LEAD FRAME PIN GRID ARRAY Search Results

8355F

Abstract: 130C JESD22
Contextual Info: Cypress Semiconductor Package Qualification Report QTP# 99331 VERSION 2.0 December, 2000 48 Lead Fine Pitch Ball Grid Array FBGA 7mm x 8.5mm ASE Taiwan CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director (408) 432-7069 Kim-Ngan Nguyen

Contextual Info: PKC Series Pin Grid Array Sockets Removable Carrier Socket Terminals PKC168-7H1711-V D Typical PCB FEATURES: PERFORMANCE SPECIFICATIONS: The PKC Series of Pin Grid Array Sockets is a method of carrying printed circuit pins on a removable carrier in a pin grid array format. This unique

KC700

Abstract: KC-700 Cypress CROSS
Contextual Info: Cypress Semiconductor Package Qualification Report QTP# 98369 VERSION 1.1 October, 2000 Ceramic Window Lid 68-lead, 84-lead and 100-lead Pin Grid Arrays Alphatec, Thailand Assembly CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director

Contextual Info: FACTSHEET F-201-1 GFZ– 20– 01–G–20 GFZ– 30– 01–G–30 GRID ARRAY INTERFACE GFZ SERIES Dual spring action for solderless connection SPECIFICATIONS APPLICATION Materials: Insulator Material: Liquid Crystal Polymer Contact Material: BeCu Current Rating:

CERAMIC PIN GRID ARRAY wire lead frame

Abstract: BGA and QFP Package TO metal package aluminum kovar TSOP 2E TSOP 54 Package nail qfp 32 land pattern ceramic pin grid array package plating ceramic pin grid array package lead finish PGA wire bonding
Contextual Info: Package Lineup/ Forms/ Structures 1. Package Lineup 2. Package Forms 3. Package Structures DB81-10002-2E 1 Package Lineup/ Forms/ Structures 1. Package Lineup PACKAGE 1. Package Lineup The packages are classified as follows, according to form, material, and the mounting methods

AT24C128BN-SH-T

Abstract: AT24C128B-TH-B AT24C128B AT24C128BD3-DH-T AT24C128BN-SH-B AT24C128B-PU AT24C128B-TH-T AT24C128BU2-UU-T AT24C128BY6-YH-T AT-24
Contextual Info: 1. Features • Low-voltage and Standard-voltage Operation – 1.8 VCC = 1.8V to 5.5V Internally Organized as 16,384 x 8 Two-wire Serial Interface Schmitt Trigger, Filtered Inputs for Noise Suppression Bidirectional Data Transfer Protocol 1 MHz (5.5V, 2.5V), and 400 kHz (1.8V) Compatibility

AT24C16BN-SH-T

Abstract: AT24C16B-PU AT24C16B-TH-B AT24C16B AT24C16BD3-DH-T AT24C16BN-SH-B AT24C16B-TH-T AT24C16BTSU-T AT24C16BU3-UU-T AT24C16BY6-YH-T
Contextual Info: 1. Features • Low-voltage and Standard-voltage Operation – 1.8 VCC = 1.8V to 5.5V Internally Organized 2048 x 8 (16K) Two-wire Serial Interface Schmitt Trigger, Filtered Inputs for Noise Suppression Bidirectional Data Transfer Protocol 1 MHz (5V, 2.5V), 400 kHz (1.8V) Compatibility

AT24C32C

Abstract: AT24C32C-TH-T AT24C32CN-SH-T AT24C32C-TH-B AT24C32CN-SH-B AT24C32C-PU AT24C64C AT24C32CY6-YH-T
Contextual Info: Features • Low-voltage and Standard-voltage Operation – 1.8 (VCC = 1.8 to 5.5V Internally Organized 4096 x 8, 8192 x 8 2-Wire Serial Interface Schmitt Trigger, Filtered Inputs for Noise Suppression Bi-directional Data Transfer Protocol 1 MHz (5.0V) and 400 KHz (1.8V Compatibility)

AT24C64CN-SH-B

Abstract: AT24C32C AT24C64C AT24C64C-PU AT24C64CN-SH-T AT24C64C-TH-B AT24C64C-TH-T 8U2-1 DBGA AT24C64CNSHT
Contextual Info: Features • Low-voltage and Standard-voltage Operation – 1.8 (VCC = 1.8 to 5.5V Internally Organized 4096 x 8, 8192 x 8 2-Wire Serial Interface Schmitt Trigger, Filtered Inputs for Noise Suppression Bi-directional Data Transfer Protocol 1 MHz (5.0V) and 400 KHz (1.8V Compatibility)

GI 312 diode

Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame ceramic pin grid array package wire bond VIC064 CPGA 168 lead frame CERAMIC PIN GRID ARRAY 144 pins VIC068A CERAMIC PIN GRID ARRAY wire lead frame description of transistor bc 148 CY7C964
Contextual Info: Qualification Report November, 1994 - QTP# 93101 Version 1.1 CMOS2AN PROCESS MARKETING PART NUMBER VIC64 DEVICE DESCRIPTION VMEbus Interface Controller with D64 VIC068A VMEbus Interface Controller VAC068A VMEbus Address Controller CY7C964 Bus Interface Logic Circuit

ierc heatsink

Contextual Info: PIN GRID ARRAY SOCKETS Optional Tabs for Clip-on Heatsink* Interstitial Pattern BREGIÎDIR Series 518 • Series 518 Interstitial PGA sockets are available with and without tabs for clip-on heatsink. • Mill-Max #43, "Ultra Lite" contact standard, seepage 151 for

AT24C16B-PU

Abstract: AT24C16BN-SH-B AT24C16BN-SH-T AT24C16B-TH-T JEDEC Drawing MO-153, Variation AA AT24C16BU3-UU AT24C16B AT24C16BD3-DH-T AT24C16B-TH-B AT24C16BTSU-T
Contextual Info: 1. Features • Low-voltage and Standard-voltage Operation – 1.8 VCC = 1.8V to 5.5V Internally Organized 2048 x 8 (16K) Two-wire Serial Interface Schmitt Trigger, Filtered Inputs for Noise Suppression Bidirectional Data Transfer Protocol 1 MHz (5V, 2.5V), 400 kHz (1.8V) Compatibility

JEDEC Drawing MO-153, Variation AA

Abstract: AT24C128BN-SH-T AT24C128BN-SH-B AT24C128B AT24C128BD3-DH-T AT24C128B-PU AT24C128B-TH-B AT24C128B-TH-T AT24C128BU2-UU-T AT24C128BY6-YH-T
Contextual Info: 1. Features • Low-voltage and Standard-voltage Operation – 1.8 VCC = 1.8V to 5.5V Internally Organized as 16,384 x 8 Two-wire Serial Interface Schmitt Trigger, Filtered Inputs for Noise Suppression Bidirectional Data Transfer Protocol 1 MHz (5.5V, 2.5V), and 400 kHz (1.8V) Compatibility

AT24C32C

Abstract: AT24C32CN-SH-B AT24C32CN-SH-T AT24C32C-PU AT24C32C-TH-B AT24C32C-TH-T AT24C64C
Contextual Info: Features • Low-voltage and Standard-voltage Operation – 1.8 (VCC = 1.8 to 5.5V Internally Organized 4096 x 8, 8192 x 8 2-Wire Serial Interface Schmitt Trigger, Filtered Inputs for Noise Suppression Bi-directional Data Transfer Protocol 1 MHz (5.0V) and 400 KHz (1.8V Compatibility)

517-93-179-18

Contextual Info: Series 590, 517 PIN GRID ARRAY SOCKETS With Tabs for Clip-On Heatsink* Standard .100" Grid illu s o li • Molded tabs hold down heatsink & clip assembly. i i • Mill-Max #35 clip standard, see page 151 for details. h • Series 590 & 517 PGA sockets are available for INTEL &

LF847

Abstract: Seven Transistor Array PNP l5 transistor PNP N5 npn transistor CS2500 CS3200 lf-621 LF853 CS4000 transistor PNP L5
Contextual Info: -RRY SEMI CONDUCT OR CORP 57E J -Db7S5b 3 D QE2 1 A - " r - m 037 -s i Chapter 1 - Getting Started With your circuit simulations and worst case analysis done, you are ready to begin the layout phase of your

EIAJ SOIC 8

Abstract: AT93C56A AT93C66A SK SOIC 20 pin package lead frame pin grid array
Contextual Info: 1. Features • Low-voltage and Standard-voltage Operation • • • • • • • • – 2.7 VCC = 2.7V to 5.5V – 1.8 (VCC = 1.8V to 5.5V) User-selectable Internal Organization – 2K: 256 x 8 or 128 x 16 – 4K: 512 x 8 or 256 x 16 Three-wire Serial Interface

EIAJ SOIC 8

Abstract: AT93C66A AT93C56A 0.5 mm pitch mlp
Contextual Info: 1. Features • Low-voltage and Standard-voltage Operation • • • • • • • • – 2.7 VCC = 2.7V to 5.5V – 1.8 (VCC = 1.8V to 5.5V) User-selectable Internal Organization – 2K: 256 x 8 or 128 x 16 – 4K: 512 x 8 or 256 x 16 Three-wire Serial Interface

AT93C56A

Abstract: AT93C66A
Contextual Info: 1. Features • Low-voltage and Standard-voltage Operation • • • • • • • • – 2.7 VCC = 2.7V to 5.5V – 1.8 (VCC = 1.8V to 5.5V) User-selectable Internal Organization – 2K: 256 x 8 or 128 x 16 – 4K: 512 x 8 or 256 x 16 Three-wire Serial Interface

ACTEL CCGA 624 mechanical

Abstract: CCGA ACTEL CCGA 1152 mechanical CG1152 pogo pin cleaning CGS624 a440 ceramic actel package mechanical drawing RTAX2000 90Pb 10Sn solder paste
Contextual Info: Application Note AC190 Ceramic Column Grid Array Introduction Ceramic Column Grid Array CCGA packages are becoming increasingly popular as an alternative to Ceramic Ball Grid Array (CBGA) packages for applications requiring very high-density interconnections

AT93C56A

Abstract: AT93C66A
Contextual Info: 1. Features • Low-voltage and Standard-voltage Operation • • • • • • • • – 2.7 VCC = 2.7V to 5.5V – 1.8 (VCC = 1.8V to 5.5V) User-selectable Internal Organization – 2K: 256 x 8 or 128 x 16 – 4K: 512 x 8 or 256 x 16 Three-wire Serial Interface

AT93C66AW-10SU-2.7

Abstract: AT93C66A-10TU-2.7 AT93C56A AT93C66A
Contextual Info: 1. Features • Low-voltage and Standard-voltage Operation • • • • • • • • – 2.7 VCC = 2.7V to 5.5V – 1.8 (VCC = 1.8V to 5.5V) User-selectable Internal Organization – 2K: 256 x 8 or 128 x 16 – 4K: 512 x 8 or 256 x 16 Three-wire Serial Interface

638 pin micro PGA

Contextual Info: C a t a l o g 16 P r e v i e w RoHS C om pliant IC Sockets S Adapters • O .C 75[l.Q 33 - 1.752 4.4.50] S( 1 fi0 0 [4 0 .fi4 : SÌJ 52 EO. SP. 9 0.C50[ t . & P /N : 5 3 9 7 - 5 6 0 « KM ! £ < • i ss Table o f Contents Table o f Contents B6A Socketing Systems

Z8070

Contextual Info: r ^ PIN GRID ARRAY SOCKETS Standard, Long Solder Tail & Low Profile RRËGI-DIPi m _ -m Series 510, 511, 515 • Series 510, 511, & 515 PG A sockets are available in three solder tail lengths: standard, long and low profile. • C hoice o f three low force clips to