L7783O Search Results
L7783O Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
soft solder die bondingContextual Info: IGC114T170S8RM IGBT3 Power Chip Features: • 1700V Trench + Field stop technology • low switching losses • soft turn off • positive temperature coefficient • easy paralleling Chip Type VCE IC IGC114T170S8RM 1700V 100A This chip is used for: • power modules |
Original |
igc114t170s8rml7783osoft solder die bonding | |
|
Contextual Info: IGC114T170S8RM IGBT3 Power Chip Features: • 1700V Trench + Field stop technology low switching losses soft turn off positive temperature coefficient easy paralleling Chip Type VCE IC IGC114T170S8RM 1700V 100A This chip is used for: power modules |
Original |
igc114t170s8rml7783ol7783tl7783e |