LAIRD THERMAL GREASE Search Results

Waveguide Gaskets

Abstract: MIL-DTL-85328 WR137 gasket dimensions M83528 001 Waveguide Gaskets WR187 ZZ-R-765 CLASS 2B, GRADE 50 SHELF LIFE m83528 MIL-DTL-83528C WR340 waveguide fluorosilicone curing
Contextual Info: Elastomeric EMI Shielding Solutions www.lairdtech.com Innovative Technology for a Connected World ANTENNAS & RECEPTION WIRELESS REMOTE CONTROL EMI SOLUTIONS THERMAL MANAGEMENT WIRELESS M2M & TELEMATICS ABOUT LAIRD TECHNOLOGIES Laird Technologies designs and manufactures customized, performance-critical

diamond antenna

Abstract: T-Flex 200 CP177 Tgon T-gon 22 CP230 K177 K228 K200 FSF52
Contextual Info: THERMAL_SHORTFORM3 14/12/05 4:52 pm Page 1 global solutions : local support Laird Technologies is the world’s leading designer and manufacturer of electromagnetic interference [EMI] shielding materials, thermal interface products, and wireless antenna

Laird thermal grease

Abstract: viscometer
Contextual Info: TgreaseTM 2500 Series Thermal Grease Innovative Technology for a Connected World ENVIRONMENTALLY FRIENDLY THERMALLY CONDUCTIVE GREASE Tgrease 2500 is a silicone-free thermal grease for use in high performance CPU’s and GPU’s. With a high thermal conductivity of 3.8 W/mK, Tgrease™ 2500 thoroughly wets

TGREASE-980

Contextual Info: TgreaseTM 980 Thermal Grease Innovative Technology for a Connected World ENVIRONMENTALLY FRIENDLY THERMALLY CONDUCTIVE GREASE Tgrease 980 is a silicone-based thermal grease for use in high performance CPUs and GPUs. Tgrease 980 has a high thermal conductivity of 3.8 W/mK and superior wetting characteristics, resulting in a very low thermal resistance and excellent long term reliability.

Laird thermal grease

Abstract: viscometer D257 transistors IGBT A15296-00
Contextual Info: TgreaseTM 880 Series Thermal Grease Innovative Technology for a Connected World ENVIRONMENTALLY FRIENDLY THERMALLY CONDUCTIVE GREASE TgreaseTM 880 is a silicone based, high performance thermal grease designed to meet the thermal, reliability and price requirements of high end CPUs, GPUs and custom ASICS chips.

D150

Abstract: D257 E595 ASTM D5470 igbt to220
Contextual Info: TgreaseTM 1500 Series Thermal Grease Innovative Technology for a Connected World TgreaseTM 1500 SERIES SOLVES OVERHEATING AND RELIABILITY ISSUES TgreaseTM 1500 is environmentally safe silicone-based thermal grease designed to solve overheating and reliability issues.

Contextual Info: TpcmTM 580SP Series Screen Printable Phase Change Material Preliminary Innovative Technology for a Connected World HIGH-PERFORMANCE SCREEN PRINTABLE PHASE CHANGE MATERIAL Tpcm 580SP is an exceptionally high-performance, screen printable or stencilable thermal interface material TIM which proves to be a great alternative to grease.

ASTM D5470

Abstract: a1371 Tputty
Contextual Info: TputtyTM 504 Series Innovative Technology for a Connected World SOFT, SILICONE GEL Tputty 504 is a soft silicone gel thermal gap filler ideal for applications where large gap tolerances are present. The silicone gel is filled with a complex matrix of ceramic fillers to yield superior thermal performance.

FSF52

Contextual Info: TpcmTM FSF-52 Innovative Technology for a Connected World Tpcm FSF-52 Tpcm™ FSF-52 is a free standing film. It contains no substrate. At temperatures greater than 52°C, Tpcm™ FSF-52 changes into a molten state and, under low closure force, wets the heat sink and component surfaces to create a very thin, low thermal resistance

Contextual Info: TputtyTM 506 Series Gap Filler Material Innovative Technology for a Connected World SOFT, SILICONE PUTTY Tputty 506 is a soft, single part, silicone putty thermal gap filler in which no cure is required. This gap filler is ideal for applications where large gap tolerances are present and in which traditional gap filler

Contextual Info: TputtyTM 504 Series Innovative Technology for a Connected World Soft, Silicone Gel Tputty 504 is a soft silicone gel thermal gap filler ideal for applications where large gap tolerances are present. The silicone gel is filled with a complex matrix of ceramic fillers to yield superior thermal performance.

Contextual Info: DA Tunnel Series, DA-011-05-02 Thermoelectric Assembly Innovative Technology for a Connected World Tunnel series Direct-to-air thermoelectric assembly The DA Tunnel Series is a Direct-to-Air thermoelectric assembly TEA that minimizes the number of airflow paths required to operate. It offers dependable, compact performance

THR-DS-DA-025-24-02

Contextual Info: DA Tunnel Series, DA-025-24-02 Thermoelectric Assembly Innovative Technology for a Connected World Tunnel series Direct-to-air thermoelectric assembly The DA Tunnel Series is a Direct-to-Air thermoelectric assembly TEA that minimizes the number of airflow paths required to operate. It offers dependable, compact performance

Contextual Info: DA Tunnel Series, DA-039-12-02 Thermoelectric Assembly Innovative Technology for a Connected World Tunnel series Direct-to-air thermoelectric assembly The DA Tunnel Series is a Direct-to-Air thermoelectric assembly TEA that minimizes the number of airflow paths required to operate. It offers dependable, compact performance

Contextual Info: DA PowerCool Series, DA-034-24-02 Thermoelectric Assembly Innovative Technology for a Connected World PowerCool series Direct-to-air thermoelectric assembly The DA PowerCool Series is a Direct-to-Air thermoelectric assembly TEA that uses impingement flow to transfer heat. It offers dependable, compact performance by

KS-886H

Abstract: Kostat tray
Contextual Info: Thermal Management and Mechanical Handling for Altera TCFCBGA Devices AN-657-1.1 Application Note This application note describes the thermal composite flip chip ball-grid array TCFCBGA package for the Arria V device family. TCFCBGA improves board real-estate use by allowing closer spacing between passive

FC-BGA

Abstract: T0812012 daewon tray
Contextual Info: Thermal Management and Mechanical Handling for Lidless Flip Chip Ball-Grid Array AN-659-1.0 Application Note This application note provides guidance on thermal management and mechanical handling of lidless flip chip ball-grid array FCBGA for Altera devices.

Contextual Info: EMI CATALOG www.lairdtech.com ABOUT LAIRD TECHNOLOGIES Laird Technologies designs and manufactures customized, performance-critical products for wireless and other advanced electronics applications. The company is a global market leader in the design and supply of electromagnetic

M83528/002D-017

Contextual Info: EMI CATALOG www.lairdtech.com ABOUT LAIRD Laird is a global technology business focused on enabling wireless communication and smart systems, and providing components and systems that protect electronics. Laird operates through two divisions, Wireless Systems and

Contextual Info: global solutions : local support |FINGERSTOCK, GASKETS AND METAL GROUNDING PRODUCTS engineered emi, antenna and thermal applications BERYLLIUM COPPER SOLUTIONS AND BEYOND. Beryllium copper has remarkable stability, superior tensile strength, impressive thermal and electrical conductivity, and high shielding

Contextual Info: Laird Technologies Web site: www.LairdTech.com Item # AL-52 /, Tpcm AL-52 Phase Change Material Tpcm™ AL-52 Phase Change Material Tpcm™ Al-52 is a thermally conductive phase change material coated on both side of aluminum foil. At temperature greater than 52°C, Tpcm™ Al-52 changes into a molten state and, Under low closure force, wets the heat sink and

microwave products

Abstract: 97-438 ASTM B488 9752 BMIC-004 electromechanical catalog coldrol 77079 semi catalog 77057
Contextual Info: LT-3034 Metals_catalog 10/8/04 10:29 AM Page 1 FINGERSTOCK, GASKETS AND METAL GROUNDING PRODUCTS LT-3034 Metals_catalog 10/8/04 10:29 AM Page 2 BERYLLIUM COPPER SOLUTIONS AND BEYOND. Beryllium copper has remarkable stability, superior tensile strength, impressive thermal and electrical conductivity, and high shielding

datasheet of Z40-12.7B heat sink

Abstract: UB35-25B Chomerics of Z40-12.7B heat sink Z3512 EP2S15 JESD51-9 T412 laird gasket JESD51-X
Contextual Info: Thermal Management for FPGAs December 2009 AN-358-2.0 Introduction As IC process geometries shrink and FPGA densities increase, managing power becomes increasingly difficult. The dilemma for design groups is how to fit in all the functions the market demands without exceeding power budgets. Although power

Loctite 3873

Abstract: T-PCM905C Loctite 3873 rework TPCM585 T-pcm585 datasheet of Z40-12.7B heat sink TPCM905C of Z40-12.7B heat sink Theta JC of FBGA JESD51-X
Contextual Info: Thermal Management for FPGAs Thermal Management for FPGAs AN-358-3.0 Application Note This application note provides guidance on thermal management of Altera devices and helps you determine the thermal performance for your application. The factors you must consider in evaluating heat dissipation include evaluating the