LAND PATTERN FOR SSOP Search Results

land pattern for SSOP

Abstract: TSOP 86 land pattern land pattern for SOP land pattern for TSOP TSOP 48 Pattern land pattern PQFP 208 land pattern for TSOP 2 86 tip 3035 land pattern PQFP 132 land pattern PQFP 100
Contextual Info: Land Pattern Recommendations The following land pattern recommendations are provided as guidelines for board layout and assembly purposes. These recommendations cover the following National Semiconductor packages: PLCC, PQFP, SOP, SSOP and TSOP. For SOT-23 5-Lead and TO-263 (3- or 5-Lead) packages, refer to land patterns shown in the Physical Dimensions for

SOD-323 land pattern

Abstract: SOIC 8 pcb pattern land pattern for SSOP tssop 16 exposed pad stencil land pattern for TSsOP 16 LPCC-16 16 soic pcb footprint land pattern for TSSOP qfn 32 land pattern qfn 28 land pattern
Contextual Info: Application Note Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and

tssop 16 exposed pad stencil

Abstract: C1316C SOIC 8 pcb pattern qfn 88 stencil SOIC 16 narrow body exposed pad pcb pattern 1316C land pattern for TSsOP 16 land pattern for TSSOP 24 pin jedec package MO-220 QFN-32 SOIC 8 narrow body pcb pattern
Contextual Info: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and

qfn 32 land pattern

Abstract: hermetic packages PCB land IPC 1725 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP land pattern for TSSOP 24 pin 16 soic pcb footprint QFN-20 reflow IPC-SM-782
Contextual Info: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and

land pattern for TSOP

Abstract: TSOP 86 land pattern land pattern for SOP land pattern PQFP 208 land pattern for TSOP 2 86 MA05A land pattern for TSOP 2 land pattern for SSOP land pattern PQFP 100
Contextual Info: Land Pattern Recommendations The following land pattern recommendations are provided as guidelines for board layout and assembly purposes. These recommendations cover the following National Semiconductor packages: PLCC, PQFP, SOP, SSOP and TSOP. For SOT-23 5-Lead and TO-263 (3- or 5-Lead) packages,

C1316C

Abstract: LPCC-16 land pattern for msOP 8 SOIC 8 pcb pattern jedec package MO-220 QFN-32 16 soic smd pcb footprint land pattern for TO 92 qfn 32 land pattern qfn32 land pattern land pattern for msOP 10
Contextual Info: Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and Packaging Electronic Circuits surface

200123K

Abstract: QFN 88 land pattern LGA-28 land pattern SOIC 8 pcb pattern
Contextual Info: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages Introduction Surface Mount Guidelines for Leadless Packages This Application Note provides sample PCB land pattern dimensions for a variety of leaded and leadless packages. These

1206 land pattern

Abstract: NOMCA MPMA HTRN
Contextual Info: Land Patterns www.vishay.com Vishay Dale Thin Film Vishay Dale Thin Film Land Patterns 1. Scope This technical note provides sample land patterns for Vishay Dale Thin Film SMT resistive products. The following drawings are based on IPC-SM-782 Surface Mount Design and Land Pattern Standard. These drawings are for reference only Vishay Thin

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of SSOP20 package SOT339-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of SSOP20 package SOT266-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land

noaa weather radio circuit diagram

Abstract: Si47xx Si470x AMI Semiconductor AN383 Si4737 Si473x si4738 FM receiver CIRCUIT DIAGRAM and specification Si4736
Contextual Info: Si4736/37/38/39-C40 B ROADCAST AM/FM R ADIO R ECEIVER Features    Integrated LDO regulator  2.0 to 5.5 V supply voltage SSOP  2.7 to 5.5 V supply voltage (QFN)  Wide range of ferrite loop sticks and air loop antennas supported  QFN and SSOP packages

SI4734

Abstract: Si4735 Si4735-C40-GU Si4734-35-C40 am sw fm radio PCB schematic diagram Si473x Si4735 receiver chip si4735-c40 Si47xx FM radio CIRcuit DIAGRAM Shortwave
Contextual Info: Si4734/35-C40 B ROADCAST AM/FM R ADIO R ECEIVER Features       RDS/RBDS processor Si4735  Optional digital audio out (Si4735)  2-wire and 3-wire control interface Ordering Information: See page 32.  Integrated LDO regulator  2.0 to 5.5 V supply voltage (SSOP)

4730C40GU

Abstract: 4730C40 SI4731 SI4730 Si473x Si47xx marking code AE -transformer SDIO CARD PCB PAD SIZE SI4730-C40-GU SI4730-C40-GM
Contextual Info: Si4730/31-C40 B ROADCAST AM/FM R ADIO R ECEIVER Features    Integrated LDO regulator  2.0 to 5.5 V supply voltage SSOP  2.7 to 5.5 V supply voltage (QFN) air loop antennas supported     Modules  Clock radios  Mini HiFi  Entertainment systems

land pattern for SSOP

Abstract: DATA SHEET 7402 ed 7402-2
Contextual Info: SSOP LAND PATTERN DIMENSIONS e1 e1 I2 α L β1 β2 b b2 Dimension Parameter e 0.80 0.65 α β1 β2 γ 0.20 0.30 0.20 0.30 0.20 0.30 0.20 0.30 b2 e E I2 I2 L+ β 1 + β 2 b b2 e −γ Unit : mm 0.50 Remark 0.20 0.30 0.20 0.25 Washability of the printed-circuit board

max232 free

Abstract: MAX249 AUO-M201.1F pdf MAX222CPN 90-0108 MAX232EJE 8 PIN Plastic DIP land pattern max233acw
Contextual Info: 19-4323; Rev 15; 1/06 +5V-Powered, Multichannel RS-232 Drivers/Receivers Next-Generation Device Features The MAX220–MAX249 family of line drivers/receivers is intended for all EIA/TIA-232E and V.28/V.24 communications interfaces, particularly applications where ±12V is

Contextual Info: 19-1339; Rev 9; 2/07 ±15kV ESD-Protected, 1µA, 1Mbps, 3.0V to 5.5V, RS-232 Transceivers with AutoShutdown Plus The MAX3224E/MAX3225E/MAX3226E/MAX3227E/ MAX3244E/MAX3245E are 3V-powered EIA/TIA-232 and V.28/V.24 communications interfaces with automatic shutdown/wakeup features, high data-rate capabilities, and enhanced electrostatic discharge ESD

CY8C28000-24PVXI

Abstract: QFN48 108X108
Contextual Info: 15.88mm [0.625"] 24.77mm [0.975"] 286XXQ rev * 27.57mm [1.085"] McMaster/Carr 91185A558 CY3250-286XXQFN Description: POD 56 pin SSOP OCD with Hirose cable connector P/N: DF12-5.0-20DP-0.5V-81 with retension mechanism included. Compatible with: SF-QFN48A-L-02B, QFN foot, 48 pin, 0.5mm pitch, 5mm body

SSOP24

Abstract: land pattern ssop24
Contextual Info: 24-Pin Shrink Small Outline Package SSOP24 Package Outline Dimensions Outline Dimensions Unit: mm 0.25 7.6 ±0.3 +0.03 0.15 -0.01 13 5.6 ±0.2 24 0 ～10゜ 0.45 ±0.2 0.325 typ. 0.65 12 0.22 +0.09 –0.06 0.1 Land Pattern Example 0.13 M Enlarged view of A

TSSOP 8PIN MARK 21

Abstract: land pattern for TSsOP 16 6pin land pattern for TSsOP 8 2952 8pin HA005-A-P
Contextual Info: CMOS IC PACKAGES Package Type DIP/TO Gull-wing Flat-lead WLP *1 Pin Count 3 8 4 5 3 5 6 3 5 8 14 8 10 8 16 24 8 5 6 8 8 10 6 4 6 8 4 5 6 8 Package Name TO-92 8-Pin DIP SC-82AB SC-88A SOT-23-3 SOT-23-5 SOT-23-6 SOT-89-3 SOT-89-5 8-Pin SOP JEDEC 14-Pin SOP

Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing M24.15 24 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE QSOP/SSOP 0.150” WIDE BODY Rev 3, 2/13 24 6.19 5.80 INDEX 3.98 3.81 AREA 5 4 0.25(0.010) M B M -B- 1 TOP VIEW DETAIL “X” SEATING PLANE

Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing M16.15A 16 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE QSOP/SSOP 0.150” WIDE BODY Rev 3, 8/12 16 INDEX AREA 3.99 3.81 6.20 5.84 4 0.25(0.010) M B M -B- 1 TOP VIEW DETAIL “X” SEATING PLANE

land pattern for sot109-1

Abstract: TSSOP-8 footprint and soldering sot-23 SOD87 footprint
Contextual Info: Packages Package cross reference 88 Packing methods 90 Minimized outline drawings and reflow soldering footprint 96 Package overview 86 107 87 Package cross reference Package cross reference 88 types in bold represent new products types in bold represent new products

lcd cross reference

Contextual Info: Chip Bead Array Chip Bead Array Type: EXC28B • Features ■ Recommended Applications ● Space saving ● Compatible line pitch with SSOP package 0.5 mm pitch ● Small size and light weight ● Pb Free (Terminal plating, conductor) ● Small digital equipment such as Personal computers, Printer, HDD, DVD-ROM, CD-ROM, LCD.

lcd cross reference

Abstract: EXC28BA121U EXC28BA221U EXC28BB121U HP4291A
Contextual Info: Chip Bead Array Chip Bead Array Type: EXC28B n Features l Space saving l Compatible line pitch with SSOP package 0.5 mm pitch l Small size and light weight Type: EXC28BB l Suitable for high speed signal (over 50 MHz) l Excellent cross talk characteristics (100 MHz:<-25 dB)