LAND PATTERN TSOP 6 Search Results

land pattern for TSOP

Abstract: TSOP 86 land pattern land pattern for SOP land pattern PQFP 208 land pattern for TSOP 2 86 MA05A land pattern for TSOP 2 land pattern for SSOP land pattern PQFP 100
Contextual Info: Land Pattern Recommendations The following land pattern recommendations are provided as guidelines for board layout and assembly purposes. These recommendations cover the following National Semiconductor packages: PLCC, PQFP, SOP, SSOP and TSOP. For SOT-23 5-Lead and TO-263 (3- or 5-Lead) packages,

land pattern for SSOP

Abstract: TSOP 86 land pattern land pattern for SOP land pattern for TSOP TSOP 48 Pattern land pattern PQFP 208 land pattern for TSOP 2 86 tip 3035 land pattern PQFP 132 land pattern PQFP 100
Contextual Info: Land Pattern Recommendations The following land pattern recommendations are provided as guidelines for board layout and assembly purposes. These recommendations cover the following National Semiconductor packages: PLCC, PQFP, SOP, SSOP and TSOP. For SOT-23 5-Lead and TO-263 (3- or 5-Lead) packages, refer to land patterns shown in the Physical Dimensions for

land pattern for TSOP

Abstract: land pattern for TSOP 2 SO32-S-L-01 SO32B
Contextual Info: 17.78 [0.700"] 1 Top View 0.5 [0.020"] 32 1.27 [0.050"] 0.64 [0.025"] 0.3 [0.012"] 17 16 9.22 [0.363"] 1.59 [0.063"] 13 [0.512"] 24.13 [0.950"] 1 6.39 [0.252"] Front View 2 1 16 17 9.65 [0.380"] 6.61 [0.260"] Side View 1 32 7.88 [0.310"] Bottom View Description: SOIC TSOP II to SOIC (TSOP I) Package Converter

M29F400BB

Abstract: TSOP 48 Pattern M29F200B TSOP 44 Pattern
Contextual Info: 1.154" 23 44 0.624" 0.5 mm pitch typ. Top View 22 Pin 1 0.645" 0.845" 1 2 Side View 0.050"±0.003" typ 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Leads: material- BeCu Alloy 194; plating- 60/40 SnPb 150-400µ"

land pattern for TSOP 2 54 pin

Abstract: land pattern for TSOP 56 pin TSOP 54 land pattern 40013A land pattern for TSOP
Contextual Info: n H igh p e rfo rm a n c e 1 M X 8 /5 1 2 K X 1 6 2.2V CMOS Flash EEPROM AS29LL8ÜÖ II 1 M X 8 / 5 1 2 K X 1 6 CMOS Flash EPROM Advance information Features •O rganization: 1M x 8/512K x 16 • Sector architecture - • Low power consumption - 8 mA typical read current

atmel 8086

Abstract: 49f020 m29F DATASHEET AM29F002 002N AT49 SST39SF010A SST39SF020A SST39SF040 SST39VF020
Contextual Info: Designing In SST’s Multi-Purpose Flash 39 Series Byte-wide Products Designing In SST’s Multi-Purpose Flash (39 Series) Byte-wide Products Application Note April 2003 INTRODUCTION This application note introduces the SST 39 series - SST’s mainstream Multi-Purpose Flash (MPF) product line. It

atmel 8086

Abstract: 49f020 Am29 Flash Family m29F DATASHEET sst 90 AT49 SST39SF010A SST39SF020A AM29F002 SST39VF010
Contextual Info: Designing In SST’s Multi-Purpose Flash 39 Series Byte-wide Products Application Note October 2005 Designing In SST’s Multi-Purpose Flash (39 Series) Byte-wide Products INTRODUCTION This application note introduces the SST 39 series - SST’s mainstream Multi-Purpose Flash (MPF) product line. It

Contextual Info: H ig h P e rfo rm a n c e lMx4 CMOS DRAM A S4C 14400 h II , 1 1M x 4 CMOS DRAM fast page m ode Prelim inary inform ation Features • 1 0 2 4 r e f r e s h c y c le s , 1 6 m s r e f r e s h in te r v a l • O r g a n iz a t io n : 1 , 0 4 8 ,5 7 6 w o r d s x 4 b its

1206 land pattern

Abstract: NOMCA MPMA HTRN
Contextual Info: Land Patterns www.vishay.com Vishay Dale Thin Film Vishay Dale Thin Film Land Patterns 1. Scope This technical note provides sample land patterns for Vishay Dale Thin Film SMT resistive products. The following drawings are based on IPC-SM-782 Surface Mount Design and Land Pattern Standard. These drawings are for reference only Vishay Thin

TSOP 86 land pattern

Abstract: land pattern 86 PIN TSOP II PA-SO86A-C-S-01
Contextual Info: 8.55mm [0.337"] 7.24mm [0.285"] 9.32mm [0.367"] 25.40mm [1.000"] 12.83mm [0.505"] 10.16mm [0.400"] 0.50mm pitch [0.020"] 38.10mm [1.500"] Top View 3 1 3.16mm [0.125"] 2 3.19mm [0.126"] 0.46mm dia. [0.018"] 2.54mm [0.100"] Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]

TSOP 44 Pattern

Abstract: MCM62996
Contextual Info: 3.57mm [0.141"] 3.54mm [0.140"] Pin 1 5.54mm [0.218"] 2.78mm [0.109"] 11.18mm [0.440"] 0.4mm [0.016"] 1 R1 3.56mm [0.140"] C2 C1 0.38mm [0.015"] scored edge 21.18mm [0.834"] 22.35mm [0.880"] 17.42mm [0.686"] 11.17mm [0.440"] TSOP PLCC 0.61mm [0.024"] 0.8mm

land pattern for TSOP 2 44 PIN

Abstract: land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin psop 44 land pattern PQFP 208
Contextual Info: High perform ance 512KX32 CMOS SGRAM 16 Megabit CMOS synchronous graphic RAM Advance information • Organization - 131,072 words x 32 bits x 4 banks • Fully synchronous - All signals referenced to positive edge of dock • Four internal banks controlled by BA0/BA1 bank select

c2702

Abstract: land pattern for TSOP TSOP 56 socket CA-SO56F-L-S-01 SF-SO56F-L-03
Contextual Info: 0.580" 0.370" 0.420" 0.210" Top View 0.040" pitch typ. 0.5 mm pitch typ. 0.580" 1 4 0.250" 2 0.370" assembled 3 SF-SO56F-L-03 included Side View 0.5 mm pitch typ. 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating

land pattern for TSOP 2-44

Abstract: Wells programming adapter TSOP 48 intel 44-lead psop land pattern for TSOP 56 pin F9232 E28F016SA70 tsop tray matrix outline wells 648-0482211 memory card thickness 29f200 tsop adapter
Contextual Info: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions

CERAMIC PIN GRID ARRAY wire lead frame

Abstract: BGA and QFP Package TO metal package aluminum kovar TSOP 2E TSOP 54 Package nail qfp 32 land pattern ceramic pin grid array package plating ceramic pin grid array package lead finish PGA wire bonding
Contextual Info: Package Lineup/ Forms/ Structures 1. Package Lineup 2. Package Forms 3. Package Structures DB81-10002-2E 1 Package Lineup/ Forms/ Structures 1. Package Lineup PACKAGE 1. Package Lineup The packages are classified as follows, according to form, material, and the mounting methods

land pattern for TSOP 2 54 pin

Abstract: TSOP 54 land pattern AS7C1024 AS7C31024 land pattern for TSOP 2 44 PIN
Contextual Info: H igh P erfo rm an ce •■ 128Kx8 A S7C 1024 A S7C 31024 H CMOS SRAM 1 2 8 K X 8 CM O S SRAM C o m m o n I / O Features • O rg a n iz a tio n : 1 3 1 ,0 7 2 w o rd s x 8 b its • H ig h sp e ed - 3 0 0 m il PDIP a n d SOJ - 1 0 / 1 2 / 1 5 / 2 0 n s ad d ress access tim e

land pattern for PSOP

Contextual Info: Plastic dual in-line package PDIP 20 pin 300 mil Min A Al B b c D E El c tA L a S 0.010 0.046 0.018 0.008 28 pin 300 mil Max 0.175 0.054 0.024 0.014 0.980 0.310 0.290 0.263 0.293 0.100 BSC 0.310 0.3S0 0.130 0.110 0° 15° 0.040 Min 0.010 0.0.58 0.016 C.008

Contextual Info: 1 Substrate: 0.0625"±0.007" Fr4/G10 or equivalent high temp material. 2 Pins: shell material- Brass; finish10µ" Gold over 50µ" Nickel min. . 0.300" Pins: shell material- Brass; shell finish10µ" Gold over 50µ" Nickel (min.). Contact material- Beryllium copper; contact finish

CA-SO48C-M-S-01

Abstract: SF-SO48C-L-01 TSOP 48 Pattern
Contextual Info: 0.505" 0.420" 0.370" 0.210" Top View 0.040" pitch typ. 0.5 mm pitch typ. 1 3 0.250" 2 Side View 0.525" 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Substrate: 0.125"±0.007" FR4/G10 or equivalent high temp material. Non-clad

Contextual Info: 0.600" 1 Substrate: 0.0625"±0.007" Fr4/G10 or equivalent high temp material. 2 Pins: shell material- Brass; finish10µ" Gold over 50µ" Nickel min. . 3 Top View Pins: shell material- Brass; shell finish10µ" Gold over 50µ" Nickel (min.). Contact material- Beryllium copper; contact finish

CA-SO48C-L-S-01

Abstract: SF-SO48C-L-01
Contextual Info: 0.505" 0.420" 0.370" 0.210" 0.040" pitch typ. 0.5 mm pitch typ. Top View 1 4 0.250" 2 0.525" 0.370" aasembled Side View 3 SF-SO48C-L-01 included 0.5 mm pitch typ. 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating

BGA-3000

Abstract: Intel reflow soldering profile BGA BGA-3102 BGA-3101 convection oven temperature sensor intel 3102 DIAPHRAGM PUMP rtd 2025 vacuum pump 28F008B3
Contextual Info: CSP-UG Chip-Scale Upgrade Kit for BGA-3000 Series Rework System 1 The rapidly emerging Chip-Scale Package has been associated with many challenges in both the rework and prototyping environment. This particular package demands a specifically tailored rework solution while maintaining user-friendliness.

PAL 007 pioneer

Abstract: pioneer PAL 007 A PAL 008 pioneer sn 7600 n 648-0482211 sem 2106 Trays tsop56 TSOP 86 land pattern amd socket 940 pinout Meritec 980020-56
Contextual Info: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions

pioneer PAL 007 A

Abstract: PAL 007 pioneer str 6654 PAL 008 pioneer pin details of str W 6654 sem 2106 Yamaichi Electronics ic197 648-0482211 TSOP56 jackson
Contextual Info: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions