LEAD-FORM TYPE PACKAGING Search Results

Contextual Info: KEMET Part Number: ERP610VH3220MEF0 C831DA221M760A Capacitor, ceramic, 220 pF, +/-20% Tol, 760V, K2000, Lead Spacing=12.5 mm General Information Supplier: Application: KEMET Safety:X1/Y1 Approvals: UL,CSA,ENEC Body Type: Radial Ceramic Disc Lead Form: Straight

Contextual Info: KEMET Part Number: ERP610VH4220MERU C835DA222M760L Capacitor, ceramic, 2200 pF, +/-20% Tol, 760V, K4000, Lead Spacing=12.5 mm General Information Supplier: Application: KEMET Safety:X1/Y1 Approvals: UL,CSA,ENEC Body Type: Radial Ceramic Disc Lead Form: Straight

pc123

Abstract: PC123 Series PC123ZY1 PC123 how to test PC-123 PC123 VDE pc1234 VDE0884 PC123 pin out PC123*1
Contextual Info: PC123 Series PC123 Series DIP 4pin Reinforced Insulation Type Photocoupler • Description ■ Agency approvals/Compliance PC123 Series contains an IRED optically coupled to a phototransistor. It is packaged in a 4-pin DIP, available in wide-lead spacing option and SMT gullwing lead-form option.

J-STD-020D

Abstract: TEMD5120X01
Contextual Info: TEMD5120X01 Vishay Semiconductors Silicon PIN Photodiode, RoHS Compliant, Released for Lead Pb -free Reflow Soldering, AEC-Q101 Released FEATURES • Package type: surface mount • Package form: top view • Dimensions (L x W x H in mm): 5 x 4.24 x 1.12

Contextual Info: TEMD5120X01 Vishay Semiconductors Silicon PIN Photodiode, RoHS Compliant, Released for Lead Pb -free Reflow Soldering, AEC-Q101 Released FEATURES • Package type: surface mount • Package form: top view • Dimensions (L x W x H in mm): 5 x 4.24 x 1.12

TEMD5010X01

Contextual Info: TEMD5010X01 Vishay Semiconductors Silicon PIN Photodiode, RoHS Compliant, Released for Lead Pb -free Reflow Soldering, AEC-Q101 Released FEATURES • Package type: surface mount • Package form: top view • Dimensions (L x W x H in mm): 5 x 4.24 x 1.12

TEMD5020X01

Abstract: J-STD-020D
Contextual Info: TEMD5020X01 Vishay Semiconductors Silicon PIN Photodiode, RoHS Compliant, Released for Lead Pb -free Reflow Soldering, AEC-Q101 Released FEATURES • Package type: surface mount • Package form: top view • Dimensions (L x W x H in mm): 5 x 4.24 x 1.12

J-STD-020D

Contextual Info: TEMD5020X01 Vishay Semiconductors Silicon PIN Photodiode, RoHS Compliant, Released for Lead Pb -free Reflow Soldering, AEC-Q101 Released FEATURES • Package type: surface mount • Package form: top view • Dimensions (L x W x H in mm): 5 x 4.24 x 1.12

Contextual Info: TEMD5110X01 Vishay Semiconductors Silicon PIN Photodiode, RoHS Compliant, Released for Lead Pb -free Reflow Soldering, AEC-Q101 Released FEATURES • • • • • Package type: surface mount Package form: top view Dimensions (L x W x H in mm): 5 x 4.24 x 1.12

Contextual Info: TEMD6200FX01 Vishay Semiconductors Ambient Light Sensor, RoHS Compliant, Released for Lead Pb -free Solder Process, AEC-Q101 Released FEATURES • • • • • Package type: surface mount Package form: 0805 Dimensions (L x W x H in mm): 2 x 1.25 x 0.85

Contextual Info: TEMD5020X01 www.vishay.com Vishay Semiconductors Silicon PIN Photodiode, RoHS Compliant, Released for Lead Pb -free Reflow Soldering, AEC-Q101 Released FEATURES • Package type: surface mount • Package form: top view • Dimensions (L x W x H in mm): 5 x 4.24 x 1.12

Contextual Info: TEMD5120X01 www.vishay.com Vishay Semiconductors Silicon PIN Photodiode, RoHS Compliant, Released for Lead Pb -free Reflow Soldering, AEC-Q101 Released FEATURES • Package type: surface mount • Package form: top view • Dimensions (L x W x H in mm): 5 x 4.24 x 1.12

temd5020x

Contextual Info: TEMD5020X01 www.vishay.com Vishay Semiconductors Silicon PIN Photodiode, RoHS Compliant, Released for Lead Pb -free Reflow Soldering, AEC-Q101 Released FEATURES • Package type: surface mount • Package form: top view • Dimensions (L x W x H in mm): 5 x 4.24 x 1.12

NPN TEMT7000X01

Abstract: phototransistor 500-600 nm TEMT7000X01 J-STD-020D VSMB1940X01 radiation sensors
Contextual Info: TEMT7000X01 Vishay Semiconductors Silicon Phototransistor in 0805 Package, RoHS Compliant, Released for Lead Pb -free Solder Process, AEC Q101 Released FEATURES • Package type: surface mount • Package form: 0805 • Dimensions (L x W x H in mm): 2 x 1.25 x 0.85

PC814XP

Abstract: origin 4pin E64380 PC814 PC814X PC844X VDE0884 PC814XP1
Contextual Info: PC814X Series DIP 4pin AC Input Photocoupler PC814X Series ∗ 4-channel package type is also available. model No. PC844X Series • Description ■ Agency approvals/Compliance PC814X Series contains an IRED optically coupled to a phototransistor. It is packaged in a 4pin DIP, available in SMT gullwing lead-form option.

AEC-Q101

Abstract: J-STD-020D TEMT6000X01
Contextual Info: TEMT6000X01 Vishay Semiconductors Ambient Light Sensor, RoHS Compliant, Released for Lead Pb -free Reflow Soldering, AEC-Q101 Released FEATURES • Package type: surface mount • Package form: 1206 • Dimensions (L x W x H in mm): 4 x 2 x 1.05 • Product designed and qualified acc. AEC-Q101

Contextual Info: TEMT6000X01 Vishay Semiconductors Ambient Light Sensor, RoHS Compliant, Released for Lead Pb -free Reflow Soldering, AEC-Q101 Released FEATURES • Package type: surface mount • Package form: 1206 • Dimensions (L x W x H in mm): 4 x 2 x 1.05 • Product designed and qualified acc. AEC-Q101

E64380

Abstract: PC814 PC814X PC814XP PC844X VDE0884
Contextual Info: PC814X Series DIP 4pin AC Input Photocoupler PC814X Series ∗ 4-channel package type is also available. model No. PC844X Series • Description ■ Agency approvals/Compliance PC814X Series contains an IRED optically coupled to a phototransistor. It is packaged in a 4pin DIP, available in SMT gullwing lead-form option.

EIA-296

Abstract: 87108 229-600
Contextual Info: AXIAL LEAD AND CARTRIDGE FUSES SUBMINIATURE GLASS BODY 2AG Slo-Blo Type Fuse U® L ® MIL ® The 2AG Slo-Blo® fuses are available in cartridge form or with axial leads. Axial leaded fuses are board washable. 2AG fuses provide the same performance characteristics as their

2222038

Abstract: 2222 Vishay 2222 056 MAL2
Contextual Info: Product Coding Vishay BCcomponents Aluminum Capacitors INTRODUCTION For unambiguous processing of customer orders, a component supplier defines a system of product codes to uniquely identify a component, including its packaging. Two systems can be used: 1. Cleartext type

BENT LEAD transistor TO-92 Outline Dimensions

Abstract: 2SC2712 equivalent 4TE12 diode ssc J Fet marking 2 AW 2SC2873 equivalent 90105 toshiba ultrasonic atomizing SMD TRANSISTOR MARKING 5c
Contextual Info: 5. PA C K A G E FO R M S 5.1 PACKAGE FORM SELECTION TABLE 5.1.1 SUPER-MINI DEVICES S-MINI (SC-59 , SMQ (SC-61), SMV, SM6) PACKAGING FORM PACKAGE SPECIFI­ CATION OUTLINE Pack PACKAGE UNIT - e TE85L Taping EXTERIOR Unit: mm » » » 3000 pcs/ Reel TE85R TE85N

atc-frost

Abstract: GR560 GP501 GR501 magnetic reed switch Standex Electronics TS560 Reed Relay distance "TR560" GR-100
Contextual Info: Reed Switch Catalogue www.StandexElectronics.com 1 Standex Product Offerings: Low-Frequency Magnetics High-Frequency Magnetics Antenna & RF Magnetics Magnetic Reed Switches, Sensors & Relays Hermetic Connector Products Precision Stamping & Value-Added Packaging

ST062C

Abstract: DTSMW-69N DTSM-61K ST064C DTSM-61N-B DTS-65N DTSM-61R DTSM-62R DTSMW-69R DTST-644K
Contextual Info: SWITCHES TACTILE, 6 x 6mm, Surface Mount DIPTRONICS type DTSM-6 A range of 6 x 6mm size surface mount tactile switches offering a choice of button style and/or length and operating force, together with an option of packaging method. High reliability with up to 1,000,000 cycle electrical life expectancy.

QSB363GR

Abstract: QEB 123
Contextual Info: T-3/4, 2mm DETECTOR Ordering Information To order QEB or QSB subminiature products on tape and reel include the appropriate standard product part number and suffix code to specify the lead form and packaging method. QSB363GR Packaging Code Lead Form Code Standard Product Part Number