LBGA324 Search Results

19575

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LBGA324 package SOT728-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: PC board footprint NXP Semiconductors Footprint information for reflow soldering of LBGA324 package SOT728-2 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

LBGA324

Abstract: MO-192 sot728
Contextual Info: PDF: 2001 Nov 02 Philips Semiconductors Package outline LBGA324: plastic low profile ball grid array package; 324 balls; body 19 x 19 x 1.05 mm A B D SOT728-1 ball A1 index area A E A2 A1 detail X C e1 1/2 e e ∅v M C A B b y y1 C ∅w M C V U T e R P N M

Contextual Info: Package outline LBGA324: plastic low profile ball grid array package; 324 balls; body 19 x 19 x 1 mm D B SOT728-2 A ball A1 index area A E A2 A1 detail X C e1 e ∅v ∅w b 1/2 e M M C A B C y y1 C V U T e R P N M L K J H G F E D C B A ball A1 index area e2

MO-192

Abstract: LBGA324 sot728
Contextual Info: Package outline Philips Semiconductors LBGA324: plastic low profile ball grid array package; 324 balls; body 19 x 19 x 1 mm D B SOT728-2 A ball A1 index area A2 A E A1 detail X C e1 e ∅v ∅w b 1/2 e M M C A B C y y1 C V U T e R P N M L K J H G F E D C B