probe header type2 MB2147-561 for the F2MC-16 family emulator. The LQFP-80P probe header type2 is used to connect the F2MC-16L/16LX emulator (MB2147-01,

NQPACK080SB-SL

Abstract: F2MC-16 MB2147-01 MB90820 LQFP-80
Contextual Info: FUJITSU SEMICONDUCTOR SUPPORT SYSTEM SS01-71038-1E F2MC-16 Family EMULATOR LQFP-80P PROBE HEADER TYPE 3 MB2147-562 OPERATION MANUAL PREFACE Thank you for purchasing the LQFP-80P probe header type 3 MB2147-562 for the F2MC-16 family emulator. The LQFP-80P probe header type 3 is used to connect the F2MC-16L/16LX emulator (MB2147-01,

a8293

Abstract: FPT-64P-M09 MB91265 NQPACK064SB PGA-401P
Contextual Info: FUJITSU MICROELECTRONICS SUPPORT SYSTEM SS01-71126-1E DSU-FR EMULATOR LQFP-64P HEADER MB2198-128-E OPERATION MANUAL PREFACE Thank you for purchasing the LQFP-64P*1 header MB2198-128-E for the DSU-FR*2 emulator. The LQFP-64P header is used in the adapter unit to connect the DSU-FR emulator (MB2198-01-E)*3

F2MC-16

Abstract: LQFP-48P MB2147-01 MB90340 mb90340 application note
Contextual Info: FUJITSU SEMICONDUCTOR SUPPORT SYSTEM SS01-71046-1E F2MC-16 Family EMULATOR LQFP-48P PROBE HEADER MB2147-521 OPERATION MANUAL PREFACE Thank you for purchasing the LQFP-48P*1 probe header MB2147-521 for the F2MC*2-16 family emulator. The LQFP-48P probe header is used to connect the F2MC-16L/16LX emulator (MB2147-01*3) and

NQPACK144SD-ND

Abstract: NQPACK144SD-ND-SL FPT-144P-M08 MB91220 PGA-401P Socket IC 80 pin LQFP Package FPT-144P-M08
Contextual Info: FUJITSU SEMICONDUCTOR SUPPORT SYSTEM SS01-71052-2E DSU-FR EMULATOR LQFP-144P HEADER TYPE8 MB2198-132 OPERATION MANUAL PREFACE Thank you for purchasing the LQFP-144P *1 header type 8 MB2198-132 for the DSU-FR *2 emulator. The LQFP-144P header type 8 (MB2198-132) is a header used to connect the DSU-FR emulator

LQFP 128 pin Socket

Contextual Info: FUJITSU SEMICONDUCTOR SUPPORT SYSTEM SS01-71040-1E DSU-FR EMULATOR LQFP-64P HEADER MB2198-128 OPERATION MANUAL PREFACE Thank you for purchasing the LQFP-64P header MB2198-128 for the DSU-FR emulator. The LQFP-64P header is used in the adapter unit to connect the DSU-FR emulator (MB2198-01, referred to as "emulator") and the DSU-FR emulator PGA-401P adapter type2 (MB2198-130, referred

MARK A48

Abstract: LQFP-100P MB91260 PGA401P
Contextual Info: FUJITSU MICROELECTRONICS SUPPORT SYSTEM SS01-71124-1E DSU-FR EMULATOR LQFP-100P HEADER TYPE 4 MB2198-126-E OPERATION MANUAL PREFACE Thank you for purchasing the LQFP-100P*1 header type 4 MB2198-126-E for the DSU-FR*2 emulator. The LQFP-100P header type 4 is used to connect the DSU-FR emulator (MB2198-01-E)*3 to a user

Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5604BC Rev. 10, 11/2012 MPC5604B/C MAPBGA–225 QFN12 144 LQFP ##_mm_x_##mm 208 MAPBGA 15 mm x 15 mm 17 x 17 x 1.7 mm MPC5604B/C SOT-343R ##_mm_x_##mm 100 LQFP (14 x 14 x 1.4 mm)

FPT-208P-M06

Abstract: lqfp 52
Contextual Info: LOW PROFILE QUAD FLAT PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN PLASTIC FPT-208P-M06 208-pin plastic LQFP FPT-208P-M06 208-pin plastic LQFP (FPT-208P-M06) Lead pitch 0.50 mm Package width x package length 28.0 × 28.0 mm Lead shape Gullwing Sealing method

MPC5604B

Abstract: mpc5604 MPC5603 MPC5602B MPC5607 trace MPC56 MPC560 ic lm 4704 MPC5603B ordering MPC56
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5604BC Rev. 8, 11/2010 MPC5604B/C MAPBGA–225 QFN12 144 LQFP ##_mm_x_##mm 208 15 MAPBGA mm x 15 mm 17 x 17 x 1.7 mm MPC5604B/C Microcontroller Data Sheet SOT-343R ##_mm_x_##mm 100 LQFP

LQFP 208

Abstract: FPT-208P-M06
Contextual Info: LOW PROFILE SHRINK QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN PLASTIC FPT-208P-M06 208-pin plastic LQFP Lead pitch 0.50 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Plastic mold FPT-208P-M06 208-pin plastic LQFP

Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5604BC Rev. 12, 04/2014 MPC5604B/C MAPBGA–225 QFN12 144 LQFP ##_mm_x_##mm 208 MAPBGA 15 mm x 15 mm 17 x 17 x 1.7 mm MPC5604B/C SOT-343R ##_mm_x_##mm 100 LQFP (14 x 14 x 1.4 mm)

Contextual Info: FUJITSU SEMICONDUCTOR SUPPORT SYSTEM SS01-71044-1E DSU-FR EMULATOR LQFP-144P HEADER TYPE7 MB2198-131 OPERATION MANUAL PREFACE Thank you for purchasing the LQFP-144P header type7 MB2198-131 for the DSU-FR emulator. The LQFP-144P header type7 is used in the adapter unit to connect the DSU-FR emulator (MB219801, re-ferred to as "emulator") and the DSU-FR emulator PGA-401P adapter type2 (MB2198-130,