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Contextual Info: DIM200PHM33-F000 DIM200PHM33-F000 Half Bridge IGBT Module DS5606-3.2 June 2008 LN26118 FEATURES • Soft Punch Through Silicon ■ 10µs Short Circuit Withstand ■ Isolated MMC Base with AlN Substrates ■ High Thermal Cycling Capability APPLICATIONS ■ |
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dim200phm33-f000ds5606-3ln26118 |