land pattern for SSOP
Abstract: TSOP 86 land pattern land pattern for SOP land pattern for TSOP TSOP 48 Pattern land pattern PQFP 208 land pattern for TSOP 2 86 tip 3035 land pattern PQFP 132 land pattern PQFP 100
Contextual Info: Land Pattern Recommendations The following land pattern recommendations are provided as guidelines for board layout and assembly purposes. These recommendations cover the following National Semiconductor packages: PLCC, PQFP, SOP, SSOP and TSOP. For SOT-23 5-Lead and TO-263 (3- or 5-Lead) packages, refer to land patterns shown in the Physical Dimensions for
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ot-23o-263ma05ams011811-1+10land pattern for ssoptsop 86 land patternland pattern for sopland pattern for tsoptsop 48 patternland pattern pqfp 208land pattern for tsop 2 86tip 3035land pattern pqfp 132land pattern pqfp 100
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land pattern for TSOP
Abstract: TSOP 86 land pattern land pattern for SOP land pattern PQFP 208 land pattern for TSOP 2 86 MA05A land pattern for TSOP 2 land pattern for SSOP land pattern PQFP 100
Contextual Info: Land Pattern Recommendations The following land pattern recommendations are provided as guidelines for board layout and assembly purposes. These recommendations cover the following National Semiconductor packages: PLCC, PQFP, SOP, SSOP and TSOP. For SOT-23 5-Lead and TO-263 (3- or 5-Lead) packages,
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ot-23o-263ma05aland pattern for tsop+7tsop 86 land patternland pattern for sopland pattern pqfp 208land pattern for tsop 2 86land pattern for tsop 2land pattern for ssopland pattern pqfp 100
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TSSOP 8PIN MARK 21
Abstract: land pattern for TSsOP 16 6pin land pattern for TSsOP 8 2952 8pin HA005-A-P
Contextual Info: CMOS IC PACKAGES Package Type DIP/TO Gull-wing Flat-lead WLP *1 Pin Count 3 8 4 5 3 5 6 3 5 8 14 8 10 8 16 24 8 5 6 8 8 10 6 4 6 8 4 5 6 8 Package Name TO-92 8-Pin DIP SC-82AB SC-88A SOT-23-3 SOT-23-5 SOT-23-6 SOT-89-3 SOT-89-5 8-Pin SOP JEDEC 14-Pin SOP
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sc-82absc-88aot-23-3ot-23-5+12ot-23-6ot-89-3ot-89-514-pin10-pin16-pintssop 8pin mark 21land pattern for tssop 166pinland pattern for tssop 82952 8pinha005-a-p
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PA-DSO-1403
Abstract: PA-DSO-4406 PA-SOF-D310-20/6 PA-SOF-D310-16/6 PA-SOF-D420-14/6 PA-SOF-D310-18/6 PA-SOF-D310-14/6 PA-SOF-D250-08/6 PA-SOF-D250-14/6 PA-SOF-D250-16/6
Contextual Info: DIP to SO-Plug Prototyping Adapter Kits These adapters will convert a small outline land pattern to a DIP package. The adapter provides a solder down SOplug on the bottom and a detachable 300 or 600 mil wide open-frame DIP socket on the top. They are also available
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pa-sof-d420-14/6pa-sof-d420-16/6pa-sof-d420-18/6pa-sof-d420-20/6+15pa-sof-d420-24/6pa-sof-d420-28/6pa-sof-d470-14/6pa-sof-d470-16/6pa-sof-d470-18/6pa-sof-d470-20/6pa-dso-1403pa-dso-4406pa-sof-d310-20/6pa-sof-d310-16/6pa-sof-d310-18/6pa-sof-d310-14/6pa-sof-d250-08/6pa-sof-d250-14/6pa-sof-d250-16/6
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7402
Abstract: ED-7402 land pattern for SOP DATA SHEET 7402 ED-7402-1 datasheet 7402 7402 data sheet
Contextual Info: SOP LAND PATTERN DIMENSIONS e1 e1 I2 α L β1 β2 b b2 Dimension Parameter e 1.27 α β1 β2 γ 0.20 0.50 0.20 0.30 b2 e E I2 I2 L+ β 1 + β 2 b b2 e − γ Unit : mm Remark Washability of the printed-circuit board Soldering strength Pattern accuracy of the solder mask and visual inspection soldering.
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ed-7402-17402ed-7402land pattern for sop+3data sheet 7402datasheet 74027402 data sheet
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IPC-7351A
Abstract: MiniMELF land pattern land pattern for TSsOP 16 land pattern for TSSOP sot89 land pattern PowerDI3333-8 SOD-323 land pattern y1 SOT23 DFN2020 SOD523 land pattern
Contextual Info: SUGGESTED PAD LAYOUT Based on IPC-7351A DFN1006-2 / DFN1006H4-2 / MiniMELF / MELF / SOD-323 / SOD-123 / SOD-523 / SMA / SMB / SMC C X G Y Z Dimensions Z G X Y C DFN1006-2 / MiniMELF DFN1006H4-2 1.1 4.7 0.3 2.1 0.7 1.7 0.4 1.3 0.7 3.5 MELF SOD-123 SOD-323 SOD-523
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ipc-7351adfn1006-2dfn1006h4-2od-323+11od-123od-523minimelf land patternland pattern for tssop 16land pattern for tssopsot89 land patternpowerdi3333-8sod-323 land patterny1 sot23dfn2020sod523 land pattern
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SOT-563 SOT-666
Abstract: SOD523 land pattern IPC-7351A IPC SOD 323F SOT-95 SOD-323 land pattern SOT-353 G5 Y3 SOT23 DFN1006-3 DFN1006H4-2
Contextual Info: SUGGESTED PAD LAYOUT Based on IPC-7351A DFN1006-2 / DFN1006H4-2 / MiniMELF / MELF / SOD-323 / SOD-123 / SOD-523 / SMA / SMB / SMC C X G Y Z Dimensions Z G X Y C DFN1006-2 / MiniMELF DFN1006H4-2 1.1 4.7 0.3 2.1 0.7 1.7 0.4 1.3 0.7 3.5 MELF SOD-123 SOD-323 SOD-523
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ipc-7351adfn1006-2dfn1006h4-2od-323+10od-123od-523sot-563 sot-666sod523 land patternipc sod 323fsot-95sod-323 land patternsot-353 g5y3 sot23dfn1006-3
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IPC-7351A
Abstract: AP02001 DFN1616-8 DFN2018-6 ipc SMB SMC MELF pad layout MiniMELF land pattern MELF "Land Pattern" DFN1411-3 land pattern for SOP
Contextual Info: Suggested Pad Layout Based on IPC-7351A Figure 1 Dimensions DFN1006-2 MiniMELF MELF SOD-323 SOD-123 SOD-523 SMA SMB SMC 9.3 Z 1.1 4.8 6.3 3.75 4.9 2.3 6.5 6.7 G 0.3 2.1 3.3 1.05 2.5 1.1 1.5 1.8 4.4 X 0.7 1.7 2.7 0.65 0.7 0.8 1.7 2.3 3.3 Y 0.4 1.3 1.5 1.35
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ipc-7351adfn1006-2od-323od-123+13od-523dfn1006-3dfn1310h4-6dfn1612-6ap02001dfn1616-8dfn2018-6ipc smb smcmelf pad layoutminimelf land patternmelf "land patterndfn1411-3land pattern for sop
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Y1 SOT-23
Abstract: MELF pad layout DFN2020-3 ipc SMB SMC land pattern for TSsOP 16 IPC-7351A SOT-353 G5 SOD-323 land pattern SOD523 land pattern land pattern for msOP 8
Contextual Info: SUGGESTED PAD LAYOUT Based on IPC-7351A DFN1006-2 / DFN1006H4-2 / MiniMELF / MELF / SOD-323 / SOD-123 / SOD-523 / SMA / SMB / SMC C X G Y Z Dimensions Z G X Y C DFN1006-2 / MiniMELF DFN1006H4-2 1.1 4.7 0.3 2.1 0.7 1.7 0.4 1.3 0.7 3.5 MELF SOD-123 SOD-323 SOD-523
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ipc-7351adfn1006-2dfn1006h4-2od-323+11od-123od-523y1 sot-23melf pad layoutdfn2020-3ipc smb smcland pattern for tssop 16sot-353 g5sod-323 land patternsod523 land patternland pattern for msop 8
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IPC-7527
Abstract: PCB design for 0.2mm pitch csp package IPC7527 tssop 16 exposed pad stencil metcal VPI-1000 qfn 44 PACKAGE footprint 7x7 DIe Size qfn 48 7x7 stencil QFN 16 CARSEM package outline QFN 8 CARSEM APR-5000
Contextual Info: MLP Application Note APPLICATION NOTE Comprehensive User’s Guide April 2002 April 2002 Cover Page Page MLP Application Note CONTENTS 1.0 1.1 THE CARSEM MICRO LEADFRAME PACKAGE MLP Introduction 2.0 2.1 MANUFACTURING CONSIDERATIONS SMT Process 3.0 3.1 3.2
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ipc-7527pcb design for 0.2mm pitch csp packageipc7527tssop 16 exposed pad stencil+6metcal vpi-1000qfn 44 package footprint 7x7 die sizeqfn 48 7x7 stencilqfn 16 carsem package outlineqfn 8 carsemapr-5000
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CPC1225N
Abstract: cpc1002 CPC1004N LCA715 "pin compatible" CPC1017N CPC1025N cpc1008 CPC1018N CPC1030N CPC1035N
Contextual Info: Single Pole Normally Open: 1-Form-A CPC1008N 100 150 8 1500 2 1 2/0.5 4 Pin SOP CPC1016N 100 100 16 1500 2 1 2/0.5 4 Pin SOP CPC1017N 1500 1 1 10/10 4 Pin SOP 60 100 16 CPC1018N 60 600 0.8 1500 1 1 3/2 4 Pin SOP CPC1025N 400 120 30 1500 2 1 2/1 4 Pin SOP CPC1030N
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cpc1008ncpc1016ncpc1017ncpc1018n+10cpc1025ncpc1030ncpc1035ncpc1225ncpc1230ncpc1330cpc1002cpc1004nlca715 "pin compatiblecpc1008
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SOP20 Package
Abstract: SOP20 20 pin Package PSOP-20
Contextual Info: 20-Pin Small Outline Package SOP20 Package Outline Dimensions Outline Dimensions 1.27 0.43 +0.07 –0.04 0 ～10゜ 0.8 ±0.2 0.25 M 13.3 max 0.1 Land Pattern Example Enlarged view of A A 0.1 +0.1 –0.05 1.5 ±0.2 12.8 ±0.2 1.9 max 0.685 typ. 0.25 10 +0.075
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20-pinsop20 packagesop20 20 pin packagepsop-20 |
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SOP16 Package
Abstract: sop16
Contextual Info: 16-Pin Small Outline Package SOP16 Package Outline Dimensions Outline Dimensions Unit: mm 1.27 8 0.43 +0.07 –0.04 10.8 max 0.1 Land Pattern Example 0.25 +0.075 0 ～10゜ 0.8 ±0.2 0.25 M Enlarged view of A A 0.1 +0.1 –0.05 1.5 ±0.2 10.3 ±0.2 1.9 max
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sop8 Package dimension
Abstract: weight of SOP package land pattern for SOP land pattern SOP SOP8 Package TOSHIBA Package
Contextual Info: 8-pin Small Outline Package SOP-8 Package Outline Dimensions Outline Dimensions Unit: mm 0.4 ±0.1 0.25 M 5.5 max 5.0 ±0.2 1.5 ±0.2 0.15 +0.1 –0.05 0.1 Land Pattern Example +0.1 0.595 typ. 4 1.27 1.27 1.27 0.1 –0.05 1 0.5 ±0.2 4.4 ±0.2 6.0 ±0.3 5
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sop8 package dimensionweight of sop packageland pattern for sopland pattern sop+2sop8 packagetoshiba package
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land pattern for SOP
Contextual Info: 8-pin Small Outline Advance Package SOP Advance Package Outline Dimensions Outline Dimensions 0.166 ±0.05 0.15 ±0.05 5.0 ±0.2 A 4 1 3.5 ±0.2 8 1.1 ±0.2 Bottom view 0.95 ±0.05 5.0 ±0.2 4 1.27 1.27 1.27 0.5 ±0.1 1 5 6.0 ±0.3 5 8 0.595 4.25 ±0.2 0.05 M A
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apx339
Abstract: APX393 TSSOP-14L
Contextual Info: APX393/APX339 LOW VOLTAGE RAIL-TO-RAIL INPUT DUAL/QUAD COMPARATORS General Description Features • • • • • • • • The APX393/339 are low voltage 2.5V to 5.5V dual and quad comparators. The APX393 is the dual version available in the 8-pin SOP and MSOP packages. The APX339 is the quad
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apx393/apx339apx393/339apx393apx339+314-pinfebruary2008tssop-14l
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D560 transistor
Abstract: 40 pin zif socket 20 pin zif socket 2003Z d560 D420 ZIF socket 16 pin dip zif socket PA-SOF-D420-28 zif 40 pin socket
Contextual Info: DIP to SO-Plug Prototyping Adapters DIP to SO-Plug Prototyping Adapters Simplify prototyping and testing Use actual size prototype boards Great for microcontrollers and EE/Flash memory testing Simple design is easy to use These plugs and socket boards are simple and easy to use following
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d560 transistor40 pin zif socket20 pin zif socket2003z+6d560d420zif socket16 pin dip zif socketpa-sof-d420-28zif 40 pin socket
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240817
Abstract: SURFACE MOUNT TECHNOLOGY
Contextual Info: 7 Surface Mount Technology SMT 7.1 Introduction Traditional through-hole methods of assembling conventional electronic assemblies reached their limits in terms of improvements in cost, weight, volume, and reliability at approximately 68L. SMT allows production of more reliable assemblies at increased board density, reduced weight,
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240817surface mount technology |
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pick and place robot
Abstract: programming smt machine .65mm bga land pattern land pattern for SOP A5666-02 2000 Packaging SURFACE MOUNT TECHNOLOGY
Contextual Info: Leaded Surface Mount Technology SMT 7.1 7 Introduction Traditional through-hole Dual In-Line Package assemblies reached their limits in terms of improvements in cost, weight, volume, and reliability at approximately 68L. SMT allows production of more reliable assemblies with higher I/O, increased board density, and reduced
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pick and place robotprogramming smt machine65mm bga land patternland pattern for sop+3a5666-022000 packagingsurface mount technology
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1.27mm pitch zif socket 3M 21X21
Abstract: 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432
Contextual Info: Ironwood Electronics SK.1 Sockets and Receptacles Ironwood offers the industry's widest array of high quality sockets and receptacles for BGA, MGA, PGA, QIP, and QFP packages. We also offer parts that provide sockets for in-circuit emulators. • • • •
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sk-mgaxx/xxxx-03sk-mgaxx/xxxx-01sk-mgaxx/xxxx-02mga10/100a-+101.27mm pitch zif socket 3m 21x211155 lga socket pins17x17* bga 2891155 lga socketpga zif socket 289amp bga 25x25bga169ctextool 15x15 pgaam29040bga432
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programming smt machine
Abstract: pick and place robot tank water level control A5668-01 SURFACE MOUNT RESISTOR SMT Process application 741 heat exchanger wired pick and place robot water pumping machine control schematic
Contextual Info: Leaded Surface Mount Technology SMT 7.1 7 Introduction Traditional through-hole Dual In-Line Package assemblies reached their limits in terms of improvements in cost, weight, volume, and reliability at approximately 68L. SMT allows production of more reliable assemblies at increased board density, reduced weight, volume, and
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programming smt machinepick and place robottank water level controla5668-01+6surface mount resistorsmt processapplication 741heat exchangerwired pick and place robotwater pumping machine control schematic
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pick and place robot
Abstract: application of pick place robot qfp 0.4mm land pattern QFP 208 pick and place robot used for circuit assembling Surface mount SMA connector land pattern QFP 132 qfp 32 land pattern wired pick and place robot 300C
Contextual Info: CHAPTER 7 SURFACE MOUNT TECHNOLOGY INTRODUCTION Traditional through-hole methods of assembling conventional electronic assemblies reached their limits in terms of improvements in cost weight volume and reliability at approximately 68L SMT allows production of more reliable assemblies at increased board density reduced
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ipc-sm-782pick and place robotapplication of pick place robotqfp 0.4mm+7land pattern qfp 208pick and place robot used for circuit assemblingsurface mount sma connectorland pattern qfp 132qfp 32 land patternwired pick and place robot300c
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land pattern for sot109-1
Abstract: TSSOP-8 footprint and soldering sot-23 SOD87 footprint
Contextual Info: Packages Package cross reference 88 Packing methods 90 Minimized outline drawings and reflow soldering footprint 96 Package overview 86 107 87 Package cross reference Package cross reference 88 types in bold represent new products types in bold represent new products
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do-35do-41do-34od80c+6od123fhxson12ot983land pattern for sot109-1tssop-8 footprint and soldering sot-23sod87 footprint
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pick and place robot
Abstract: land pattern QFP 208 programming smt machine pick and place robot used for circuit assembling Surface mount SMA connector 300C IPC-SM-782 OMEGA P-M edge mount sma footprint SURFACE MOUNT TECHNOLOGY
Contextual Info: 2 7 Surface Mount Technology 1/16/97 5:04 PM CH07WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 7 SURFACE MOUNT TECHNOLOGY 7.1. INTRODUCTION Traditional through-hole methods of assembling conventional electronic assemblies reached their limits in terms of improvements in cost, weight, volume, and reliability at approximately
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ch07wippick and place robotland pattern qfp 208programming smt machine+7pick and place robot used for circuit assemblingsurface mount sma connector300cipc-sm-782omega p-medge mount sma footprintsurface mount technology
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