LQFP 208 Search Results

LQFP-48 thermal pad

Abstract: CS-007 TQFP 100 pin ic pcb design 0,5 mm pitch 5x5 matrix LD176 tqfp 7x7 tqfp 7x7 1.4 tray tqfp 7x7 tray LD48
Contextual Info: LEADFRAME data sheet ExposedPad LQFP / TQFP Features ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /

8012-X

Abstract: dd136
Contextual Info: AMI A M I SE M IC O N D U C TO R s Packaging Capabilities LQFP Description Surface Mount The Low Profile Quad Flatpack LQFP plastic package family is a reduced thickness plastic surface mount package. The LQFP package is constructed using the latest wire bonding and molding technology to provide

FPT-208P-M06

Abstract: lqfp 52
Contextual Info: LOW PROFILE QUAD FLAT PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN PLASTIC FPT-208P-M06 208-pin plastic LQFP FPT-208P-M06 208-pin plastic LQFP (FPT-208P-M06) Lead pitch 0.50 mm Package width x package length 28.0 × 28.0 mm Lead shape Gullwing Sealing method

Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5604BC Rev. 12, 04/2014 MPC5604B/C MAPBGA–225 QFN12 144 LQFP ##_mm_x_##mm 208 MAPBGA 15 mm x 15 mm 17 x 17 x 1.7 mm MPC5604B/C SOT-343R ##_mm_x_##mm 100 LQFP (14 x 14 x 1.4 mm)

PCR 406 J

Abstract: transistor pcr 406 sdc 7500 pwm control PCR 406 J transistor PCR 406 TRANSISTOR smd transistor pk3 sdc 7500 transistor SMD PJ3 data sheet for all smd components NEW TRANSISTOR DATA SHEET
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5606S Rev. 1, 10/2008 MPC5606S LQFP–144 MAPBGA–225 QFN12 20 mm x 20 mm ##_mm_x_##mm 15 mm x 15 mm MPC560xS Microcontroller Data Sheet LQFP–176 24 mm x 24 mm SOT-343R ##_mm_x_##mm

SIGNETICS

Abstract: QFP minimum pitch size qfp 0.4mm lead frame QFP lead frame gold wire MQFP
Contextual Info: Data Sheet Signetics Signetics Flip Chip Package Data Sheet Signetics QFP Signetics MQFP, MQFP LOC, MQFP H/S, LQFP, LQFP Sensor, QFP EPP, and TQFP The Signetics QFP package family is a lead frame based package with gull wing style leads on four sides. Signetics offers an array of QFP’s including standard MQFP,

F741583

Abstract: sp3721d d741667bpgf F741583PGF f721501apgf tnetv901apag F711862PGE F721730EPBK f721905pag F731891PDV
Contextual Info: 12500 TI Boulevard, MS 8640, Dallas, Texas 75243 Final Notification of Qualification of New Environmentally Friendly green Mold Compound for TQFP/LQFP Packages Assembled at TI Philippines and TI Taiwan Assembly Sites Change Notification Letter PCN# 20040714001

mpc5604

Abstract: mpc5604 reference design MPC5604B MPC5603B sPC560 MPC5604 spi example
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5604BC Rev. 11, 12/2012 MPC5604B/C MAPBGA–225 QFN12 144 LQFP ##_mm_x_##mm 208 MAPBGA 15 mm x 15 mm 17 x 17 x 1.7 mm MPC5604B/C Microcontroller Data Sheet Features • • • •

FPT-208P-M06

Abstract: lqfp 52 LQFP Package
Contextual Info: LOW PROFILE SHRINK QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN PLASTIC To Top / Package Lineup / Package Index FPT-208P-M06 208-pin plastic LQFP Lead pitch 0.50 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method

footprint plcc 208

Abstract: PLASTIC QUAD FLAT PACK 160 PINS DIMENSION LXT304A LXT305A LXT307 LXT310 LXT317 LXT318 LXT325 A 3120 8 Pins ICs
Contextual Info: Fall 1998 Communication ICs Data Book Table 1: Telecom Product/Packages Product Table 1: Telecom Product/Packages Product Package Package SXT6051 208 QFP SXT6251 208 QFP SXT6282 144-Pin LQFP LXT300Z/301Z 28-Pin DIP and 28-Pin PLCC LXT304A 28-Pin DIP and 28-Pin PLCC

1820fH

Abstract: CXD1257AR ICX026CKA ICX027CKA ICX054AK ICX055AK ICX056AK 64pin digital sony 1816fH analog camera
Contextual Info: CXD1257AR CCD Camera Timing Generator Description The CXD1257AR generates the timing pulses required by the CCD image sensors as well as signal processing circuits. 64 pin LQFP Plastic Features • NTSC and PAL compatible • Electronic shutter function

mpc5604 reference design

Abstract: mpc5604 MPC5604 FlexCAN mpc560xb errata MPC5603B package MPC5607 2-PE-12 MPC5604 spi example
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5604BC Rev. 9, 06/2011 MPC5604B/C MAPBGA–225 QFN12 144 LQFP ##_mm_x_##mm 208 MAPBGA 15 mm x 15 mm 17 x 17 x 1.7 mm MPC5604B/C Microcontroller Data Sheet • • • • • •

CXD1265R

Abstract: ICX038BLA ICX038BNA ICX038BNB ICX039BLA ICX039BNA ICX039BNB ICX058AK ICX058AKB ICX058AL
Contextual Info: CXD1265R CCD Camera Timing Generator Description The CXD1265R generates the timing pulses required by the CCD image sensors as well as signal processing circuits. 64 pin LQFP Plastic Features • NTSC and PAL compatible • Compatible with digital and analog camera

LQFP256

Abstract: ZL50017 ZL50017GAC ZL50017GAG2 ZL50017QCC
Contextual Info: ZL50017 1 K Digital Switch Data Sheet Features • November 2006 1024 channel x 1024 channel non-blocking digital Time Division Multiplex TDM switch at 4.096, 8.192 or 16.384 Mbps Ordering Information ZL50017GAC ZL50017QCC ZL50017QCG1 256 Ball PBGA 256 Lead LQFP

pj 88 LV

Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5646C Rev. 4, 07/2011 MPC5646C 176-pin LQFP 24 mm x 24 mm MPC5646C Microcontroller Datasheet On-chip modules available within the family include the following features: • • •

sc6038

Abstract: SC-6038 K 2941 SOT393-1 DBS13P DIP20 DIP28 HDIP18 LQFP100 LQFP48
Contextual Info: PACKAGE INFORMATION Page Index DBS DIP HDIP LQFP PLCC QFP SDIP SIL SO SSOP SQFP Soldering 1816 1818 1822 1823 1827 1830 1836 1839 1841 1849 1851 1852 Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION DBS DIL-bent-SIL

pcb design 0,5 mm pitch

Abstract: PBGA 1515 D 4242 STD150 Samsung ASIC fbga 153
Contextual Info: Appendix Package Capabilities D Package Appendix D Package The most current package availability and capability can be obtained from your local Samsung Technology and Design Centers. • In-house ❏ Sub-contractor LQFP Package 0707 mm 1010 mm 1212 mm 1420 mm

MPC5606B

Abstract: MPC5607B
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: MPC5607B Rev. 6, 07/2011 MPC5607B 100 LQFP 14 mm x 14 mm MPC5607B Microcontroller Data Sheet • Single issue, 32-bit CPU core complex e200z0h – Compliant with the Power Architecture technology

Contextual Info: Freescale Semiconductor Advanced Information Document Number: MM912F634 Rev. 5.0, 11/2010 Integrated S12 Based Relay Driver with LIN MM912F634 48-PIN LQFP-EP, 7.0 mm x 7.0 mm AE SUFFIX: Exposed Pad Option The MM912F634 is an integrated single package solution that

MPC5634

Abstract: mpc5633 SPC5633 SPC5634 MPC5633M SPC5634MF2MLU80 SPC5634MF2MLQ80 SPC5633MF2MLQ80 an3926 SPC563M60L3
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5634M Rev. 9, 05/2012 MPC5634M 144 LQFP 20 mm x 20 mm MPC5634M Microcontroller Data Sheet • Operating Parameters — Fully static operation, 0 MHz – 80 MHz plus 2% frequency modulation - 82 MHz

SPC563M64L5

Contextual Info: SPC563M64L5, SPC563M64L7 SPC563M60L5P, SPC563M60L7P 32-bit Power Architecture based MCU for automotive powertrain applications Datasheet  production data Features • 144 LQFP 20 mm x 20 mm Single issue, 32-bit Power Architecture® Book E compliant e200z335 CPU core complex

MC9S12I32

Abstract: 43561 43461 0X0103 CTR30 CSE06 micro HCS12 NV 15F HCS12 HS21
Contextual Info: Document Number: MM912F634 Rev. 4.0, 10/2010 Freescale Semiconductor Advanced Information Integrated S12 Based Relay Driver with LIN MM912F634 48-PIN LQFP-EP, 7.0 mm x 7.0 mm AE SUFFIX: Exposed Pad Option The MM912F634 is an integrated single package solution that

MPC5606B

Abstract: MPC5605B mpc5605B reference manual mpc560xB reference manual MPC560xB MPC560xB freescale
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: MPC5607B Rev. 5, 08/2010 100 LQFP 14 mm x 14 mm MPC5607B Microcontroller Data Sheet • Single issue, 32-bit CPU core complex e200z0h – Compliant with the Power Architecture technology

MM912F634

Abstract: S12SPIV4 lift control ISO7637-2 NV 15F relay 5v to 12v pin connections hcs12 S08 CRG 48-PIN HCS12 HS21
Contextual Info: Document Number: MM912F634 Rev. 5.0, 11/2010 Freescale Semiconductor Advanced Information Integrated S12 Based Relay Driver with LIN MM912F634 48-PIN LQFP-EP, 7.0 mm x 7.0 mm AE SUFFIX: Exposed Pad Option The MM912F634 is an integrated single package solution that