LAND PATTERN SOP Search Results

land pattern for SSOP

Abstract: TSOP 86 land pattern land pattern for SOP land pattern for TSOP TSOP 48 Pattern land pattern PQFP 208 land pattern for TSOP 2 86 tip 3035 land pattern PQFP 132 land pattern PQFP 100
Contextual Info: Land Pattern Recommendations The following land pattern recommendations are provided as guidelines for board layout and assembly purposes. These recommendations cover the following National Semiconductor packages: PLCC, PQFP, SOP, SSOP and TSOP. For SOT-23 5-Lead and TO-263 (3- or 5-Lead) packages, refer to land patterns shown in the Physical Dimensions for

land pattern for TSOP

Abstract: TSOP 86 land pattern land pattern for SOP land pattern PQFP 208 land pattern for TSOP 2 86 MA05A land pattern for TSOP 2 land pattern for SSOP land pattern PQFP 100
Contextual Info: Land Pattern Recommendations The following land pattern recommendations are provided as guidelines for board layout and assembly purposes. These recommendations cover the following National Semiconductor packages: PLCC, PQFP, SOP, SSOP and TSOP. For SOT-23 5-Lead and TO-263 (3- or 5-Lead) packages,

7402

Abstract: ED-7402 land pattern for SOP DATA SHEET 7402 ED-7402-1 datasheet 7402 7402 data sheet
Contextual Info: SOP LAND PATTERN DIMENSIONS e1 e1 I2 α L β1 β2 b b2 Dimension Parameter e 1.27 α β1 β2 γ 0.20 0.50 0.20 0.30 b2 e E I2 I2 L+ β 1 + β 2 b b2 e − γ Unit : mm Remark Washability of the printed-circuit board Soldering strength Pattern accuracy of the solder mask and visual inspection soldering.

SOP16 Package

Abstract: sop16
Contextual Info: 16-Pin Small Outline Package SOP16 Package Outline Dimensions Outline Dimensions Unit: mm 1.27 8 0.43 +0.07 –0.04 10.8 max 0.1 Land Pattern Example 0.25 +0.075 0 ～10゜ 0.8 ±0.2 0.25 M Enlarged view of A A 0.1 +0.1 –0.05 1.5 ±0.2 10.3 ±0.2 1.9 max

SOP20 Package

Abstract: SOP20 20 pin Package PSOP-20
Contextual Info: 20-Pin Small Outline Package SOP20 Package Outline Dimensions Outline Dimensions 1.27 0.43 +0.07 –0.04 0 ～10゜ 0.8 ±0.2 0.25 M 13.3 max 0.1 Land Pattern Example Enlarged view of A A 0.1 +0.1 –0.05 1.5 ±0.2 12.8 ±0.2 1.9 max 0.685 typ. 0.25 10 +0.075

PA-DSO-1403

Abstract: PA-DSO-4406 PA-SOF-D310-20/6 PA-SOF-D310-16/6 PA-SOF-D420-14/6 PA-SOF-D310-18/6 PA-SOF-D310-14/6 PA-SOF-D250-08/6 PA-SOF-D250-14/6 PA-SOF-D250-16/6
Contextual Info: DIP to SO-Plug Prototyping Adapter Kits These adapters will convert a small outline land pattern to a DIP package. The adapter provides a solder down SOplug on the bottom and a detachable 300 or 600 mil wide open-frame DIP socket on the top. They are also available

sop8 Package dimension

Abstract: weight of SOP package land pattern for SOP land pattern SOP SOP8 Package TOSHIBA Package
Contextual Info: 8-pin Small Outline Package SOP-8 Package Outline Dimensions Outline Dimensions Unit: mm 0.4 ±0.1 0.25 M 5.5 max 5.0 ±0.2 1.5 ±0.2 0.15 +0.1 –0.05 0.1 Land Pattern Example +0.1 0.595 typ. 4 1.27 1.27 1.27 0.1 –0.05 1 0.5 ±0.2 4.4 ±0.2 6.0 ±0.3 5

SOP14 package

Abstract: SOP14
Contextual Info: 14-Pin Small Outline Package SOP14 Package Outline Dimensions Outline Dimensions Unit: mm 1.34 typ. 1.27 10.8 max Land Pattern Example 0.25 +0.075 0 ～10゜ 0.8 ±0.2 0.25 M Enlarged view of A A 0.1 +0.1 –0.05 1.5 ±0.2 10.3 ±0.2 0.1 7.8 ±0.3 7 0.43 +0.07

Contextual Info: CHINO- EXCEL TECHNOLOGY CORP. SOP-8 產品外觀尺寸圖 Product Outline Dimension 0.5 Pin 1 dot 4.75 6.75 θ L Detail “A” 1.0 E1 7 (4X) D 。 1.27 。 7 (4X) 1.27 1.27 (單位：mm) Land Pattern Recommendation A e A1 See Detail “A” B eB SYMBOLS

Contextual Info: 8-Pin Flat Mini Package FM8 Package Outline Dimensions Outline Dimensions Unit: mm 5.0 +0.2 –0.3 0.15 +0.1 –0.05 0.35 ±0.1 4.5 +0.3 –0.2 5 3.1 ±0.2 8 4 1 1.27 0 ~0.1 1.5 ±0.2 1.27 1.27 Land Pattern Example Unit: mm 3.8 1.2 0.7 Toshiba package name

2952 8pin

Contextual Info: DIMENSIONS Unit: mm LAND PATTERN RECOMMENDATION (Unit: mm) 1.0 SOT-89-5 2.0 1.0 1.0 4.5±0.2 1.6±0.2 1.5±0.2 0.3 0.65 min. (0.2) 2.5±0.2 4.5 45° 2.7 (3.1) (0.1) +0.2 -0.3 0.3 (0.2) 0.65 min. 1.0 0.4±0.1 0.4±0.1 0.45±0.1 1.5±0.1 1.5 0.4±0.05 1.5±0.1

land pattern for TSsOP 16

Abstract: land pattern for TSSOP RL01 dj rw
Contextual Info: R E V 1 S 1ON S REV S YMM D E SC R IP T IO N B REDRAW ON C P O S . T O L . O F L E A D S WAS 0 . 1 3 ; UPDATE NOTE 1. D ADD LEAD PRO/E; FIN IS H ADD NOTE LAND PATTERN RECOM ENDATION CHANGE S H T . & UPDATE TO "B" E .C .N . DATE 113 2 3 02/16/1996 MS/CS 721

TSSOP 8PIN MARK 21

Abstract: land pattern for TSsOP 16 6pin land pattern for TSsOP 8 2952 8pin HA005-A-P
Contextual Info: CMOS IC PACKAGES Package Type DIP/TO Gull-wing Flat-lead WLP *1 Pin Count 3 8 4 5 3 5 6 3 5 8 14 8 10 8 16 24 8 5 6 8 8 10 6 4 6 8 4 5 6 8 Package Name TO-92 8-Pin DIP SC-82AB SC-88A SOT-23-3 SOT-23-5 SOT-23-6 SOT-89-3 SOT-89-5 8-Pin SOP JEDEC 14-Pin SOP

IPC-7351A

Abstract: MiniMELF land pattern land pattern for TSsOP 16 land pattern for TSSOP sot89 land pattern PowerDI3333-8 SOD-323 land pattern y1 SOT23 DFN2020 SOD523 land pattern
Contextual Info: SUGGESTED PAD LAYOUT Based on IPC-7351A DFN1006-2 / DFN1006H4-2 / MiniMELF / MELF / SOD-323 / SOD-123 / SOD-523 / SMA / SMB / SMC C X G Y Z Dimensions Z G X Y C DFN1006-2 / MiniMELF DFN1006H4-2 1.1 4.7 0.3 2.1 0.7 1.7 0.4 1.3 0.7 3.5 MELF SOD-123 SOD-323 SOD-523

IPC-7351A

Abstract: AP02001 DFN1616-8 DFN2018-6 ipc SMB SMC MELF pad layout MiniMELF land pattern MELF "Land Pattern" DFN1411-3 land pattern for SOP
Contextual Info: Suggested Pad Layout Based on IPC-7351A Figure 1 Dimensions DFN1006-2 MiniMELF MELF SOD-323 SOD-123 SOD-523 SMA SMB SMC 9.3 Z 1.1 4.8 6.3 3.75 4.9 2.3 6.5 6.7 G 0.3 2.1 3.3 1.05 2.5 1.1 1.5 1.8 4.4 X 0.7 1.7 2.7 0.65 0.7 0.8 1.7 2.3 3.3 Y 0.4 1.3 1.5 1.35

Y1 SOT-23

Abstract: MELF pad layout DFN2020-3 ipc SMB SMC land pattern for TSsOP 16 IPC-7351A SOT-353 G5 SOD-323 land pattern SOD523 land pattern land pattern for msOP 8
Contextual Info: SUGGESTED PAD LAYOUT Based on IPC-7351A DFN1006-2 / DFN1006H4-2 / MiniMELF / MELF / SOD-323 / SOD-123 / SOD-523 / SMA / SMB / SMC C X G Y Z Dimensions Z G X Y C DFN1006-2 / MiniMELF DFN1006H4-2 1.1 4.7 0.3 2.1 0.7 1.7 0.4 1.3 0.7 3.5 MELF SOD-123 SOD-323 SOD-523

CPC1225N

Abstract: cpc1002 CPC1004N LCA715 "pin compatible" CPC1017N CPC1025N cpc1008 CPC1018N CPC1030N CPC1035N
Contextual Info: Single Pole Normally Open: 1-Form-A CPC1008N 100 150 8 1500 2 1 2/0.5 4 Pin SOP CPC1016N 100 100 16 1500 2 1 2/0.5 4 Pin SOP CPC1017N 1500 1 1 10/10 4 Pin SOP 60 100 16 CPC1018N 60 600 0.8 1500 1 1 3/2 4 Pin SOP CPC1025N 400 120 30 1500 2 1 2/1 4 Pin SOP CPC1030N

IPC-7527

Abstract: PCB design for 0.2mm pitch csp package IPC7527 tssop 16 exposed pad stencil metcal VPI-1000 qfn 44 PACKAGE footprint 7x7 DIe Size qfn 48 7x7 stencil QFN 16 CARSEM package outline QFN 8 CARSEM APR-5000
Contextual Info: MLP Application Note APPLICATION NOTE Comprehensive User’s Guide April 2002 April 2002 Cover Page Page MLP Application Note CONTENTS 1.0 1.1 THE CARSEM MICRO LEADFRAME PACKAGE MLP Introduction 2.0 2.1 MANUFACTURING CONSIDERATIONS SMT Process 3.0 3.1 3.2

2735N

Abstract: NSA6295A TTL IC
Contextual Info: クロック用水晶発振器 2735N シリーズ • 形名 2735N 総合周波数許容偏差± 100 x 10–6 品 ■ 用途 ●ノート PC携帯情報端末、PC カード ■ 特長 ● TTL IC を直接駆動します。 ● 薄型 IC（TS SOP、TV SOP）と同等の薄さ 1mm を実現しました。

Contextual Info: クロック用水晶発振器 2735N シリーズ • 形名 2735N 総合周波数許容偏差± 50 x 10–6 品 ■ 用途 ●ノート PC携帯情報端末、PC カード ■ 特長 ● TTL IC を直接駆動します。 ● 薄型 IC（TS SOP、TV SOP）と同等の薄さ 1mm を実現しました。

Contextual Info: クロック用水晶発振器 2735N シリーズ • 形名 2735N 総合周波数許容偏差± 100 x 10–6 品 ■ 用途 ●ノート PC携帯情報端末、PC カード ■ 特長 ● TTL IC を直接駆動します。 ● 薄型 IC（TS SOP、TV SOP）と同等の薄さ 1mm を実現しました。

2735N

Abstract: NSA6295B CC701
Contextual Info: クロック用水晶発振器 2735N シリーズ • 形名 2735N 総合周波数許容偏差± 50 x 10–6 品 ■ 用途 ●ノート PC携帯情報端末、PC カード ■ 特長 ● TTL IC を直接駆動します。 ● 薄型 IC（TS SOP、TV SOP）と同等の薄さ 1mm を実現しました。

land pattern for SOP

Contextual Info: 8-pin Small Outline Advance Package SOP Advance Package Outline Dimensions Outline Dimensions 0.166 ±0.05 0.15 ±0.05 5.0 ±0.2 A 4 1 3.5 ±0.2 8 1.1 ±0.2 Bottom view 0.95 ±0.05 5.0 ±0.2 4 1.27 1.27 1.27 0.5 ±0.1 1 5 6.0 ±0.3 5 8 0.595 4.25 ±0.2 0.05 M A

D560 transistor

Abstract: 40 pin zif socket 20 pin zif socket 2003Z d560 D420 ZIF socket 16 pin dip zif socket PA-SOF-D420-28 zif 40 pin socket
Contextual Info: DIP to SO-Plug Prototyping Adapters DIP to SO-Plug Prototyping Adapters Simplify prototyping and testing Use actual size prototype boards Great for microcontrollers and EE/Flash memory testing Simple design is easy to use These plugs and socket boards are simple and easy to use following