LAND PATTERN FOR SOP Search Results

PA-DSO-1403

Abstract: PA-DSO-4406 PA-SOF-D310-20/6 PA-SOF-D310-16/6 PA-SOF-D420-14/6 PA-SOF-D310-18/6 PA-SOF-D310-14/6 PA-SOF-D250-08/6 PA-SOF-D250-14/6 PA-SOF-D250-16/6
Contextual Info: DIP to SO-Plug Prototyping Adapter Kits These adapters will convert a small outline land pattern to a DIP package. The adapter provides a solder down SOplug on the bottom and a detachable 300 or 600 mil wide open-frame DIP socket on the top. They are also available

IPC-7351A

Abstract: AP02001 DFN1616-8 DFN2018-6 ipc SMB SMC MELF pad layout MiniMELF land pattern MELF "Land Pattern" DFN1411-3 land pattern for SOP
Contextual Info: Suggested Pad Layout Based on IPC-7351A Figure 1 Dimensions DFN1006-2 MiniMELF MELF SOD-323 SOD-123 SOD-523 SMA SMB SMC 9.3 Z 1.1 4.8 6.3 3.75 4.9 2.3 6.5 6.7 G 0.3 2.1 3.3 1.05 2.5 1.1 1.5 1.8 4.4 X 0.7 1.7 2.7 0.65 0.7 0.8 1.7 2.3 3.3 Y 0.4 1.3 1.5 1.35

240817

Abstract: SURFACE MOUNT TECHNOLOGY
Contextual Info: 7 Surface Mount Technology SMT 7.1 Introduction Traditional through-hole methods of assembling conventional electronic assemblies reached their limits in terms of improvements in cost, weight, volume, and reliability at approximately 68L. SMT allows production of more reliable assemblies at increased board density, reduced weight,

land pattern for sot109-1

Abstract: TSSOP-8 footprint and soldering sot-23 SOD87 footprint
Contextual Info: Packages Package cross reference 88 Packing methods 90 Minimized outline drawings and reflow soldering footprint 96 Package overview 86 107 87 Package cross reference Package cross reference 88 types in bold represent new products types in bold represent new products

Si8640BB

Contextual Info: Si8640/41/42/45 L O W - P OWER Q UAD - C HANNEL D IGITAL I SOLATOR Features  High-speed operation DC to 150 Mbps  No start-up initialization required  Wide Operating Supply Voltage 2.5–5.5 V  Up to 5000 VRMS isolation   

TK12A10K3

Abstract: tk12a10k TK33A60V TPCA*8065 TK40E10K3 SSM6K407TU TPCA*8064 tk6a65d equivalent TPCA*8036 TK100G10N1
Contextual Info: Semiconductor Catalog 2012-3 MOSFETs SEMICONDUCTOR & STORAGE PRODUCTS http://www.semicon.toshiba.co.jp/eng C O N T E N T S 1 Features and Structures . 3 2 Toshiba’s MOSFET Product Lines and Part Numbering Schemes. 4

TD9722

Contextual Info: Techcode DATASHEET Stereo, Differential Input Cap-Free Line Driver TD9722 General Description Features The TD9722 is a stereo, differential input, single supply,and cap-free line driver, which is available in SOP-14 and TSSOP-14 packages. The TD9722 is ground-reference output, and doesn’t need

TD9721

Contextual Info: Techcode DATASHEET Stereo, Differential Input Cap-Free Line Driver TD9721 General Description Features The TD9721 is a stereo, differential input, single supply,and cap-free line driver, which is available in SOP-14 and TSSOP-14 packages. The TD9721 is ground-reference output, and doesn’t need

STJ009

Contextual Info: STJ009 P-ch Trench MOSFET Portable Equipment Application Features  Low drain-source On-resistance: RDS on =72mΩ (Max.) @VGS=-10V, ID=-2.7A  Low gate charge: Qg=4.7nC (Typ.)  High power and current handing capability  RoHS compliant device SOP-8

land pattern for TSsOP 16

Abstract: land pattern for TSSOP RL01 dj rw
Contextual Info: R E V 1 S 1ON S REV S YMM D E SC R IP T IO N B REDRAW ON C P O S . T O L . O F L E A D S WAS 0 . 1 3 ; UPDATE NOTE 1. D ADD LEAD PRO/E; FIN IS H ADD NOTE LAND PATTERN RECOM ENDATION CHANGE S H T . & UPDATE TO "B" E .C .N . DATE 113 2 3 02/16/1996 MS/CS 721

LH1540ACDTR

Abstract: LH1525ACD LH1540 LH1540ACD
Contextual Info: LH1540ACD/ACDTR 1 Form A SOP Solid-State Relay FEATURES • • • • • • • • • Package Dimensions in Inches mm High-speed Operation 1500 VRMS I/O Isolation Current-limit Protection High Surge Capability Linear, ac/dc Operation Clean, Bounce-free Switching

z44n

Abstract: mosfet z44n specification of mosfet irf IRF MOSFET driver IRF Power MOSFET code marking IRF n CHANNEL MOSFET 1N4148 marking SOT89 MARKING CODE CL sot89 Marking mosfet RL Z44N
Contextual Info: AP436 Synchronous Rectifier MOSFET Driver „ Features „ General Descriptions - VOUT slew-rate minimum 100V/uS @ CL=3000pF - IOUT sink & source =1.2 / 0.9 A - Safety considered. - Reduce power system thermal & increase system efficiency. - Pb-free packages: SOT89-5L, SOP-8L

AN4129

Abstract: FAN7601B
Contextual Info: FAN7601B Green Current Mode PWM Controller Features Description • •        The FAN7601B is a programmable frequency green current mode PWM controller. It is specially designed for the offline adapter applications and the auxiliary power

FAN7601B

Abstract: 0306 8pin AN4129 FAN7601BGX AN412 FAN7601BMX FAN7601
Contextual Info: FAN7601B Green Current Mode PWM Controller Features Description • •        The FAN7601B is a programmable frequency green current mode PWM controller. It is specially designed for the offline adapter applications and the auxiliary power

CTS RESISTOR NETWORK

Abstract: diode b6 k 450 RT-1404 RT1400B6 RT1400B7 RT1401B6 RT1401B7 RT1402B6 SSTL-2 1.27 pad layout
Contextual Info: DDR SDRAM Terminator Technical Data Preliminary Features • 18 Bit SSTL-2 Termination Sets • Compliant to JEDEC Std. 8-9 • Excellent High Frequency Performance • Slim BGA Package • 1% Resistor Tolerance • Low Channel Capacitance Description This SSTL-2 termination network provides high

A6278

Abstract: A6279 A6279EETTR-T A6279ELPTR-T Direct Replacement allegro
Contextual Info: A6278 and A6279 Serial-Input Constant-Current Latched LED Drivers with Open LED Detection Features and Benefits Description ▪ ▪ ▪ ▪ ▪ ▪ ▪ ▪ ▪ The A6278 and A6279 devices are specifically designed for LED display applications. Each of these BiCMOS devices

A6278EAT

Abstract: a6278elwt
Contextual Info: A6278 and A6279 Serial-Input Constant-Current Latched LED Drivers with Open LED Detection Features and Benefits Description ▪ ▪ ▪ ▪ ▪ ▪ ▪ ▪ ▪ The A6278 and A6279 devices are specifically designed for LED display applications. Each of these BiCMOS devices

A6278

Abstract: A6279 A6279EETTR-T A6279ELPTR-T
Contextual Info: A6278 and A6279 Serial-Input Constant-Current Latched LED Drivers with Open LED Detection Features and Benefits Description ▪ ▪ ▪ ▪ ▪ ▪ ▪ ▪ ▪ The A6278 and A6279 devices are specifically designed for LED display applications. Each of these BiCMOS devices

A6279EA-T

Abstract: A6279ELPTR-T A6279ELWTR-T A6278 A6278EA-T A6278ELPTR-T A6278ELWTR-T A6279
Contextual Info: A6278 and A6279 Serial-Input Constant-Current Latched LED Drivers with Open LED Detection Features and Benefits Description ▪ ▪ ▪ ▪ ▪ ▪ ▪ ▪ ▪ The A6278 and A6279 devices are specifically designed for LED display applications. Each of these BiCMOS devices

IPC-SM-782

Abstract: IPCSM-782 IPC-782 IPC782 SOJ 44 PCB land MELF "Land Pattern" land pattern for TSOP J-Lead, QFP ceramic
Contextual Info: Number One Systems IPC-SM-782 Library Supplementary Surface Mount Library for Easy-PC For Windows IPC-SM-782 Library The optional IPCSM-782 library contains supplementary component IPC782.CML and PCB symbol (IPC782.PSL) libraries for use with any variant of Easy-PC For Windows,

qfn 3x3 tray dimension

Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the

Contextual Info: Si844x/5x QSOP F O UR A N D F IVE - C HANNEL D IGITAL I SOLA TORS Features  High-speed operation  Up to 1000 VRMS isolation DC  Precise timing typical to 150 Mbps  No start-up initialization required  Wide Operating Supply Voltage: 2.70–5.5 V

28F160

Abstract: 28F160B3 BGA thermal resistance 6x8 intel 28f160 s5 SOP JEDEC tray A576 ubga package BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS TRANSPORT MEDIA AND PACKING
Contextual Info: The Micro Ball Grid Array µBGA* Package 15.1 15 Introduction The Micro Ball Grid Array package (µBGA*) is considered a “chip size” package (CSP). A chip size package is generally defined as a package which does not exceed the die size by greater than

BFG95

Contextual Info: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL