LDC32 Search Results

Contextual Info: Microwave Components/Modules Chip Multilayer Hybrid Couplers 3dB Hybrid 0.9±0.1 3.2±0.2 2 (1) (4) (5) (6) 2.5±0.2 (3) 1.0±0.1 LDC32 Series 0.35±0.15 0.45±0.15 0.55±0.15 (4) : Out1 (1) : IN (5) : GND (2) : GND (3) : Terminate (6) : Out2 (in mm) Insertion Loss

LDC32900M03B-703

Contextual Info: Microwave Components Chip Multilayer Hybrid Couplers 3dB Hybrid 0.9±0.1 3.2±0.2 2 (1) (4) (5) (6) 2.5±0.2 (3) 1.0±0.1 LDC32 Series 0.35±0.15 0.45±0.15 0.55±0.15 (4) : Out1 (1) : IN (5) : GND (2) : GND (3) : Terminate (6) : Out2 (in mm) Part Number

Contextual Info: Microwave Components Chip Multilayer Hybrid Couplers 3dB Hybrid 0.9±0.1 3.2±0.2 2 (1) (4) (5) (6) 2.5±0.2 (3) 1.0±0.1 LDC32 Series 0.35±0.15 0.45±0.15 0.55±0.15 (4) : Out1 (1) : IN (5) : GND (2) : GND (3) : Terminate (6) : Out2 (in mm) Part Number

Hybrid Couplers

Contextual Info: Microwave Components/Modules Chip Multilayer Hybrid Couplers 3dB Hybrid 0.9±0.1 3.2±0.2 2 (1) (4) (5) (6) 2.5±0.2 (3) 1.0±0.1 LDC32 Series 0.35±0.15 0.45±0.15 0.55±0.15 (4) : Out1 (1) : IN (5) : GND (2) : GND (3) : Terminate (6) : Out2 (in mm) Insertion Loss

Contextual Info: Microwave Components/Modules Chip Multilayer Hybrid Couplers 3dB Hybrid 0.9±0.1 3.2±0.2 2 (1) (4) (5) (6) 2.5±0.2 (3) 1.0±0.1 LDC32 Series 0.35±0.15 0.45±0.15 0.55±0.15 (4) : Out1 (1) : IN (5) : GND (2) : GND (3) : Terminate (6) : Out2 (in mm) Insertion Loss

Ceramic Capacitors 104

Abstract: mev-50a DXW21BN7511S SAYFP1G95AA0B00 ck 66 ul94v-0 lcd SAYFP897MCA0B00 SAFEB1G57KE0F00 SAWEN1G84 murata enc-03r MA300D1-1
Contextual Info: MURATA PRODUCTS 2009-2010 2009-2010 MURATA PRODUCTS !Note • This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice.

LD3600

Abstract: Eaton rgc320032e HFD3225 Eaton WESTINGHOUSE scr LS CIRCUIT BREAKERS ld2500 Cutler-Hammer Digitrip RMS 310 trip unit digitrip 310 time curve Digitrip OPTIM 1050 HMCP030H1
Contextual Info: Molded Case Circuit Breakers Series G Circuit Breakers 2.1 Introduction Product Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Typical Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MA58MF14-0N

Abstract: MA300D1-1 MICROblower murata nfc antenna SiBEAM MM8030-2610 PKGS MURATA alcohol sensor MM8130-2600 SAFFB
Contextual Info: K70E.pdf Feb.15,2012 Lineup MURATA PRODUCTS 2012 DU 2 MURATA PRODUCTS 2012 Lineup n K70E.pdf Feb.15,2012 Capacitors p2 3 C Chip Monolithic Ceramic Capacitors for General Electronic Devices 12 Chip Monolithic Ceramic Capacitors for Automotive C 14 Lead Type Ceramic Capacitors for General Electronic Devices

Contextual Info: Microwave Components Chip Multilayer Hybrid Couplers 3dB Hybrid 0.9±0.1 2 (1) (4) (5) (6) (3) (2) (1) (4) (5) (6) LDC31 Series 1.0±0.1 0.45±0.15 0.35±0.15 0.55±0.15 2.5±0.2 1.6±0.15 (3) 0.9±0.1 3.2±0.2 1.0±0.1 (1) : IN (2) : GND (3) : Terminate

Contextual Info: Microwave Components Microwave Components Chip Multilayer Hybrid Couplers Directional Coupler 1.6±0.1 0.6±0.1 1 (4) (5) (6) (3) (2) (1) 1.25±0.1 0.8±0.1 0.3±0.1 0.20+0.10/-0.15 0.2±0.1 LDC18906M17B-325 0.95±0.1 2.0±0.1 A (4) 0.2±0.1 0.3±0.1 (5)

Contextual Info: Microwave Components 03.02.28 Chip Multilayer Hybrid Couplers 3dB Hybrid 0.9±0.1 2 (1) (4) (5) (6) (3) (2) (1) (4) (5) (6) LDC311G6003B-601 1.0±0.1 0.45±0.15 0.35±0.15 0.55±0.15 2.5±0.2 1.6±0.15 (3) 0.9±0.1 3.2±0.2 1.0±0.1 (1) : IN (2) : GND (3) : Terminate

JEP95 MS-028

Contextual Info: SMM5146XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier and x2 multiplier • 10dB Conversion Gain :10dB • Input Third Order Intercept Point IIP3 : +2dBm

Contextual Info: SMM5139XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier • Conversion Gain : 10dB • Input Third Order Intercept Point IIP3 : +2dBm

Contextual Info: SMM5142XZ 17.7 – 23.6GHz Down converter MMIC FEATURES • Wafer Level Chip Size Package with Solder Balｌ • Integrated Balanced Mixer, Low Noise Amplifier, LO Buffer Amplifier and x2 multiplier • 10dB Conversion Gain • 2.6dB Noise Figure • +2dBm Input Third Order Intercept Point IIP3

Contextual Info: ES/SMM5144XZ Preliminary 24– 30GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, Low Noise Amplifier, LO Buffer Amplifier and x2 multiplier • Conversion Gain : 12dB • Input Third Order Intercept Point IIP3 :+2dBm

LDC311G6003B-601

Abstract: LDC32900M03B-703 50-LOAD
Contextual Info: 高周波コンポーネンツ 05.05.30 チップ多層ハイブリッドカプラ 3dBハイブリッド 0.9±0.1 3.2±0.15 2 (1) (4) (5) (6) (3) (2) (1) (4) (5) (6) LDC311G6003B-601 1.0±0.1 0.45±0.15 0.35±0.15 0.55±0.15 2.5±0.2 1.6±0.15 (3) 0.9±0.1

MURATA ENV-05g

Abstract: Murata AFL filter LDC31 afl murata ENV-05G LDC18 MQE95 MURATA safeh MA40S CGSD
Contextual Info: MURATA PRODUCTS Available Product List for RoHS Restriction K28E3.pdf 05.6.8 MURATA PRODUCTS Available Product List for RoHS Restriction • The RoHS compliance means that we judge from EU Directive 2002/95/EC the products do not contain lead, cadmium, mercury, hexavalent

SMD resistors 1806

Abstract: inductor 100 micro henry Ultrasonic Piezoelectric murata ultrasonic sensor RX TX Ultrasonic bubble Chokes* COMMON MODE SUPPRESSION 250V GIGAFIL "Piezoelectric transducer" ultrasonic, murata Chip Multilayer Delay Lines murata MuRata capacitors 1uF 0201
Contextual Info: K26E5.pdf 05.03.16 2005 MURATA PRODUCT Selection Guides 2005 MURATA PRODUCT Selection Guides MURATA PRODUCT Selection Guides K26E5.pdf 05.03.16 CONTENTS Capacitors 01 Resistors • Thermistors 05 Coils · Delay Lines 08 Noise Suppression Products · EMI Suppression Filters

Contextual Info: Microwave Components 03.06.12 Chip Multilayer Hybrid Couplers 3dB Hybrid 0.9±0.1 3.2±0.15 2 (1) (4) (5) (6) (3) (2) (1) (4) (5) (6) LDC311G6003B-601 1.0±0.1 0.45±0.15 0.35±0.15 0.55±0.15 2.5±0.2 1.6±0.15 (3) 0.9±0.1 3.2±0.2 1.0±0.1 (1) : IN (2) : GND

Contextual Info: SMM5139XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier • Conversion Gain : 10dB • Input Third Order Intercept Point IIP3 : +2dBm

Contextual Info: SMM5142XZ 17.7 – 23.6GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Bal • Integrated Balanced Mixer, Low Noise Amplifier, LO Buffer Amplifier and x2 multiplier • Conversion Gain : 10dB • Input Third Order Intercept Point IIP3 : +2dBm

LDC311G6003B-601

Contextual Info: 高频元件 05.01.28 片状多层混合耦合器 3dB混合 0.9±0.1 3.2±0.15 2 (1) (4) (5) (6) (3) (2) (1) (4) (5) (6) LDC311G6003B-601 1.0±0.1 0.45±0.15 0.35±0.15 0.55±0.15 2.5±0.2 1.6±0.15 (3) 0.9±0.1 3.2±0.2 1.0±0.1 (1) : IN (2) : GND (3) : Terminate

MC44 diode

Abstract: sg 4001 diode LDC31 pv34 mc4512 PKM44EW-1001C NFA6CC MQE95 PKM34EW-1101C SAFCH
Contextual Info: Minimum Quantity Guide D Capacitors Products Name Part Number Dimensions mm L W T Minimum Quantity 0180mm Reel 10330mmReef Bulk (Bag) Bulk Case Ammo Pack • Chip Monolithic Ceramic Capacitors Ultra - Small Type GRP03 0.6 0.3 0.3 15000 for Flow / Reflow Soldering

Contextual Info: Microwave Components 04.10.20 Chip Multilayer Hybrid Couplers 3dB Hybrid 0.9±0.1 3.2±0.15 2 (1) (4) (5) (6) (3) (2) (1) (4) (5) (6) LDC311G6003B-601 1.0±0.1 0.45±0.15 0.35±0.15 0.55±0.15 2.5±0.2 1.6±0.15 (3) 0.9±0.1 3.2±0.2 1.0±0.1 (1) : IN (2) : GND