LPDDR2 CIRCUIT DESIGN Search Results

Contextual Info: Freescale Semiconductor Application Note Document Number: AN4397 Rev. 1, 06/2013 Common Hardware Design for i.MX 6Dual/6Quad and i.MX 6Solo/6DualLite The i.MX 6Quad, i.MX 6Dual, i.MX 6DualLite, and i.MX 6Solo families of applications processors represent Freescale Semiconductor’s ARM Cortex -A9 based

G2986

Contextual Info: G2986 Global Mixed-mode Technology LPDDR2/LPDDR3 Termination Regulator Features „ „ „ „ „ „ „ „ „ „ „ „ „ General Description Support 1.2V LPDDR2/LPDDR3 and DDR IIIL 0.675VTT Requirements Input Voltage Range: 3V to 5.5V VLDOIN Voltage Range: 1.2V to 3.6V

DA9053

Abstract: VLDO10
Contextual Info: Fact Sheet DA9053 Flexible High Power System PMIC variants to support Freescale i.MX53 designs General Description The DA9053 is a quad buck PMIC subsystem suitable for use on Freescale’s Multimedia Reference Platforms. Combining a powerful switched-mode DC input/USB compatible charger, full

imx6sl

Abstract: JTAG-SM AN439
Contextual Info: Hardware Development Guide for i.MX 6SoloLite Applications Processors IMX6SLHDG Rev 1 06/2013 Contents Paragraph Number Title Page Number Contents Chapter 1 Design Checklist 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 Design checklist overview . 1-1

Contextual Info: Cyclone V GX Starter Kit User Manual 1 www.terasic.com April 7, 2014 CONTENTS INTRODUCTION . 3 CHAPTER 1 1.1 PACKAGE CONTENTS. 3

74164 truth table

Abstract: W978H6KB 74191, 74192, 74193 circuit diagram
Contextual Info: W978H6KB / W978H2KB LPDDR2-S4B 256Mb Table of Contents1. GENERAL DESCRIPTION . 6 2. FEATURES . 6

Contextual Info: W979H6KB / W979H2KB LPDDR2-S4B 512Mb Table of Contents1. GENERAL DESCRIPTION . 6 2. FEATURES . 6

UG933

Abstract: ZYNQ-7000 zynq7000 UG865
Contextual Info: Zynq-7000 All Programmable SoC PCB Design and Pin Planning Guide UG933 v1.5 September 26, 2013 Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum

Contextual Info: W97AH6KB / W97AH2KB LPDDR2-S4B 1Gb Table of Contents1. GENERAL DESCRIPTION . 6 2. FEATURES . 6

Manufacturer ID list eMMC

Abstract: emmc 4.41 spec finder type 81.11
Contextual Info: Intel Atom Processor Z2760 Datasheet October 2012 Revision 1.0 Document Number: 328104-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS

Contextual Info: Freescale Semiconductor Application Note Document Number: AN4580 Rev. 0, 12/2012 i.MX 6SoloLite Power Consumption Measurement by Freescale Semiconductor, Inc. This application note helps the user design power management systems. Through several use cases, this report

OMAP5430

Abstract: OMAP5432 MIPI CSI-2 Parallel bridge Toshiba eMMC 4.40 emmc pcb layout toshiba eMMC DS MIPI DPI CAMERA PARALLEL RGB TO MIPI CSI-2 TWL6041 emmc toshiba
Contextual Info: Version F EL I M Data Manual IN Multimedia Device Engineering Samples 2.0 AR OMAP5430 Public Version PR ADVANCE INFORMATION concerns new products in the sampling or preproduction phase of development. Characteristic data and other specifications are subject to change without notice.

sony cmos sensor imx 174

Abstract: Sony imx 174 Sony IMX 145 CMOS
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6SLCEC Rev. 3, 04/2014 MCIMX6LxDVN10xx MCIMX6LxEVN10xx i.MX 6SoloLite Applications Processors for Consumer Products Package Information Plastic Package 13 x 13 mm, 0.5 mm pitch Ordering Information

samsung eMMC 4.5

Abstract: eMMC samsung* lpddr2 lpddr2 SAMSUNG emmc emmc 4.5 emmc samsung SAMSUNG moviNAND lpddr2 mcp samsung lpddr2
Contextual Info: Samsung Mobile Memory Taking Mobility to New Storage Horizons Mobile DRAM | Multi-Chip Packages | eMMC Samsung Mobile Memory Mobile DRAM The future of Mobile DRAM Performance and battery life are the key metrics upon which mobile electronics are measured. Samsung Mobile

sony cmos sensor imx 179

Abstract: sony cmos sensor imx 174 sony cmos sensor imx 175 sony IMX 136 sony cmos sensor imx 117 sony CMOS sensor imx 136 Sony "IMX 175" CMOS sony imx 175 sony IMX 179 imx 179
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6SLCEC Rev. 1, 11/2012 MCIMX6L i.MX 6SoloLite Applications Processors for Consumer Products Package Information Plastic Package 13 x 13 mm, 0.5 mm pitch Ordering Information See Table 1 on page 3

sony cmos sensor imx 174

Abstract: sony cmos sensor imx 179
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6SLCEC Rev. 2.2, 08/2013 MCIMX6LxDVN10xx MCIMX6LxEVN10xx i.MX 6SoloLite Applications Processors for Consumer Products Package Information Plastic Package 13 x 13 mm, 0.5 mm pitch Ordering Information

Contextual Info: Freescale Semiconductor Application Note Document Number: AN4603 Rev. 1.0, 12/2012 Power Management Design Guidelines for the i.MX50x Family of Microprocessors 1 Purpose The present document is intended to teach the reader how to supply the power management to the i.MX50x family of

Contextual Info: Product Folder Sample & Buy Technical Documents Tools & Software Support & Community TDA3 SPRT704A – OCTOBER 2014 – REVISED OCTOBER 2014 TDA3x SoC Processors for Advanced Driver Assist Systems ADAS Technical Brief 1 Device Overview 1.1 Features • Architecture Designed for ADAS Applications

Samsung eMMC 4.41

Abstract: LPDDR2 SDRAM samsung i.MX53 USB_OTG emmc spec samsung samsung EMMC user guide samsung lpddr2 eMMC 4.4 Jedec lpddr2 sahara lcd monitor circuit diagram free
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53AEC Rev. 3, 7/2011 MCIMX53xA i.MX53xA Automotive and Infotainment Applications Processors Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Ordering Information

emmc 5.0

Abstract: iMX536 IC_USB voltage class "ARM Cortex A8" samsung ddr2 nand ESDHC MCIMX THERMAL Fuse m20 tf 115 c lpddr2 layout 15 TFT 20 pin lvds
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX53AEC Rev. 6, 03/2013 MCIMX53xA i.MX53xA Automotive and Infotainment Applications Processors Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Silicon Version 2.1

samsung EMMC user guide

Abstract: eMMC 4.4 Jedec lpddr2 emmc 4.4 standard jedec ARM cortex A9 neon SIMD imx53 Freescale i.MX53 Quick Start Board H.264 encoder cortex a8 schema tv sony SAMSUNG NAND FLASH TRANSLATION LAYER SOFTWARE
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX53IEC Rev. 6, 03/2013 MCIMX53xC i.MX53 Applications Processors for Industrial Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Silicon Version 2.1 Ordering Information

IMX6DQ6SDLSRM

Abstract: Samsung eMMC 4.41 sony cmos sensor imx 174 sony cmos sensor imx 179 sony cmos sensor imx 175 sony IMX 136 sony CMOS sensor imx 136 sony IMX 138 LVDS to MIPI CSI Sony imx 134
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQIxEC Rev. 2, 04/2013 MCIMX6QxCxxxxC MCIMX6DxCxxxxC i.MX 6Dual/6Quad Applications Processors for Industrial Products Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch Ordering Information

iMX536

Abstract: sahara lcd monitor circuit diagram free us10 sd diode samsung lpddr2 Mobile RAM Automotive Telematics On-board unit Platform emmc jedec mechanical standard Samsung board Board design guide eMMC emmc 4.5 spec samsung sony bullet camera sd 3.0 emmc 4.4
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX53AEC Rev. 5, 12/2012 MCIMX53xA i.MX53xA Automotive and Infotainment Applications Processors Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Silicon Version 2.1

HMI 14 PIN CONNECTOR CONFIGURATION

Abstract: emmc jedec mechanical standard emmc bga 162 "thermal switch" t175
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53AEC Rev. 2, 5/2011 MCIMX53xA i.MX53xA Automotive and Infotainment Applications Processors Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Ordering Information