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    KA15A Datasheets (1)

    National Semiconductor
    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    KA15A
    		National Semiconductor 15 Lead TO-3 Metal Can Package Original PDF 55.3KB 1
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    KA15A Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    KA15A

    Contextual Info: 15 Lead TO-3 Metal Can Package NS Package Number KA15A All dimensions are in inches millimeters LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL


    Original     		ka15a PDF

    transistor BC 458

    Abstract: transistor BC 945 ac 1084 transistor bc 577 Transistor BC 585 MS-015-AB TRANSISTOR A42 bd 743 transistor uA109 CA 358 AE
    Contextual Info: Hermetic Dimensional/Thermal Data The following table identifies all of the hermetic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the ceramic and


    Original     		ms011795transistor bc 458transistor bc 945ac 1084+7transistor bc 577transistor bc 585ms-015-abtransistor a42bd 743 transistorua109ca 358 ae PDF

    iso 1043-1

    Abstract: DIN 6120 iso 1043-1 polypropylene j1344 sae j1344 W28B D1972 DIN6120 d24j TA11A
    Contextual Info: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container


    Original     		ms011809-4ms011809-1ms011809-5ms011809-2+14ms011809-6ms011809-3ms011809-7ms011809iso 1043-1din 6120iso 1043-1 polypropylenej1344sae j1344w28bd1972din6120d24jta11a PDF

    iso 1043-1

    Abstract: DIN 6120 sae j1344 j1344 w28c iso 1043-1 polypropylene bga Shipping Trays MEC34 BGA OUTLINE DRAWING TSOP package tray
    Contextual Info: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container


    Original     		ms011809-4ms011809-1ms011809-5ms011809-2+14ms011809-6ms011809-3ms011809-7ms011809iso 1043-1din 6120sae j1344j1344w28ciso 1043-1 polypropylenebga shipping traysmec34bga outline drawingtsop package tray PDF

    transistor BC 458

    Abstract: transistor a42 MO-003 transistor Bc 540 ua109a CERAMIC PIN GRID ARRAY CPGA lead frame transistor bc 577 W144A UA65A CERAMIC QUAD FLATPACK CQFP
    Contextual Info: Hermetic Dimensional/Thermal Data The following table identifies all of the hermetic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the ceramic and


    Original     		transistor bc 458transistor a42mo-003transistor bc 540+6ua109aceramic pin grid array cpga lead frametransistor bc 577w144aua65aceramic quad flatpack cqfp PDF

    K04A

    Abstract: KA15A H06C H08A K02A K02B K02C K08A KA04B KC02A
    Contextual Info: Metal Can Packages TO-3/5/8/18/39/46/52/72 2 Lead TO-3 Metal Can Package NS Package Number K02A 2000 National Semiconductor Corporation MS101115 www.national.com Metal Can Packages (TO-3/5/8/18/39/46/52/72) August 1999 Metal Can Packages (TO-3/5/8/18/39/46/52/72)


    Original     		o-3/5/8/18/39/46/52/72ms101115kc02ak04a+8ka15ah06ch08ak02ak02bk02ck08aka04b PDF