K 32 S 34 Search Results

B32561

Abstract: B32562 KMK0318-4 KMK0329-J KMK0444-Y KMK0561-U KMK0601-S KMK0718-T EPCOS LABEL
Contextual Info: Taping and Packing Axial Leads 1 Capacitors with axial leads The axial-lead capacitors B 32 232, B 32 537 and B 32 538 are available on tape. Taping in accordance with IEC 60286-1. 1,2 max. k s 4,5+1 c b 6±1 Tape dimensions KMK0601-S B 32 232 B 32 537, B 32 538

BI 668

Abstract: SM 668
Contextual Info: T M 4 9 7 F B K 3 2 , T M 4 9 7 F B K 3 2 S 4 1 9 4 3 0 4 BY 32-BI T T M 8 9 3 G B K 3 2 , T M 8 9 3 G B K 3 2 S 8 3 8 8 6 0 8 BY 32-BI T E X T E N D E D DATA O U T D Y N A M I C RAM M O D U L E S S M M S 668-N O VEM BER 1996 Or ga n i za t i o n - T M 4 9 7 F B K 3 2 / S : 4 194 304 x 32

Contextual Info: 2 3 5 4 6 7 A X X Lochbi Id Kontaktanordnung board d r i l l ings co nta ct arrangement alle Locher 32 E i nlot K o n t a k t e 32 s o ld e r co ntacts 15 11 13 I 7 9 I 5 I El = E i nlot K o nt a k t s o ld e r co nta ct □ = K o n t a k t p o s i t i o n nicht b e legt

vl82c483

Abstract: C1882 CYM7450 203C 74so3 VL82C 128 pin connector c3195 D01711 950 T63
Contextual Info: CYM7450 CYM7451 PRELIMINARY rj f C Y P R E S S 128K/256K Cache M odule for VLSI VL82C483 Chip Set Features Functional Description • 128 K-byte CYM7450 or 256 K-byte (CYM7451) secondary cache module organized as 32K by 32 or 64K by 32 • Ideal for Intel 486-based systems

Contextual Info: A D M A ß O G S O K K F O ^ffiM T T fl !] in te i MILITARY 386 SX MICROPROCESSOR Full 32-Bit Internal Architecture — 8-, 16-, 32-Bit Data Types — 8 General Purpose 32-Bit Registers Runs Intel386™ Software in a Cost Effective 16-Bit Hardware Environment

bx-upi

Abstract: 271062 "FRC"
Contextual Info: M W Â K K S E O ßiO IFÜ K lM lÄ TD ^ in te * M82965 FAULT TOLERANT BUS EXTENSION UNIT Military Multiprocessor Support — Connect up to 32 Processor and Memory Modules In a Single System Multiple Bus Support with No External Logic — Connect up to Four 32-Bit Buses for

Non-Pipelined Single-Cycle processor

Abstract: s12w beo 4051 270710 80960CF PQFP dimension intel 80960
Contextual Info: in te i A O W & K K g S O K [F K ffiflA T D @ (M 80960CF-33, -25, -16 32-BIT HIGH PERFORMANCE SUPERSCALAR PROCESSOR • Socket and Object Code Compatible with 80960CA • Two Instructions/Clock Sustained Execution • Four 59 Mbytes/s DMA Channels with Data Chaining

Contextual Info: A 5 X 32 E i n l ö t K o n t a k t e 32 s o l d e r c o n t a c t s Kontaktanordnung 31 con ta ct arrangement 27 29 23 25 21 19 15 17 11 7 13 9 Z 3 5 E in lö t Kontakt s o l d e r c ont ac t _ a 2:1 □ = k i nked E i n l ö t K o n t a k t — c 10, 5 ± o , 1

Contextual Info: 3 X A 15 Kont ak t ano r d nu ng c o n t a c t ar r angement 11 13 I 7 9 I 4 B 6 7 32 E i n l o t - K o n t a k t e 32 s o l d e r - c o n t a c t s 3 5 I l IHI = _a — c Ei nlo t-K o n ta k t solder-contact 2:1 □ = Kontaktposition nicht belegt p o s it io n without contact

Contextual Info: 3 X A 15 Kont ak t ano r d nu ng c o n t a c t ar r angement 11 13 I 7 9 I 4 B 6 7 32 E i n l o t - K o n t a k t e 32 s o l d e r - c o n t a c t s 3 5 I l IHI = _a — c Ei nlo t-K o n ta k t solder-contact 2:1 □ = Kontaktposition nicht belegt p o s it io n without contact

Contextual Info: 2 3 4 Y A Kontaktanordnung Contact arrangement 5 6 7 32 S i g n a l K o n t a k t e 32 signal contacts 5 9 7 13 11 17 15 21 19 25 23 1 29 27 31 2:1 is = K o n t a k t p o s i t i on b e l e g t = position with contact 10,5 ± 0,1 _a 8 , 5 . 0,1 □ = Kontaktposition nicht belegt

Katalog tesla tranzistor

Abstract: KD502 KD3055 KD617 KU607 KU612 Tesla katalog KD602 kd 617 kd607
Contextual Info: T E U f • - f l J P i A . f E L E K T R O N IC K É € K O N C E R N S O U C Á S T K Y R O Z N O V Kremikové vÿkonové tranzistory fill* KC31S VOO331 ft* » .* K03773 T30 32> U U * K0336 VQ0321 I I I IA If« » KOWt MÍO 32' K0338 VQ0 3SI ic c a f li

Contextual Info: DENSE-PAC 32 Megabit High Speed CM OS SRAM M I c R O s Y s TI' M s DPS1MK32MKV3 DESCRIPTION: The D P S 1 M K 3 2 M K V 3 " V E R S A - S T A C K " m o d u le is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Lead less Chip

SC11320

Abstract: 1320s
Contextual Info: o SC11320 32 x 32 Crosspoint Switch SIERRA SEMICONDUCTOR □ 32 x 32 D ig ita l c ro s s p o in t structure □ CMOS low pow er □ 3 ns skew, typical □ 50 M Hz operation □ CMOS com patible in p u ts /tristatable outputs □ M ultiple package options 100-PIN Q FP P A C K A G E

Contextual Info: K M 2 3 V3 2 2 0 5 B S G CMOS Mas k ROM ELECTRONICS 32M-Bit 2M X 16/1 M X 32 CMOS MASK ROM FEATURES GENERAL DESCRIPTION • Switchable organization 2,097,152 x16(word mode)/ 1,048,576 x 32(double word mode) • Fast access time Random Access : 100ns (max.)

Contextual Info: Adaptors 25 39 S 151-SOO E3 31 32 S 151-S00 E3 32 32 S 151-KOO E3 SMC m / BNC m 26 .5 Remarks: 26 39 S 151-KOO E3 SM A m 1 BNC f 25 - rp R jl m i . "TTun-^j| il Remarks: 27 SMC f /SMA m — 39 K 132-S00 E3 33 — SMA m/TNCm 27 .2 rpq Ml Pvfp^Tl y

Contextual Info: fax id: 2052 CYPRESS PRELIMINARY C YM 1851V33 1,024K x 32 3.3V Static RAM Module Features • H ig h -d e n s ity 3.3 V 3 2 -m e g a b it S R A M m o d u le • 32 -b it S tan d ard F o o tp rin t su p p o rts d e n s itie s from 1 6 K x 32 th ro u g h 1 M x 32

Contextual Info: X A 32 E i n p r e ß K o n t a k t e Ko n t a k t ano r dnu ng 15 c o n t a c t ar r angement 32 p r e s s - i n c o n t a c t s 11 13 9 5 z 1 El - 0 = Einpreß Kontakt press-in o o ISIS ISIS ISIS ISIS ISIS ISIS ISIS ISIS ISIS ISIS ISIS ISIS ISIS ISIS ISIS

Contextual Info: 2 3 A 5 4 X Lochbi Id Kontaktanordnung contact arrangement alle Locher 00,05 01 <D 32 E i n p r e s s K o n t a k t e 32 p r e s s - i n contacts 1 — Position 16 15 position H f t±±±*f:t±±±d* •4t +0,1 7 X board d r i l l ings a l l holes 02,8 6 t>

PIGTAILS

Contextual Info: FUSES / SICHERUNGEN non resettable P lug-on caps w ith p ig ta ils A ufsteckkappen m it Drahtanschlüssen fo r fu se-lin k s 5 x 20 m m and 6,3 x 32 m m fü r S ich e ru n g s e in s ä tze 5 x 20 m m und 6,3 x 32 m m / n ic h t r ü c k s t e l l e n d in

Contextual Info: M O S E L V IT E L IC PRELIM INARY V62C3181024 2 .7 VOL T 1 2 8 K X 8 STA TIC RAM Features • Packages - 32-pin TSOP Standard - 32-pin TSOP (Reverse) - 32-pin 600 mil PDIP - 32-pin 300 mil SOP (450 mil pin-to-pin) - 32-pin 440 mil SOP (525 mil pin-to-pin)

transistor 1548 b

Abstract: CM150TX-24S
Contextual Info: CM150TX-24S Six IGBTMOD NX-S Series Module Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 724 925-7272 www.pwrx.com 150 Amperes/1200 Volts AJ AK AG A D K E AH F G J H L K M K M K K AA AB C K L K K K DETAIL "A" Z 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31

Contextual Info: s e m ik r o n V rrm V br V rwm V V V Types Vf If = 30 A V N Rthjoil High Voltage Rectifiers 35.180 kV °c/w S K X A . 35 000 52 000 30 000 S K X A 35 N 120 32 12,5 80 000 100 000 80 000 100 000 75 000 75 000 S K X A 75 000 S K X A 75 M 160 210 54 61

m5324

Abstract: KMM5324004CK KMM5324004CKG
Contextual Info: KM M 5324004C K/C KG K M M 5324104C K /C K G DRAM M O D ULE K M M 5324004C K/CK G & KM M 5324104CK/CKG Fast Page M ode with EDO Mode 4M x 32 DRAM SIMM using 4Mx4, 4K/2K Refresh, 5V GENERAL DESCRIPTION FEATURES T h e S a m s u n g K M M 53240 1 0 4 C K is a 4 M x 3 2 b its