LBGA208 Search Results

MO-192

Abstract: LBGA208 sot774
Contextual Info: PDF: 2002 May 14 Philips Semiconductors Package outline LBGA208: plastic low profile ball grid array package; 208 balls; body 17 x 17 x 1.05 mm A B D SOT774-1 ball A1 index area A E A2 A1 detail X C e1 1/2 e e ∅v M C A B b y y1 C ∅w M C T R e P N M L K

Contextual Info: Package outline LBGA208: plastic low profile ball grid array package; 208 balls; body 17 x17 x 1 mm A B D SOT774-2 ball A1 index area E A A2 A1 detail X e1 e ∅v ∅w b 1/2 e C C A B C M M y y1 C T R P e N M L K J H G F E D C B A ball A1 index area e2 1/2 e

TC1910

Abstract: TC1912 TC1920
Contextual Info: TC1910 PR OD UCT BR I EF Product Summary Based on the award-winning unified 32-bit TriCore architecture, the TC1910 is specifically designed to address the feature and performance requirements in communication gateway and audio/speech processing applications. The costefficient TC1910 offers an ideal peripheral set e.

SPC560

Abstract: sdc 7500 sdc 7500 pwm control mc306 crystal 12,000 MHz Crystal oscillator SPC560 MIPS SPC560B40L3 ic lm 7500 SPC560B40 C 12 PH diode
Contextual Info: SPC560B40x, SPC560B44x, SPC560B50x SPC560C40x, SPC560C44x, SPC560C50x 32-bit MCU family built on the Power Architecture embedded category for automotive body electronics applications Preliminary data Features • High-performance 64 MHz e200z0h CPU – 32-bit Power Architecture™ Book E CPU

AD17

Abstract: AD27 AD29 TC1912 AD-29B
Contextual Info: Da ta S he et , V 1. 0, O ct . 20 03 T C 1 91 2 3 2 - B i t S i n g le - C h i p M ic r o c o n t r o l l e r M i c ro c o n t ro l l e rs N e v e r s t o p t h i n k i n g . Edition 2003-10 Published by Infineon Technologies AG, St.-Martin-Strasse 53, D-81541 München, Germany

SPC563M64

Abstract: SPC564A80 SPC564A chip amp ta 8268 e200z448n3 e200z4 PowerPC core Reference manual PCR131 K20 LQFP144 SPC564A80L7 flexcan spc56
Contextual Info: SPC564A80B4, SPC564A80L7 32-bit MCU family built on the embedded Power Architecture Preliminary data Features • ■ 150 MHz e200z4 Power Architecture core – Variable length instruction encoding VLE – Superscalar architecture with 2 execution units

1.8V SRAM

Contextual Info: Da ta S he et , V 1. 0, O ct . 20 03 T C 1 91 0 3 2 - B i t S i n g le - C h i p M ic r o c o n t r o l l e r M i c ro c o n t ro l l e rs N e v e r s t o p t h i n k i n g . Edition 2003-10 Published by Infineon Technologies AG, St.-Martin-Strasse 53, D-81541 München, Germany

Contextual Info: SPC563M64L5, SPC563M64L7 32-bit Power Architecture based MCU for automotive powertrain applications Datasheet − production data Features • 144 LQFP 20 mm x 20 mm Single issue, 32-bit Power Architecture® Book E compliant e200z335 CPU core complex – Includes variable length encoding VLE

SPC5644

Abstract: MPC5634M SPC5643 MPC5644A e200z4 MPC55XX JTAG MicroSecond Bus nexus 5001 CRC-32 MPC5534
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5644A Rev. 4, 09/2010 MPC5644A 324 TEPBGA 23 mm x 23 mm MPC5644A Microcontroller Data Sheet • 150 MHz e200z4 Power Architecture core – Variable length instruction encoding VLE

MPC5644A

Abstract: e200z448n3 SPC5643 SPC5644 e200z4 bosch injector common rail bosch Bosch oxygen sensor MPC5644APB bosch fuel injector
Contextual Info: Freescale Semiconductor Product Brief Document Number: MPC5644APB Rev. 5, 09/2010 This document contains preview information on a new product that may be in a design phase or under development. Freescale reserves the right to change or discontinue this product without notice.

SPC560B60L3

Abstract: SPC560B54L5 Date Code Marking STMicroelectronics LBGA LQFP100 tray ndk crystal SPC560B64x SPC560B64 SPC560B60 linflex SPC560
Contextual Info: SPC560B54x SPC560B60x, SPC560B64x 32-bit MCU family built on the Power Architecture for automotive body electronics applications Features • ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ High performance 64 MHz e200z0h CPU – 32-bit Power Architecture® technology CPU

intc 001107

Abstract: SPC560 PCR 406 J APC UPS CIRCUIT DIAGRAM SPC560P SPC560x spc560b transistor pcr 606 j STMICROELECTRONICS MSL PCR 606 J
Contextual Info: RM0017 Reference manual SPC560B4x, SPC560B5x, SPC560C4x, SPC560C5x 32-bit MCU family built on the embedded Power Architecture Introduction The SPC560x is a new family of next generation microcontrollers built on the Power Architecture™ embedded category. This document describes the features of the family and

Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5644A Rev. 7, Jan 2012 MPC5644A MPC5644A Microcontroller Data Sheet 176 24 x 24 mm • • • • • • • 150 MHz e200z4 Power Architecture core — Variable length instruction encoding (VLE)

Contextual Info: SPC560B40x, SPC560B50x SPC560C40x, SPC560C50x 32-bit MCU family built on the Power Architecture for automotive body electronics applications Datasheet − production data Features • High-performance 64 MHz e200z0h CPU – 32-bit Power Architecture® technology

Contextual Info: SPC564A74B4, SPC564A74L7, SPC564A80B4, SPC564A80L7 32-bit MCU family built on the embedded Power Architecture Features • ■ ■ ■ 150 MHz e200z4 Power Architecture® core – Variable length instruction encoding VLE – Superscalar architecture with 2 execution

sdc 7500 pwm control

Abstract: sdc 7500 cluster stepper motor transistor SMD PJ3 smd transistor pk3 ph-15 diode smd Pj9 sdc 7500 pwm SMD Transistor g15 pj12 diode
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5606S Rev. 2, 05/2009 MPC560xS LQFP 144 20 x 20 x 1.4 mm MPC560xS Microcontroller Data Sheet • High performance 64 MHz e200z0h CPU – 32-bit Power Architecture book E CPU – Up to 60 DMIPs operation

SPC560

Abstract: SPC560C50L3 FlexCAN SPC560B40L3 SPC560B64 SPC560C50 e200z Wakeup SPC560B40L3 FlexCAN SPC560B40L3 manual
Contextual Info: SPC560B40x, SPC560B50x SPC560C40x, SPC560C50x 32-bit MCU family built on the Power Architecture for automotive body electronics applications Datasheet − production data Features • High-performance 64 MHz e200z0h CPU – 32-bit Power Architecture® technology

C90FL

Abstract: SPC563M64 microsecond bus bosch bosch microsecond microsecond bus SPC563M60L3 bosch Knock sensor SPC563Mxx NEXUS CONNECTOR "microsecond bus"
Contextual Info: SPC563Mxx 32-bit Power Architecture based MCU for automotive powertrain applications Data Brief Features • Single issue, 32-bit PowerPCTM Book E compliant e200z335 CPU core complex – Includes variable length encoding VLE enhancements for code size reduction

TDA8756

Abstract: philips 116 k3 AC-RX2 LBGA208 LQFP144 TDA8754
Contextual Info: TDA8754 Triple 8-bit video ADC up to 270 Msample/s Rev. 06 — 16 June 2005 Product data sheet 1. General description The TDA8754 is a complete triple 8-bit ADC with an integrated PLL running up to 270 Msample/s and analog preprocessing functions clamp and PGA optimized for

TDA8756

Abstract: marking code CB SMD ic N6 acrx smd marking code pa0 MARKING BB5 ic DEVICE MARKING CODE ga7 AC-RX2 Top Marking GB2 marking gb0 marking GB6
Contextual Info: INTEGRATED CIRCUITS DATA SHEET TDA8754 Triple 8-bit video ADC up to 270 Msps Product specification Supersedes data of 2003 Sept 30 2004 May 19 Philips Semiconductors Product specification Triple 8-bit video ADC up to 270 Msps CONTENTS 1 FEATURES 2 APPLICATIONS

circuit diagram of wifi wireless router

Abstract: relay ras 1210 reverse MII BD 669 ST50160 PRDW08DGZ PRB08DGZ C184 RFC2684 circuit diagram of wifi router
Contextual Info: ST50160 ADSL RESIDENTIAL COMBO GATEWAY PROCESSOR DATA BRIEF 1 • ■ ■ GENERAL FEATURES Figure 1. Package WAN modem feature set Embedded ADSL transceiver ANSI T1.413, ITU G.dmt Annex A, B, C and Deutsche Telecom UR-2 compliant, splitterless ITU G.Lite Compatibility:

LBGA208

Abstract: LQFP144 TDA8754 AC-RX2
Contextual Info: INTEGRATED CIRCUITS DATA SHEET TDA8754 Triple 8-bit video ADC up to 270 Msps Preliminary specification Supersedes data of 2003 Jul 16 2003 Sep 30 Philips Semiconductors Preliminary specification Triple 8-bit video ADC up to 270 Msps CONTENTS 1 FEATURES 2 APPLICATIONS

fpi bus

Abstract: AD10 AD11 AD12 AD14 HS13 HS14 TC1910
Contextual Info: Da ta S he et , V 1. 0, O ct . 20 03 T C 1 91 0 3 2 - B i t S i n g le - C h i p M ic r o c o n t r o l l e r M i c ro c o n t ro l l e rs N e v e r s t o p t h i n k i n g . Edition 2003-10 Published by Infineon Technologies AG, St.-Martin-Strasse 53, D-81541 München, Germany

adsl2 wireless modem

Abstract: ST20190 ADSL2 chipset ST20184 ST20196 TQFP-100
Contextual Info: The ST advantage Development support The ST20190 ADSL2+ chipset is built on a worldwide reference, the widely deployed DynaMiTe technology, and hence leverages more than 10 years of field proven Interoperability ST Utopia chipsets are designed to allow OEM customers