LAND PATTERN FOR SOIC 16 Search Results

max232 free

Abstract: MAX249 AUO-M201.1F pdf MAX222CPN 90-0108 MAX232EJE 8 PIN Plastic DIP land pattern max233acw
Contextual Info: 19-4323; Rev 15; 1/06 +5V-Powered, Multichannel RS-232 Drivers/Receivers Next-Generation Device Features The MAX220–MAX249 family of line drivers/receivers is intended for all EIA/TIA-232E and V.28/V.24 communications interfaces, particularly applications where ±12V is

200123K

Abstract: QFN 88 land pattern LGA-28 land pattern SOIC 8 pcb pattern
Contextual Info: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages Introduction Surface Mount Guidelines for Leadless Packages This Application Note provides sample PCB land pattern dimensions for a variety of leaded and leadless packages. These

si8540

Abstract: IA2410 sot-23 MARKING CODE G1 marking 611 mark G1 SOT-23
Contextual Info: Si8540 H I G H - S ID E C URRENT S ENSE A MPLIFIER Features  Complete, unidirectional high-side current sense capability  0.2% full-scale accuracy  +5 to +36 V supply operation  85 dB power supply rejection  90 µA max supply current 9 µA shutdown current

D8025

Abstract: SC1302A SC1302B SC1302C
Contextual Info: SC1302A/B/C/D/E/F Dual High Speed Low-Side MOSFET Driver POWER MANAGEMENT Description Features ‹ +4.5V to +16.5V operation ‹ Fast rise and fall times 20ns typical with 1000pf load ‹ Dual MOSFET driver ‹ 2A peak drive current ‹ 40ns propagation delay

land pattern for TSsOP 16

Abstract: 8 PIN Plastic DIP land pattern maxim 1584 land pattern for TSSOP 24 pin land pattern for TSSOP land pattern for SOIC 16
Contextual Info: 19-1539; Rev 0; 2/00 High-Speed, Single-Supply, Quad, SPST Analog Switches Features Applications Test Equipment Sample-and-Hold Circuits Disk Drives Guidance and Control Systems Tape Drives Military Radios Audio and Video Communications Systems Switching PBX, PABX

qfn 32 land pattern

Abstract: hermetic packages PCB land IPC 1725 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP land pattern for TSSOP 24 pin 16 soic pcb footprint QFN-20 reflow IPC-SM-782
Contextual Info: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and

Contextual Info: SC1302A/B/C/D/E/F Dual High Speed Low-Side MOSFET Driver POWER MANAGEMENT Description Features ‹ +4.5V to +16.5V operation ‹ Fast rise and fall times 20ns typical with 1000pf load ‹ Dual MOSFET driver ‹ 2A peak drive current ‹ 40ns propagation delay

Contextual Info: SC1302A/B/C/D/E/F Dual High Speed Low-Side MOSFET Driver POWER MANAGEMENT Description Features ‹ +4.5V to +16.5V operation ‹ Fast rise and fall times 20ns typical with 1000pf load ‹ Dual MOSFET driver ‹ 2A peak drive current ‹ 40ns propagation delay

SOIC127P1032X265-16AN

Contextual Info: Si860x B IDIRECTIONAL I 2 C I SOLA TORS WITH U NIDIRECTIONAL D IGITA L C HANNELS Features  Independent, bidirectional SDA and SCL isolation channels Open drain outputs with 35 mA sink current  High electromagnetic immunity  Wide operating supply voltage

SC1302E equivalent

Contextual Info: SC1302A/B/C/D/E/F Dual High Speed Low-Side MOSFET Driver POWER MANAGEMENT Description Features ‹ +4.5V to +16.5V operation ‹ Fast rise and fall times 20ns typical with 1000pf load ‹ Dual MOSFET driver ‹ 2A peak drive current ‹ 40ns propagation delay

SOD-323 land pattern

Abstract: SOIC 8 pcb pattern land pattern for SSOP tssop 16 exposed pad stencil land pattern for TSsOP 16 LPCC-16 16 soic pcb footprint land pattern for TSSOP qfn 32 land pattern qfn 28 land pattern
Contextual Info: Application Note Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and

HPCL-3120

Abstract: HPCL3120 A 3120 opto HPCL 3120 SOIC127P1032X265-16AN 3120 8 pin optocoupler A 3120 opto coupler opto cross reference avago si8220bb-a-is 60601-1
Contextual Info: S i 8 2 2 0/21 0 . 5 A N D 2 . 5 A M P I S O D R I VE R S W I T H O P T O I N P U T 2.5, 3.75, AND 5.0 KV RMS Features  Functional upgrade for HCPL-0302, HCPL-3120, TLP350, and similar opto-drivers  60 ns propagation delay max (independent of input drive current)

Contextual Info: S i 8 7 1 x/2x 5 K V L E D E MU LAT OR I NPUT , L O G I C O UTPUT I SOLATORS Features  High Speed: dc to 15 Mbps   2.5 to 5.5 V logic output  Pin-compatible, drop-in upgrades for popular high-speed digital  optocouplers   Performance and reliability

Contextual Info: S i 8 2 2 0/21 0 . 5 A N D 2 . 5 A M P I S O D R I VE R S W I T H O P T O I N P U T 2.5, 3.75, AND 5.0 KV RMS Features  Functional upgrade for HCPL-0302, HCPL-3120, TLP350, and similar opto-drivers  60 ns propagation delay max (independent of input drive current)

si87xx

Contextual Info: Si87xx 5 K V LED E MULATOR I N PU T , O PEN C OLLECTOR O UTPUT I SOLA TORS Features  Pin-compatible, drop-in upgrades for  popular high-speed digital  optocouplers   Performance and reliability  advantages vs. optocouplers Resistant to temperature, age and 

Contextual Info: S i 8 7 1 x/2x 5 K V L E D E MU LAT OR I NPUT , L O G I C O UTPUT I SOLATORS Features  High Speed: dc to 15 Mbps   2.5 to 5.5 V logic output  Pin-compatible, drop-in upgrades for popular high-speed digital  optocouplers   Performance and reliability

Si8640BB

Contextual Info: Si8640/41/42/45 L O W - P OWER Q UAD - C HANNEL D IGITAL I SOLATOR Features  High-speed operation DC to 150 Mbps  No start-up initialization required  Wide Operating Supply Voltage 2.5–5.5 V  Up to 5000 VRMS isolation   

LGA land pattern

Abstract: SI8233AB-C-IS1 LH2015 SI8235BB-C-IS1 LGA-14 si8233 Si8232 SOIC-16 SI8233AD-C-IS si8235
Contextual Info: Si823x 0 . 5 AND 4 . 0 A MP I S O D R I V E R S 2.5 AND 5 K V RMS Features  Two completely isolated drivers  60 ns propagation delay (max) in one package  Independent HS and LS inputs or Up to 5 kVRMS input-to-output PWM input versions isolation

WBSOIC-16

Abstract: LGA land pattern SI8233BD-C-IS SI823 Si8233 mosfet igbt drivers theory si8235 Si823x Si8233BB-C-IS SI8234-B-IS
Contextual Info: Si823x 0 . 5 AND 4 . 0 A MP I S O D R I V E R S 2.5 AND 5 K V RMS Features Pin Assignments       Two completely isolated drivers  Independent HS and LS inputs or in one package PWM input versions Up to 5 kVRMS input-to-output

RxBN

Contextual Info: RF6535 3.0V TO 4.2V, 2.4GHz FRONT END MODULE Features      TX Output Power: 23dBm TX Gain: 28dB RX Gain: 11.5dB RX NF: 3dB Integrated LNA TXCT GND VCC_BAIS VCC NC Package Style: QFN, 20-Pin, 3.5mmx3.5mmx0.5mm 15 14 13 12 11 TXN 16 10 VCC TXP

Contextual Info: RF6535 3.0V TO 4.2V, 2.4GHz FRONT END MODULE Features      TX Output Power: 23dBm TX Gain: 28dB RX Gain: 11.5dB RX NF: 3dB Integrated LNA TXCT GND VCC_BAIS VCC NC Package Style: QFN, 20-Pin, 3.5mmx3.5mmx0.5mm 15 14 13 12 11 TXN 16 10 VCC TXP

RF65

Abstract: 1F CAPACITOR
Contextual Info: RF6535 3.0V to 4.2V, 2.4GHz Front End Module Features      TX Output Power: 23dBm TX Gain: 28dB RX Gain: 11.5dB RX NF: 3dB Integrated LNA TXCT GND VCC_BAIS VCC NC Package Style: QFN, 20-Pin, 3.5mm x 3.5mm x 0.5mm 15 14 13 12 11 TXN 16 10 VCC

RF6535

Contextual Info: RF6535 3.3V, 2.4GHz FRONT END MODULE Package Style: QFN, 20-Pin, 3.5mmx3.5mmx0.5mm  Applications   ZigBee 802.15.4 Based Systems for Remote Monitoring and Control WiFi 802.11b/g VCC_BAIS VCC NC 13 12 11 TXN 16 10 VCC TXP 17 9 GND RXCT 18 8 ANT1

LPCC-16

Abstract: recommended land pattern for soic qfn 32 land pattern LPCC16 ipc-SM-782 narrow body SOIC 8 pcb pattern Discrete Semiconductors qfn32 land pattern SOIC 8 pcb pattern SOIC 8 narrow body pcb pattern
Contextual Info: GaAs RFICs and Modules Footprints Surface Mount Land Patterns Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and Packaging Electronic Circuits surface mount design and land pattern standard: IPC-SM-782.