LEAD TIME Search Results

Contextual Info: Features * Fast Read Access Time - 70 ns * Low Power CMOS Operation - 100 |jA max. Standby - 30 mA max. Active at 5 MHz * JEDEC Standard Packages - 32-Lead 600-mii PDIP - 32-Lead 450-mil SOIC SOP - 32-Lead PLCC - 32-Lead TSOP * 5V + 10% Supply * High Reliability CMOS Technology

TIONA 595

Contextual Info: Features • Fast Read Access Time - 90 ns • Low Power CMOS Operation - 100 nA max. Standby - 40 mA max. Active at 5 MHz • JEDEC Standard Packages - 32 Lead PLCC - 32-Lead 600-mii PDIP and Cerdip - 32-Lead 450-mil SOIC SOP - 32-Lead TSOP • 5 V ± 10% Supply

1N914

Abstract: 27C080 AT27C080 AT27C080-90 AT27C080-90JC AT27C080-90PC atmel 728
Contextual Info: Features • Fast Read Access Time - 90 ns • Low Power CMOS Operation • • • • • • • – 100 µA max. Standby – 40 mA max. Active at 5 MHz JEDEC Standard Packages – 32 Lead PLCC – 32-Lead 600-mil PDIP – 32-Lead 450-mil SOIC SOP – 32-Lead TSOP

Contextual Info: Features • Fast Read Access Time - 70 ns • Low Power CMOS Operation 100 |^A max. Standby 30 mA max. Active at 5 MHz • JEDEC Standard Packages 32-Lead 600-mii PDIP 32-Lead 450-mil SOIC SOP 32-Lead PLCC 32-Lead TSOP • 5 V ± 10% Supply • High Reliability CMOS Technology

D010171

Contextual Info: AT27C040 Features • • • • • • • • • Fast Read Access Time - 80 ns Low Power CMOS Operation 100 |iA max. Standby 30 mA max. Active at 5 MHz JEDEC Standard Packages 32-Lead 600-mil PDIP 32-Lead 450-mil SOIC SOP 32-Lead PLCC 32-Lead TSOP 5V± 10% Supply

Atmel 318

Abstract: AT27C040-12TC 1N914 27C040 AT27C040 AT27C040-12 AT27C040-15 AT27C040-70 AT27C040-70JC AT27C040-90
Contextual Info: Features • Fast Read Access Time - 70 ns • Low Power CMOS Operation • • • • • • • – 100 µA max. Standby – 30 mA max. Active at 5 MHz JEDEC Standard Packages – 32-Lead 600-mil PDIP – 32-Lead 450-mil SOIC SOP – 32-Lead PLCC – 32-Lead TSOP

1N914

Abstract: 27C040 AT27C040 AT27C040-12 AT27C040-15 AT27C040-70 AT27C040-70JC AT27C040-90
Contextual Info: Features • Fast Read Access Time - 70 ns • Low Power CMOS Operation • • • • • • • – 100 µA max. Standby – 30 mA max. Active at 5 MHz JEDEC Standard Packages – 32-Lead 600-mil PDIP – 32-Lead 450-mil SOIC SOP – 32-Lead PLCC – 32-Lead TSOP

OSC SMD XTAL

Abstract: transistor smd marking 94 smd marking CA SMD MARKING t 152
Contextual Info: FMOCJS SERIES • HCMOS Compatible • J-Lead Molded Plastic 5.0 Vdc Clock Oscillators • Surface Mount J-LEAD PLASTIC SMD • Tape and Reel Available SPECIFICATIONS Frequency Range Overall Frequency Tolerance J-LEAD PLASTIC SMD Specification Rise and Fall Time

SAHA Mica capacitors

Abstract: cm05fd RS-153 dm15 capacitor DM19 DM30 SAHA scdm series DM42F SAHA DM15
Contextual Info: Sharma Mica Capacitors Page 1 Quick Reference Page Series Features DM05 Lead Spacing: 3.05 +/-0.8 mm 7 DM10 Lead Spacing: 3.57 +/-0.8 mm 9 DM12 Lead Spacing: 5.00 +/-0.8 mm 10 DM15 Lead Spacing: 5.95 +/-0.8 mm 11 DM19 Lead Spacing: 8.73 +/-0.8 mm 13 DM20 Lead Spacing: 11.11 +/-0.8 mm

BYD127ZH

Contextual Info: ZOWIE Ultrafast Efficient Rectifier 200V / 1.0A BYD127ZH FEATURES OUTLINE DIMENSIONS Halogen-free type Lead free product, compliance to RoHs Lead less chip form, no lead damage Lead-free solder joint, no wire bond & lead frame Low power loss, High efficiency

AD411

Contextual Info: Features * 8-Bit Multiplexed Addresses/Outputs * Fast Read Access Time - 70 ns * Low Power CMOS Operation - 20 mA max. Active at 5 MHz * 20-Lead TSSOP Package * 20-Lead SOIC Package * 28-Lead TSOP Package * 5V + 10% Supply * High Reliability CMOS Technology

BYD18

Contextual Info: ZOWIE Ultrafast Efficient Rectifier 800V / 1.0A BYD187ZH FEATURES OUTLINE DIMENSIONS Halogen-free type Lead free product, compliance to RoHs Lead less chip form, no lead damage Lead-free solder joint, no wire bond & lead frame Low power loss, High efficiency

SOD87 marking

Contextual Info: ZOWIE Ultrafast Efficient Rectifier 400V / 1.0A BYD147ZH FEATURES OUTLINE DIMENSIONS Halogen-free type Lead free product, compliance to RoHs Lead less chip form, no lead damage Lead-free solder joint, no wire bond & lead frame Low power loss, High efficiency

Contextual Info: Control Devices LOW LOSS MESA BEAM LEAD PIN DIODES • Broadband Operation through "K" Band • Ultra Fast Switching Time • Low Insertion Loss/Low Resistance GOLD LEAD CATHODE GOLD LEAD ANODE • Electrically Stable Performance • RF Characteristics of each Wafer

BYD167ZH

Abstract: SOD87 marking code BYD167Z
Contextual Info: ZOWIE Ultrafast Efficient Rectifier 600V / 1.0A BYD167ZH FEATURES OUTLINE DIMENSIONS Halogen-free type Lead free product, compliance to RoHs Lead less chip form, no lead damage Lead-free solder joint, no wire bond & lead frame Low power loss, High efficiency

SOD87 marking code

Abstract: BYD57ZM
Contextual Info: ZOWIE High Efficient Rectifier 200V~1000V / 1.0A BYD57ZH series FEATURES OUTLINE DIMENSIONS Halogen-free type Lead free product, compliance to RoHS GPRC (Glass passivated rectifier chip) inside Lead less chip form, no lead damage Lead-free solder joint, no wire bond & lead frame

MBCR10J

Abstract: MBCR10K 1000V1A
Contextual Info: ZOWIE Bridge Rectifier 600V~1000V / 1A MBCR10J THRU MBCR10M FEATURES OUTLINE DIMENSIONS Internal structure with GPRC (glass passivated rectifier chip) inside Lead free product, compliance to RoHS Lead less chip form, no lead damage Lead-free solder joint, no wire bond & lead frame

SRGC10MH

Abstract: SRGC10DH SRGC10 Zowie SRGC10MH
Contextual Info: ZOWIE Fast Recovery Rectifier 200V~1000V / 1.0A SRGC10DH THUR SRGC10MH FEATURES OUTLINE DIMENSIONS Halogen-free type Lead free product, compliance to RoHS Lead less chip form, no lead damage Lead-free solder joint, no wire bond & lead frame Low power loss, High efficiency

BYD57ZMH

Contextual Info: ZOWIE High Efficient Rectifier 200V~1000V / 1.0A BYD57ZH series FEATURES OUTLINE DIMENSIONS Halogen-free type Lead free product, compliance to RoHs Lead less chip form, no lead damage Lead-free solder joint, no wire bond & lead frame Low power loss, High efficiency

Contextual Info: ZOWIE Ultrafast Efficient Rectifier 50V~400V / 1.0A BYD77ZH series FEATURES OUTLINE DIMENSIONS Halogen-free type Lead free product, compliance to RoHs Lead less chip form, no lead damage Lead-free solder joint, no wire bond & lead frame Low power loss, High efficiency

Contextual Info: MN101C66D, MN101C66G Type ROM x× 8-bit RAM (×× 8-bit) Package MN101C66D MN101C66G (under development) 64 K 128 K 2K QFP084-P-1818E *Lead-free, 4K LQFP080-P-1414A *Lead-free, TQFP080-P-1212D *Lead-free (under plannning) Minimum Instruction Execution Time

AD5327

Abstract: AD5676R
Contextual Info: Precision DACs Part Number Resolution Bits Outputs Interface Package Comments Single-Supply, Low Voltage Output (≤5 V) 140 A typ at 5 V AD5300 8 1 SPI 6-lead SOT-23 AD5601 8 1 SPI 6-lead SC70, 6-lead LFCSP AD5301 8 1 I2C 6-lead SOT-23 AD5602 8 1 6-lead SC70, 6-lead LFCSP

Contextual Info: External Lead Finish for Plastic Packages For plastic packages, National Semiconductor offers two primary lead finishes: solder plate and solder dip. The component lead finish serves as a protective coating to prevent oxidation of the lead base material prior to use. The lead finish

MN101C427

Contextual Info: MN101C425 , MN101C427 Type MN101C425 MN101C427 ROM x× 8-bit 8K 16 K RAM (×× 8-bit) 0.25 K 0.5 K Package (Conventional Package) SDIP042-P-0600C *Lead-free, TQFP048-P-0707B *Lead-free , QFP044-P-1010F *Lead-free (SDIP042-P-0600) Minimum Instruction Execution Time