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Catalog Datasheet	Type	Document Tags	PDF
SIDC09D60F6 Abstract: soft solder die bonding Contextual Info: SIDC09D60F6 Fast switching diode A Features: • 600V Emitter Controlled technology 70 µm chip • soft , fast switching • low reverse recovery charge • small temperature coefficient This chip is used for: • power modules and discrete devices C Applications:	Original	sidc09d60f6 l4304m soft solder die bonding	PDF

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SIDC09D60F6

Abstract: soft solder die bonding
Contextual Info: SIDC09D60F6 Fast switching diode A Features: • 600V Emitter Controlled technology 70 µm chip • soft , fast switching • low reverse recovery charge • small temperature coefficient This chip is used for: • power modules and discrete devices C Applications:

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sidc09d60f6 l4304m soft solder die bonding

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