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    LFBGA144 Search Results

    LFBGA144 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    LFBGA144 NXP Semiconductors Footprint for reflow soldering Original PDF

    LFBGA144 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline LFBGA144: plastic low profile fine-pitch ball grid array package; 144 balls; A B D SOT1190-1 ball A1 index area E A A2 A1 detail X e1 e C C A B C Æv Æw b 1/2 e y y1 C M L K J e H G e2 F 1/2 e E D C B A ball A1 index area 1 2 3 4 5 6 7 8 9 10 11 12


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    LFBGA144: OT1190-1 sot1190-1 MO-205 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline LFBGA144: plastic low profile fine-pitch ball grid array package; 144 balls; body 12 x 12 x 0.9 mm A B D SOT644-1 ball A1 index area A E A2 A1 detail X C e1 e y1 C ∅v M C A B b y ∅w M C N M L K e J H e2 G F E D C B A ball A1 index area


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    LFBGA144: OT644-1 MO-205 PDF

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA144 package SOT644-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


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    LFBGA144 OT644-1 OT644-1 PDF

    sot512

    Abstract: LFBGA-144
    Text: PDF: 1999 Jun 09 Philips Semiconductors Package outline LFBGA144: plastic low profile fine-pitch ball grid array package; 144 balls; body 10 x 10 x 1.05 mm SOT512-1 D ball A1 index area A2 A E A1 detail X A b e ∅w M ZD y v A M ZE L K J H e G F E D C B A


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    LFBGA144: OT512-1 sot512 LFBGA-144 PDF

    Untitled

    Abstract: No abstract text available
    Text: P-LFBGA144-1313-0.80 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.


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    P-LFBGA144-1313-0 PDF

    Untitled

    Abstract: No abstract text available
    Text: P-LFBGA144-1111-0.80 5 Package material Ball material Package weight g Rev. No./Last Revised Epoxy resin Sn/Pb 0.3 TYP. 1/Aug.25,1999


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    P-LFBGA144-1111-0 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline LFBGA144: plastic low profile fine-pitch ball grid array package; 144 balls; A B D SOT1190-2 ball A1 index area A E A2 A1 detail X e1 e ∅v ∅w b 1/2 e C C A B C y y1 C M L K J e H G e2 F 1/2 e E D C B A ball A1 index area 1 2 3 4 5 6 7 8


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    LFBGA144: OT1190-2 sot1190-2 MO-205 PDF

    LQFP64 reel size

    Abstract: STA2058 STA5620 LFBGA144 teseo teseo 2 data output LQFP64 STA2058EX timer2 A2F4
    Text: STA2058 TESEO GPS platform high-sensitivity baseband Data Brief Features • Single chip baseband with embedded Flash ■ Complete embedded memory system: – Flash 256 KB +16 Kbytes – RAM 64 Kbytes LQFP64 LFBGA144 ■ 66 MHz ARM7TDMI 32 bit processor


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    STA2058 LQFP64 LFBGA144 STA2058 25x25mm) LQFP64 reel size STA5620 LFBGA144 teseo teseo 2 data output LQFP64 STA2058EX timer2 A2F4 PDF

    Untitled

    Abstract: No abstract text available
    Text: P-LFBGA144-1111-0.80 5 Package material Ball material Package weight g Rev. No./Last Revised Epoxy resin Sn/Pb 0.30 TYP. 1/Aug. 25, 1999


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    P-LFBGA144-1111-0 PDF

    LFBGA144

    Abstract: MO-205 sot644
    Text: PDF: 2000 Oct 17 Philips Semiconductors Package outline LFBGA144: plastic low profile fine-pitch ball grid array package; 144 balls; body 12 x 12 x 0.90 mm SOT644-1 B D A ball A1 index area A E A2 A1 detail X C e1 v M B b e y y1 C ∅w M v M A N M L e K J


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    LFBGA144: OT644-1 GA144: MO-205 LFBGA144 MO-205 sot644 PDF

    Untitled

    Abstract: No abstract text available
    Text: STA2058 TESEO GPS platform high-sensitivity baseband Data Brief Features • Single chip baseband with embedded Flash ■ Complete embedded memory system: – Flash 256 KB +16 Kbytes – RAM 64 Kbytes LQFP64 LFBGA144 ■ 66 MHz ARM7TDMI 32 bit processor


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    STA2058 LQFP64 LFBGA144 STA2058 25x25mm) PDF

    LFBGA144

    Abstract: MO-205
    Text: PDF: 2003 Feb 18 Philips Semiconductors Package outline LFBGA144: plastic low profile fine-pitch ball grid array package; 144 balls; body 12 x 12 x 0.9 mm A B D SOT644-1 ball A1 index area A E A2 A1 detail X C e1 e ∅v M C A B b y1 C y ∅w M C N M L K e


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    LFBGA144: OT644-1 OT64grid MO-205 LFBGA144 MO-205 PDF

    Untitled

    Abstract: No abstract text available
    Text: P-LFBGA144-1313-0.80 Mirror finish Package material Ball material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Sn/Pb Solder plating( 5 m) 0.40 TYP. 1/Jun.23,1998


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    P-LFBGA144-1313-0 PDF

    Untitled

    Abstract: No abstract text available
    Text: P-LFBGA144-1111-0.80 5 パッケージ材質 ボール材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 Sn/Pb 0.30 TYP. 1 版/99.8.25


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    P-LFBGA144-1111-0 PDF

    Untitled

    Abstract: No abstract text available
    Text: P-LFBGA144-1313-0.80 Mirror finish 5 Package material Ball material Package weight g Rev. No./Last Revised Epoxy resin Sn/Pb 0.40 TYP. 1/Jun. 23, 1998


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    P-LFBGA144-1313-0 PDF

    AT91SAM3U4

    Abstract: at91sam3 1N1308 MAR 735 REGULATOR IC 7912 pin identify AT91SAM3U4E SAM3u1 AT91SAM3U 3961 G.E 0x20180
    Text: Features • Core • • • • • • – ARM Cortex®-M3 revision 2.0 running at up to 96 MHz – Memory Protection Unit MPU – Thumb®-2 instruction set Memories – From 64 to 256 Kbytes embedded Flash, 128-bit wide access, memory accelerator,


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    128-bit 6430F 21-Feb-12 AT91SAM3U4 at91sam3 1N1308 MAR 735 REGULATOR IC 7912 pin identify AT91SAM3U4E SAM3u1 AT91SAM3U 3961 G.E 0x20180 PDF

    STM32W108

    Abstract: stm32f103 DAC STM8L151 PROGRAMMER FOR STM32F103 stm32f107 stm32f103 spi stm32f105 STM32 PWM output developer kit ST10F273 programmer schematic STM32-PRIMER2
    Text: 62 7x 10 M32 M8 R7 R9 * E T P F,C F ROM no character EPROM OTP FastROM Flash Version code ST6 ST7 ST10 STM32 STM8 STR7 STR9 Family STM32 Y F E G K L D H J S C N AR R M V W Z 16 pins 20 pins 24 pins 28 pins 32 pins 34 pins 38 pins 40 pins 42 pins 44 pins


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    STM32 10x10) 14x14) 32-bit SGMICRO0909 STM32W108 stm32f103 DAC STM8L151 PROGRAMMER FOR STM32F103 stm32f107 stm32f103 spi stm32f105 STM32 PWM output developer kit ST10F273 programmer schematic STM32-PRIMER2 PDF

    STM32F103xC

    Abstract: STM32F103xC ADC1 CF 4093 N STM32F103xC boot STM32F103Rx STM32F103xE STM32F103xx STM32F103VC g717 stm32f103ve
    Text: STM32F103xC STM32F103xD STM32F103xE High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces Features FBGA • Core: ARM 32-bit Cortex -M3 CPU – 72 MHz maximum frequency, 1.25 DMIPS/MHz Dhrystone 2.1


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    STM32F103xC STM32F103xD STM32F103xE 32-bit 512KB STM32F103xC ADC1 CF 4093 N STM32F103xC boot STM32F103Rx STM32F103xE STM32F103xx STM32F103VC g717 stm32f103ve PDF

    Untitled

    Abstract: No abstract text available
    Text: BGA, HBGA, LFBGA & TFBGA FOOTPRINT REFLOW SOLDERING Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10


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    MBL179 BGA156 OT472-1 BGA256 OT466-1 OT471-1 BGA292 OT489-1 BGA316 PDF

    arm stm32 f103

    Abstract: stm32f103z STM32F103VG STM32F103VF STM32F103ZG stm32f103xg stm32 f103 100 pin STM32F103Rx LQFP100 LQFP144
    Text: STM32F103xF STM32F103xG XL-density performance line ARM-based 32-bit MCU with 768 KB to 1 MB Flash, USB, CAN, 17 timers, 3 ADCs, 13 communication interfaces Preliminary data Features FBGA • Core: ARM 32-bit Cortex -M3 CPU with MPU – 72 MHz maximum frequency,


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    STM32F103xF STM32F103xG 32-bit arm stm32 f103 stm32f103z STM32F103VG STM32F103VF STM32F103ZG stm32f103xg stm32 f103 100 pin STM32F103Rx LQFP100 LQFP144 PDF

    Untitled

    Abstract: No abstract text available
    Text: STR71xFxx STR710RZ ARM7TDMI 32-bit MCU with Flash, USB, CAN, 5 timers, ADC, 10 communication interfaces Features • ■ Core – ARM7TDMI 32-bit RISC CPU – 59 MIPS @ 66 MHz from SRAM – 45 MIPS @ 50 MHz from Flash LQFP64 10 x 10 Memories – Up to 256 Kbytes Flash program memory


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    STR71xFxx STR710RZ 32-bit LQFP64 PDF

    STM32F20xxx reference manual

    Abstract: No abstract text available
    Text: STM32F205xx STM32F207xx ARM-based 32-bit MCU, 150DMIPs, up to 1 MB Flash/128+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera Datasheet - production data Features &"'! • Core: ARM 32-bit Cortex -M3 CPU 120 MHz max with Adaptive real-time accelerator (ART


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    STM32F205xx STM32F207xx 32-bit 150DMIPs, Flash/128 DocID15818 STM32F20xxx reference manual PDF

    STM32F103VC

    Abstract: STM32F103RC STM32F103xE STM32F10* I2C errata 548-72 STM32F103ZD USART STM32F101RC STM32F101RD stm32f103ve errata
    Text: STM32F101xC/D/E and STM32F103xC/D/E Errata sheet STM32F101xC/D/E and STM32F103xC/D/E high-density device limitations Silicon identification This errata sheet applies to the revisions Z and Y of the STMicroelectronics STM32F101xC/D/E access line and STM32F103xC/D/E performance line high-density


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    STM32F101xC/D/E STM32F103xC/D/E STM32F103xC/D/E 32-bit STM32F103VC STM32F103RC STM32F103xE STM32F10* I2C errata 548-72 STM32F103ZD USART STM32F101RC STM32F101RD stm32f103ve errata PDF

    ARM7TDMI System Peripherals

    Abstract: program key lock ic 4013 154WA SAM7SE512 at91sam7sexx
    Text: Features • Incorporates the ARM7TDMI ARM® Thumb® Processor • • • • • • • • • • • – High-performance 32-bit RISC Architecture – High-density 16-bit Instruction Set – Leader in MIPS/Watt – EmbeddedICE In-circuit Emulation, Debug Communication Channel Support


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    32-bit 16-bit SAM7SE512) SAM7SE256) SAM7SE32) 6222H 25-Jan-12 SAM7SE512/256/32 ARM7TDMI System Peripherals program key lock ic 4013 154WA SAM7SE512 at91sam7sexx PDF