CHOMERICS Search Results

cho-bond 1086

Abstract: cho-bond 1075 Cho-Bond 584-29 cho-bond 1029 584-29 cho-bond primer 1086 RTV silicone viscosity 51-00-1035-0000 50-02-1075-0000 CHO-SEAL 1285
Contextual Info: CONDUCTIVE COMPOUNDS CHO-BOND Conductive Adhesives Single- and two-component epoxy and silicone adhesives, with room temperature, elevated temperature or moisture cure mechanisms. Epoxies for Microelectronics Chomerics’ growing family of conductive epoxies now includes one-part, silver-filled pastes formulated for today’s

1278n

Abstract: S6305 chomerics MIL-G-83528 Cho-Seal 1298 S6305 CHO-SEAL 1215 Cho-Seal s6305 3M Nextel EPDM fungus resistance CEPS-0002
Contextual Info: CONDUCTIVE ELASTOMERS ® CHO-SEAL & CHO-SIL Conductive Elastomers Since 1961, Chomerics has invented and extended virtually every aspect of conductive elastomer materials technology — from the earliest silver and silver/copper filled silicones to the

T410R

Contextual Info: 371824B00034G - heatsinks for BGA Devices Page 1 of 2 Tel toll-free : +1-855-32-AAVID Register Log in Search Home Products Solutions Aavid Design Tools & Docs Contact Company Online Store » BGA Heat Sinks 371824B00034G Need assistance? Call us: 1-855-32-AAVID

SAS 251

Abstract: S6305 14f1 FS1-S01-14C1 SAS Connector pcb layout 19220 port
Contextual Info: 8 7 6 5 3 4 1 2 REVISIONS REV. DESCRIPTION DATE APPROVED ELASTOMERIC GASKET OPTION ADDED SEP 15/09 ZLJ DETAIL J ADDED JAN 14/10 ZLJ ECN V Z F F FS1-S01-1XXX MOUNTING SCREW OPTION 1 = 8 mm MOUNTING SCREW SHIPPED BULK IN SAME TRAYS WITH CAGE ASSEMBLIES 2 = NO MOUNTING SCREW SUPPLIED

250 mhz IBM PowerPC Processor

Abstract: EMPPC740 interface 740 IBM PowerPC 740 reference manual emppc750 IBM PowerPC 250 EMPPC750L
Contextual Info: PowerPC 740TM and PowerPC 750TM Embedded Microprocessor Datasheet IBM CMOS 0.20 µm Copper Technology EMPPC740L and EMPPC750L Version 1.51 7/15/99 IBM Microelectronics Division Notices Before using this information and the product it supports, be sure to read the general information on the

powerpc 750l compatible

Abstract: PowerPC 750 IBM25ppc750L PID8p-750 PID-8p
Contextual Info: PowerPC 750TM SCM RISC Microprocessor for the PID8p-750 Version 2.0 09/30/1999 IBM Microelectronics Division Notices Before using this information and the product it supports, be sure to read the general information on the back cover of this book. Trademarks

M83528

Abstract: WR340 flange dimensions OSD-6411A wr 2300 flange waveguide Waveguide Gaskets 20-03-3731-1212 CMR-137 WR137 gasket dimensions RG-106 wr 2300 waveguide flange
Contextual Info: CONDUCTIVE ELASTOMERS Waveguide Gaskets Waveguide Gaskets CHO-SEAL CHO-SEAL 1212 1239 SPECIFICATIONS Type Ref: MIL-G-83528 Volume Resistivity (ohm-cm, max) as supplied (without pressure-sensitive adhesive) K G 0.005 0.007 Hardness (Shore A ±5) 80 80 Specific Gravity (±0.25)

Contextual Info: Freescale Semiconductor MPC8349EEC Rev. 2, 5/2005 Advance Information MPC8349E PowerQUICC II Pro Integrated Host Processor Hardware Specifications The MPC8349E contains a PowerPC processor core with system logic required for networking, storage, and general-purpose embedded applications. For functional

Contextual Info: Freescale Semiconductor MPC8349EEC Rev. 8, 2/2007 Technical Data MPC8349E PowerQUICC II Pro Integrated Host Processor Hardware Specifications The MPC8349E PowerQUICC™ II Pro is a next generation PowerQUICC II integrated host processor. The MPC8349E contains a PowerPC™ processor core built on Power

Contextual Info: Freescale Semiconductor Technical Data Document Number: MPC8533EEC Rev. 0, 04/2008 MPC8533E PowerQUICC III Integrated Processor Hardware Specifications 1 MPC8533E Overview This section provides a high-level overview of MPC8533E features. Figure 1 shows the major functional units within

Contextual Info: Freescale Semiconductor MPC8347EEC Rev. 2, 5/2005 Advance Information MPC8343E PowerQUICC II Pro Integrated Host Processor Hardware Specifications The MPC8343E contains a PowerPC processor core with system logic required for networking, storage, and general-purpose embedded applications. For functional

Contextual Info: ffc14 ^ Pll rI aa «1 CHAUN-CHOUNG- TECHNOLOGY CORP. U ^ 7 U ^ 7 HEAT PIPE DEPARTMENT J_ NO. 184, CHUNG HSING N. ST., SANCHUNG CITY, TAIPEI, TAIWAN, R.G.C TEL: 886-2-9952666-8 FAX: 886-2-9958258-9 fS □ /b APPROVAL SHEET CCI PART NAME : COST REDUCED BROOKDALE-G WSHS

UX31

Contextual Info: 4 2 3 NOTE: [TjM a rkin g i The Supplier ID format is C C C 2 Y W W . X X X Vendor tracking nunber Work week “the product was nomufactured Year the product was manufactured 2 ] M a r k in g : B B In te l P a r t Number 3, C LIP MUST STAY ATTACHED TD HEATSINK

Contextual Info: IBM PowerPC 750 SCM RISC Microprocessor PID8P-750 Preface The PowerPC PID8p-750 microprocessor is an implementation of the PowerPC family of reduced instruc­ tion set computer RISC microprocessors. In this document, the term “PID8p-750” is used as an abbreviation

flotherm

Abstract: Nippon capacitors
Contextual Info: MPE603E7TEC/D Motorola Order Number 1/1999 REV. 2.0 ª Advance Information EC603e Ô Embedded RISC Microprocessor (PID7t) Hardware SpeciÞcations The EC603e microprocessor from Motorola is an implementation of the PowerPCª family of reduced instruction set computing (RISC) microprocessors. The EC603e

uPD71054

Abstract: PD71054 8259 programmable interval timer
Contextual Info: AIP-8d 8 Channel Analogue Input Board User Manual AIP-8d User Manual Document Part N° Document Reference Document Issue Level 0127-1004.doc AIP-8d\.\0127-1004.doc 2.0 Manual covers PCBs identified AIP-8d Rev. C All rights reserved. No part of this publication may be reproduced, stored in any retrieval system, or

MPC8377

Abstract: mpc8377e MPC8378 mpc8379 MPC8260 MPC8349E MPC8378E PC16450 PC16550 SHA-256
Contextual Info: Freescale Semiconductor Technical Data Document Number: MPC8377EEC Rev. 3, 03/2010 MPC8377E PowerQUICC II Pro Processor Hardware Specifications This document provides an overview of the MPC8377E PowerQUICC II Pro processor features, including a block diagram showing the major functional components. The

PC7448

Abstract: microprocessor DIODE 921 LGA PACKAGE thermal resistance Freescale powerpc 7448
Contextual Info: PC7448 PowerPC 7448 RISC Microprocessor Datasheet Features • • • • • • • • • • • • • • • 3000 Dhrystone 2.1 MIPS at 1.3 GHz Selectable Bus Clock 30 CPU Bus Dividers up to 28x Selectable MPx/60x Interface Voltage (1.5V; 1,8V; 2.5V)

PC8640

Abstract: openpic
Contextual Info: PC8640 and PC8640D Power Architecture Integrated Processor Datasheet - Preliminary Specification Features • • • • • • • • • • • • • Dual-e600 Power Architecture Processor Cores PD Typically 21.7W at 1.25 GHz VDD = 1.05V Selectable MPX Bus up to 600 MHz (64 bits)

pci slot pinout

Abstract: e2v GTX 120 PC8640
Contextual Info: PC8640 and PC8640D Power Architecture Integrated Processor Datasheet Features • • • • • • • • • • • • • Dual-e600 Power Architecture Processor Cores PD Typically 21.7W at 1.25 GHz VDD = 1.05V Selectable MPX Bus up to 600 MHz (64 bits)

Contextual Info: PC7448 PowerPC 7448 RISC Microprocessor Datasheet Features • • • • • • • • • • • • • • • 3000 Dhrystone 2.1 MIPS at 1.3 GHz Selectable Bus Clock 30 CPU Bus Dividers up to 28x Selectable MPx/60x Interface Voltage (1.5V; 1.8V; 2.5V)

AOP-8

Abstract: 200H H300 H301
Contextual Info: AOP-8 8 Channel Analogue Output Board User Manual AOP-8 User Manual Document Part N° Document Reference Document Issue Level 0127-1011 0127-1011.Doc 1.0 Manual covers PCBs identified AOP-8 Rev. B All rights reserved. No part of this publication may be reproduced, stored in any retrieval system, or

PC MOTHERBOARD CIRCUIT diagram of LG computers

Abstract: AD585 AIP-24 H300 H301 H302 lm35 to 1-5 volts
Contextual Info: AIP-24 24 Channel Analogue Input Board User Manual AIP-24 User Manual Document Part N° Document Reference Document Issue Level 0127-1012 0127-1012.Doc 1.2 Manual covers PCBs identified AIP-24 Rev F All rights reserved. No part of this publication may be reproduced, stored in any retrieval system, or

qfn 3x3 tray dimension

Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the