L7783N Search Results
L7783N Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
soft solder die bondingContextual Info: IGC168T170S8RH IGBT3 Power Chip Features: • 1700V Trench + Field stop technology • low switching losses and saturation losses • soft turn off • positive temperature coefficient • easy paralleling Chip Type IGC168T170S8RH VCE IC 1700V 150A This chip is used for: |
Original |
igc168t170s8rhl7783nsoft solder die bonding | |
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Contextual Info: IGC114T170S8RH IGBT3 Power Chip Features: • 1700V Trench + Field stop technology • low switching losses and saturation losses • soft turn off • positive temperature coefficient • easy paralleling Chip Type IGC114T170S8RH VCE IC 1700V 100A This chip is used for: |
Original |
igc114t170s8rhl7783n |