JTAG SAMSUNG S Search Results
JTAG SAMSUNG S Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
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| 4T774COUPONEVM |
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EVM for direction-controlled bidirectional translation device to support SPI, JTAG, UART interfaces |
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| SCAN921226HSM |
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High Temperature 20MHz - 80MHz 10-Bit Deserializer with IEEE 1149.1 Test Access 49-NFBGA -40 to 125 |
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| SCAN921025HSM |
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High Temperature 20MHz - 80MHz 10-Bit Serializer with IEEE 1149.1 Test Access 49-NFBGA -40 to 125 |
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| SCAN921226SLC/NOPB |
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30-80 MHz 10 Bit Bus LVDS Deserializer with IEEE 1149.1 (JTAG) and at-speed BIST 49-NFBGA |
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| SCAN92LV090SLC |
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9-channel bus LVDS transceiver with boundary SCAN 64-NFBGA -40 to 85 |
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JTAG SAMSUNG S Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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Contextual Info: Preliminary 256Kx72 Pipelined NtRAMTM K7N167249A Document Title 256Kx72-Bit Pipelined NtRAMTM Revision History History Draft Date Remark 0.0 1. Initial document. April. 21. 2001 Preliminary 0.1 1. Add JTAG Scan Order May. 10. 2001 Preliminary Rev. No. The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to c hange the |
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K7N167249A 256Kx72-Bit 256Kx72 11x19 00x10 | |
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Contextual Info: Preliminary 256Kx72 Pipelined NtRAMTM K7N167245A Document Title 256Kx72-Bit Pipelined NtRAMTM Revision History History Draft Date Remark 0.0 1. Initial document. April. 21. 2001 Preliminary 0.1 1. Add JTAG Scan Order May. 10. 2001 Preliminary Rev. No. The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to c hange the |
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K7N167245A 256Kx72-Bit 256Kx72 11x19 00x10 | |
GS882Z18CGB-200IV
Abstract: jtag bsdl cypress
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GS882Z18/36C 119-bump 165-bump 882ZVxxC GS882Z18CGB-200IV jtag bsdl cypress | |
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Contextual Info: Samsung Samsung Secret Secret SAMSUNG QDRII+/DDRII+ 16Mb C-die Specification Change Notice July, 2008 Product Planning & Application Engineering Team MEMORY DIVISION SAMSUNG ELECTRONICS Co., LTD Product Product Planning Planning & & Application Application Eng. |
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K7K1636T2C K7K1618T2C 512Kx36 K7S1636T4C K7S1618T4C 1Mx18 11x15 | |
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Contextual Info: GS882Z18/36C B/D -xxxV 9Mb Pipelined and Flow Through Synchronous NBT SRAM 119-bump and 165-bump BGA Commercial Temp Features • NBT (No Bus Turn Around) functionality allows zero wait Read-Write-Read bus utilization; fully pin-compatible with both pipelined and flow through NtRAM , NoBL™ and |
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GS882Z18/36C 119-bump 165-bump 882ZVxxC | |
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Contextual Info: GS882ZV18/36BB/D-333/300/250/200/150 119-bump and 165-bump BGA Commercial Temp Industrial Temp 9Mb Pipelined and Flow Through Synchronous NBT SRAM 333 MHz–150 MHz 1.8 V VDD 1.8 V I/O Features Functional Description • NBT No Bus Turn Around functionality allows zero wait |
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GS882ZV18/36BB/D-333/300/250/200/150 119-bump 165-bump | |
GS882Z18BB-150V
Abstract: GS882Z18BB-200V GS882Z18BB-250V
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GS882Z18/36B 119-bump 165-bump GS882Z18BB-150V GS882Z18BB-200V GS882Z18BB-250V | |
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Contextual Info: GS882Z18/36B B/D -xxxV 119-bump and 165-bump BGA Commercial Temp Industrial Temp 9Mb Pipelined and Flow Through Synchronous NBT SRAM Features • NBT (No Bus Turn Around) functionality allows zero wait Read-Write-Read bus utilization; fully pin-compatible with |
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GS882Z18/36B 119-bump 165-bump | |
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Contextual Info: Preliminary GS882Z18/36C B/D -xxxV 119-bump and 165-bump BGA Commercial Temp Industrial Temp 250 MHz–150 MHz 1.8 V or 2.5 V VDD 1.8 V or 2.5 V I/O 9Mb Pipelined and Flow Through Synchronous NBT SRAM Features • NBT (No Bus Turn Around) functionality allows zero wait |
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GS882Z18/36C 119-bump 165-bump 165-bumNoBL 882ZVxxC | |
lh832Contextual Info: GS882Z18/36B B/D -xxxV 250 MHz–150 MHz 1.8 V or 2.5 V VDD 1.8 V or 2.5 V I/O 9Mb Pipelined and Flow Through Synchronous NBT SRAM 119-bump and 165-bump BGA Commercial Temp Industrial Temp Features Because it is a synchronous device, address, data inputs, and |
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GS882Z18/36B 119-bump 165-bump lh832 | |
K7P321866M
Abstract: K7P323666M SA10 SA12 SA13 SA15 SA18 samsung capacitance Manufacturing location
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K7P323666M K7P321866M 1Mx36 2Mx18 119BGA K7P321866M K7P323666M SA10 SA12 SA13 SA15 SA18 samsung capacitance Manufacturing location | |
INTEGRATED DEVICE TECHNOLOGY
Abstract: GS882ZV18B GS882ZV18BB-250 GS882ZV18BB-300 GS882ZV18BB-333 GS882ZV36B
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GS882ZV18/36BB/D-333/300/250/200 119-bump 165-bump INTEGRATED DEVICE TECHNOLOGY GS882ZV18B GS882ZV18BB-250 GS882ZV18BB-300 GS882ZV18BB-333 GS882ZV36B | |
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Contextual Info: GS882Z18/36B B/D -xxxV 119-bump and 165-bump BGA Commercial Temp Industrial Temp 9Mb Pipelined and Flow Through Synchronous NBT SRAM Features • NBT (No Bus Turn Around) functionality allows zero wait Read-Write-Read bus utilization; fully pin-compatible with |
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GS882Z18/36B 119-bump 165-bump | |
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Contextual Info: Preliminary GS882Z18/36C B/D -xxxV 119-bump and 165-bump BGA Commercial Temp Industrial Temp 250 MHz–150 MHz 1.8 V or 2.5 V VDD 1.8 V or 2.5 V I/O 9Mb Pipelined and Flow Through Synchronous NBT SRAM Features • NBT (No Bus Turn Around) functionality allows zero wait |
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GS882Z18/36C 119-bump 165-bump 165-bumation 882ZVxxC | |
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Contextual Info: K7K1636T2C K7K1618T2C Preliminary 512Kx36 & 1Mx18 DDRII+ CIO b2 SRAM 18Mb DDRII+ SRAM Specification 165 FBGA with Pb & Pb-Free RoHS compliant INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. |
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K7K1636T2C K7K1618T2C 512Kx36 1Mx18 11x15 | |
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Contextual Info: K7K1636T2C K7K1618T2C 512Kx36 & 1Mx18 DDRII+ CIO b2 SRAM 18Mb DDRII+ SRAM Specification 165 FBGA with Pb & Pb-Free RoHS compliant INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, |
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K7K1636T2C K7K1618T2C 512Kx36 1Mx18 11x15 | |
SRAM sheet samsungContextual Info: K7J643682M K7J641882M 2Mx36 & 4Mx18 DDR II SIO b2 SRAM 72Mb M-die DDRII SRAM Specification 165 FBGA with Pb & Pb-Free RoHS compliant INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, |
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K7J643682M K7J641882M 2Mx36 4Mx18 11x15 SRAM sheet samsung | |
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Contextual Info: K7P323674C K7P321874C Preliminary 1Mx36 & 2Mx18 SRAM 36Mb Late Write SRAM Specification 119BGA with Pb & Pb-Free RoHS compliant INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, |
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K7P323674C K7P321874C 1Mx36 2Mx18 119BGA | |
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Contextual Info: K7P323674C K7P321874C 1Mx36 & 2Mx18 SRAM 36Mb Late Write SRAM Specification 119BGA with Pb & Pb-Free RoHS compliant INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, |
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K7P323674C K7P321874C 1Mx36 2Mx18 119BGA | |
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Contextual Info: K7K1636T2C K7K1618T2C 512Kx36 & 1Mx18 DDRII+ CIO b2 SRAM 18Mb DDRII+ SRAM Specification 165 FBGA with Pb & Pb-Free RoHS compliant INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, |
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K7K1636T2C K7K1618T2C 512Kx36 1Mx18 11x15 | |
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Contextual Info: K7K1636T2C K7K1618T2C Preliminary 512Kx36 & 1Mx18 DDRII+ CIO b2 SRAM 18Mb DDRII+ SRAM Specification 165 FBGA with Pb & Pb-Free RoHS compliant INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. |
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K7K1636T2C K7K1618T2C 512Kx36 1Mx18 11x15 | |
SRAM sheet samsungContextual Info: K7I643682M K7I641882M 2Mx36 & 4Mx18 DDRII CIO b2 SRAM 72Mb M-die DDRII SRAM Specification 165 FBGA with Pb & Pb-Free RoHS compliant INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, |
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K7I643682M K7I641882M 2Mx36 4Mx18 11x15 SRAM sheet samsung | |
K7R643684Contextual Info: K7R643684M K7R641884M 2Mx36 & 4Mx18 QDRTM II b4 SRAM 72Mb M-die QDRII SRAM Specification 165 FBGA with Pb & Pb-Free RoHS compliant INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, |
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K7R643684M K7R641884M 2Mx36 4Mx18 11x15 K7R643684 | |
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Contextual Info: K7R643684M K7R641884M 2Mx36 & 4Mx18 QDRTM II b4 SRAM 72Mb QDRII SRAM Specification 165 FBGA with Pb & Pb-Free RoHS compliant INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, |
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K7R643684M K7R641884M 2Mx36 4Mx18 11x15 | |