LDC32900M03B703 Search Results

Ceramic Capacitors 104

Abstract: mev-50a DXW21BN7511S SAYFP1G95AA0B00 ck 66 ul94v-0 lcd SAYFP897MCA0B00 SAFEB1G57KE0F00 SAWEN1G84 murata enc-03r MA300D1-1
Contextual Info: MURATA PRODUCTS 2009-2010 2009-2010 MURATA PRODUCTS !Note • This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice.

Contextual Info: Microwave Components/Modules Chip Multilayer Hybrid Couplers 3dB Hybrid 0.9±0.1 3.2±0.2 2 (1) (4) (5) (6) 2.5±0.2 (3) 1.0±0.1 LDC32 Series 0.35±0.15 0.45±0.15 0.55±0.15 (4) : Out1 (1) : IN (5) : GND (2) : GND (3) : Terminate (6) : Out2 (in mm) Insertion Loss

Contextual Info: Microwave Components Chip Multilayer Hybrid Couplers 3dB Hybrid 0.9±0.1 2 (1) (4) (5) (6) (3) (2) (1) (4) (5) (6) LDC31 Series 1.0±0.1 0.45±0.15 0.35±0.15 0.55±0.15 2.5±0.2 1.6±0.15 (3) 0.9±0.1 3.2±0.2 1.0±0.1 (1) : IN (2) : GND (3) : Terminate

Contextual Info: Microwave Components Microwave Components Chip Multilayer Hybrid Couplers Directional Coupler 1.6±0.1 0.6±0.1 1 (4) (5) (6) (3) (2) (1) 1.25±0.1 0.8±0.1 0.3±0.1 0.20+0.10/-0.15 0.2±0.1 LDC18906M17B-325 0.95±0.1 2.0±0.1 A (4) 0.2±0.1 0.3±0.1 (5)

LDC32900M03B-703

Contextual Info: Microwave Components Chip Multilayer Hybrid Couplers 3dB Hybrid 0.9±0.1 3.2±0.2 2 (1) (4) (5) (6) 2.5±0.2 (3) 1.0±0.1 LDC32 Series 0.35±0.15 0.45±0.15 0.55±0.15 (4) : Out1 (1) : IN (5) : GND (2) : GND (3) : Terminate (6) : Out2 (in mm) Part Number

Contextual Info: Microwave Components 03.02.28 Chip Multilayer Hybrid Couplers 3dB Hybrid 0.9±0.1 2 (1) (4) (5) (6) (3) (2) (1) (4) (5) (6) LDC311G6003B-601 1.0±0.1 0.45±0.15 0.35±0.15 0.55±0.15 2.5±0.2 1.6±0.15 (3) 0.9±0.1 3.2±0.2 1.0±0.1 (1) : IN (2) : GND (3) : Terminate

JEP95 MS-028

Contextual Info: SMM5146XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier and x2 multiplier • 10dB Conversion Gain :10dB • Input Third Order Intercept Point IIP3 : +2dBm

Contextual Info: SMM5139XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier • Conversion Gain : 10dB • Input Third Order Intercept Point IIP3 : +2dBm

Contextual Info: SMM5142XZ 17.7 – 23.6GHz Down converter MMIC FEATURES • Wafer Level Chip Size Package with Solder Balｌ • Integrated Balanced Mixer, Low Noise Amplifier, LO Buffer Amplifier and x2 multiplier • 10dB Conversion Gain • 2.6dB Noise Figure • +2dBm Input Third Order Intercept Point IIP3

Contextual Info: SMM5139XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Size Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier • 10dB Conversion Gain • 2.5dB Noise Figure • +2dBm Input Third Order Intercept Point IIP3

Contextual Info: ES/SMM5144XZ Preliminary 24– 30GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, Low Noise Amplifier, LO Buffer Amplifier and x2 multiplier • Conversion Gain : 12dB • Input Third Order Intercept Point IIP3 :+2dBm

LDC311G6003B-601

Abstract: LDC32900M03B-703 50-LOAD
Contextual Info: 高周波コンポーネンツ 05.05.30 チップ多層ハイブリッドカプラ 3dBハイブリッド 0.9±0.1 3.2±0.15 2 (1) (4) (5) (6) (3) (2) (1) (4) (5) (6) LDC311G6003B-601 1.0±0.1 0.45±0.15 0.35±0.15 0.55±0.15 2.5±0.2 1.6±0.15 (3) 0.9±0.1

Contextual Info: Microwave Components 03.06.12 Chip Multilayer Hybrid Couplers 3dB Hybrid 0.9±0.1 3.2±0.15 2 (1) (4) (5) (6) (3) (2) (1) (4) (5) (6) LDC311G6003B-601 1.0±0.1 0.45±0.15 0.35±0.15 0.55±0.15 2.5±0.2 1.6±0.15 (3) 0.9±0.1 3.2±0.2 1.0±0.1 (1) : IN (2) : GND

Contextual Info: SMM5139XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier • Conversion Gain : 10dB • Input Third Order Intercept Point IIP3 : +2dBm

Contextual Info: Microwave Components Chip Multilayer Hybrid Couplers 3dB Hybrid 0.9±0.1 3.2±0.2 2 (1) (4) (5) (6) 2.5±0.2 (3) 1.0±0.1 LDC32 Series 0.35±0.15 0.45±0.15 0.55±0.15 (4) : Out1 (1) : IN (5) : GND (2) : GND (3) : Terminate (6) : Out2 (in mm) Part Number

LDC311G6003B-601

Contextual Info: 高频元件 05.01.28 片状多层混合耦合器 3dB混合 0.9±0.1 3.2±0.15 2 (1) (4) (5) (6) (3) (2) (1) (4) (5) (6) LDC311G6003B-601 1.0±0.1 0.45±0.15 0.35±0.15 0.55±0.15 2.5±0.2 1.6±0.15 (3) 0.9±0.1 3.2±0.2 1.0±0.1 (1) : IN (2) : GND (3) : Terminate

Contextual Info: Microwave Components 04.10.20 Chip Multilayer Hybrid Couplers 3dB Hybrid 0.9±0.1 3.2±0.15 2 (1) (4) (5) (6) (3) (2) (1) (4) (5) (6) LDC311G6003B-601 1.0±0.1 0.45±0.15 0.35±0.15 0.55±0.15 2.5±0.2 1.6±0.15 (3) 0.9±0.1 3.2±0.2 1.0±0.1 (1) : IN (2) : GND

Contextual Info: Preliminary ES/SMM5144XZ 24– 30GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, Low Noise Amplifier, LO Buffer Amplifier and x2 multiplier • Conversion Gain : 12dB • Input Third Order Intercept Point IIP3 :+2dBm

Hybrid Couplers

Contextual Info: Microwave Components/Modules Chip Multilayer Hybrid Couplers 3dB Hybrid 0.9±0.1 3.2±0.2 2 (1) (4) (5) (6) 2.5±0.2 (3) 1.0±0.1 LDC32 Series 0.35±0.15 0.45±0.15 0.55±0.15 (4) : Out1 (1) : IN (5) : GND (2) : GND (3) : Terminate (6) : Out2 (in mm) Insertion Loss

JEP95 MS-028

Contextual Info: SMM5146XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier and x2 multiplier • 10dB Conversion Gain :10dB • Input Third Order Intercept Point IIP3 : +2dBm

LDC31

Abstract: LDC32900M03B-703 LDC311G6003B-601 LDC43850M03B-401 LDC55250M03B-200 LDC43 LDC32
Contextual Info: Microwave Components Chip Multilayer Hybrid Couplers 3dB Hybrid 0.9±0.1 2 (1) (4) (5) (6) (3) (2) (1) (4) (5) (6) LDC31 Series 1.0±0.1 0.45±0.15 0.35±0.15 0.55±0.15 2.5±0.2 1.6±0.15 (3) 0.9±0.1 3.2±0.2 1.0±0.1 (1) : IN (2) : GND (3) : Terminate

Contextual Info: Microwave Components Chip Multilayer Hybrid Couplers 3dB Hybrid 0.9±0.1 3.2±0.15 2 (1) (4) (5) (6) (3) (2) (1) (4) (5) (6) LDC31 Series 1.0±0.1 0.45±0.15 0.35±0.15 0.55±0.15 2.5±0.2 1.6±0.15 (3) 0.9±0.1 3.2±0.2 1.0±0.1 (1) : IN (2) : GND (3) : Terminate

LDC43850M03B-401

Abstract: LDC311G6003B-601 LDC32900M03B-703 LDC55250M03B-200
Contextual Info: Microwave Components 03.12.9 Chip Multilayer Hybrid Couplers 3dB Hybrid 0.9±0.1 3.2±0.15 2 (1) (4) (5) (6) (3) (2) (1) (4) (5) (6) LDC311G6003B-601 1.0±0.1 0.45±0.15 0.35±0.15 0.55±0.15 2.5±0.2 1.6±0.15 (3) 0.9±0.1 3.2±0.2 1.0±0.1 (1) : IN (2) : GND

MM5829-2700

Abstract: MM8030-2600 ANCL11G57SAA165 ANCL11G57 CSR BC5MM MICROCHIP 2012 SMD MARKING AS-M15SA-R CA0TB MEDIATEK z5v cap
Contextual Info: MURATA PRODUCTS 2010-2011 2010-2011 MURATA PRODUCTS !Note • This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice.