JESD51-2 DDR3 85 Search Results

W3J512M40G

Abstract: M41K256M32
Contextual Info: W3J512M32G-XBX W3J512M32GT-XB2X W3J512M40G T -XB3X *PRELIMINARY 2GB – 512M x 32/40 DDR3 SDRAM 1.5V – 136/204 PBGA Multi-Chip Package FEATURES BENEFITS  DDR3 Data Rate = 800, 1,066, 1333 Mb/s  74% Space savings vs. FBGA  Packages:  Reduced part count

W3J512M32G

Abstract: M41K256M32
Contextual Info: W3J512M32G-XBX W3J512M32G T -XB2X W3J512M36/40G(T)-XB3X *PRELIMINARY 2GB – 512M x 32/36/40 DDR3 SDRAM 1.5V – 136/204 PBGA Multi-Chip Package FEATURES BENEFITS  DDR3 Data Rate = 800, 1,066, 1333 Mb/s  74% Space savings vs. FBGA  Packages:

M41K256M32

Contextual Info: W3J512M32K-XBX W3J512M36K T -XB2X W3J512M36/40K(T)-XB3X *PRELIMINARY 2GB – 512M x 32/36/40 DDR3 SDRAM 1.35V – 136/204 PBGA Multi-Chip Package FEATURES BENEFITS  DDR3 Data Rate = 800, 1,066, 1333 Mb/s  74% Space savings vs. FBGA  Packages:

MPR 55 F resistor

Abstract: M41K256M32
Contextual Info: W3J512M32G-XBX W3J512M32/36/40G T -XB2X *PRELIMINARY 2GB – 512M x 32/36/40 DDR3 SDRAM 1.5V – 136/204 PBGA Multi-Chip Package FEATURES BENEFITS  DDR3 Data Rate = 800, 1,066, 1333 Mb/s  74% Space savings vs. FBGA  Packages:  Reduced part count

M41K256M32

Contextual Info: W3J512M32K-XBX W3J512M32/36/40K T -XB2X *PRELIMINARY 2GB – 512M x 32/36/40 DDR3 SDRAM 1.35V – 136/204 PBGA Multi-Chip Package FEATURES BENEFITS  DDR3 Data Rate = 800, 1,066, 1333 Mb/s  74% Space savings vs. FBGA  Packages:  Reduced part count

tn0008

Abstract: mobile ddr2 TN-00-08 micron BGA SDRAM
Contextual Info: TN-00-08: Thermal Applications Introduction Technical Note Thermal Applications Introduction This technical note defines a general method and the criteria for measuring and ensuring that Micron memory components and modules do not exceed the maximum allowable temperature. The specified temperatures will help ensure the reliability and

Contextual Info: W3J512M72K-XPBX W3J512M72K-XLBX *ADVANCED 4GB – 512M x 72 DDR3 SDRAM 1.35V – 543 PBGA Multi-Chip Package FEATURES  Address/control terminations included  DDR3 Data Rate = 800, 1,066, 1333, 1600* Mb/s  Differential clock terminations included

Contextual Info: W3J128M72K-XLBX W3J128M72K-XPBX *ADVANCED 1GB – 128M x 72 DDR3 SDRAM – 1.35V – 375 PBGA Multi-Chip Package FEATURES BENEFITS  DDR3 Data Rate = 800; 1,066; 1,333; 1,600* Mb/s  35%* Space savings vs. FBGA  Packages:  Reduced part count

w3j128m72

Abstract: w3j512m72
Contextual Info: W3J512M72G-XPBX W3J512M72G-XLBX 4GB – 512M x 72 DDR3 SDRAM – 1.5V – 543 PBGA Multi-Chip Package FEATURES  Address/control terminations included  DDR3 Data Rate = 800, 1066, 1333, 1600* Mb/s  Differential clock terminations included

Contextual Info: W3J512M64G-XPBX W3J512M64G-XLBX 4GB – 512M x 64 DDR3 SDRAM – 1.5V – 543 PBGA Multi-Chip Package FEATURES  Address/control terminations included  DDR3 Data Rate = 800, 1066, 1333, 1600* Mb/s  Differential clock terminations included

Contextual Info: W3J512M64G-XPBX W3J512M64G-XLBX 4GB – 512M x 64 DDR3 SDRAM – 1.5V – 543 PBGA Multi-Chip Package FEATURES  Address/control terminations included  DDR3 Data Rate = 800, 1066, 1333, 1600* Mb/s  Differential clock terminations included

Contextual Info: W3J512M64K-XPBX W3J512M64K-XLBX *ADVANCED 4GB – 512M x 64 DDR3 SDRAM 1.35V – 543 PBGA Multi-Chip Package FEATURES  Address/control terminations included  DDR3 Data Rate = 800, 1,066, 1333, 1600* Mb/s  Differential clock terminations included

Contextual Info: W3J128M72G-XLBX W3J128M72G-XPBX 1GB – 128M x 72 DDR3 SDRAM – 1.5V – 375 PBGA Multi-Chip Package FEATURES BENEFITS  DDR3 Data Rate = 800, 1,066, 1,333, 1,600* Mb/s  35%* Space savings vs. FBGA  Packages:  Reduced part count

Contextual Info: W3J128M72G-XLBX W3J128M72G-XPBX 1GB – 128M x 72 DDR3 SDRAM – 375 PBGA Multi-Chip Package FEATURES BENEFITS  DDR3 Data Rate = 800, 1,066, 1333 Mb/s  35%* Space savings vs. FBGA  Packages:  Reduced part count • 375 Plastic Ball Grid Array PBGA , 20.5 mm x 21.5 mm

Contextual Info: W3J128M72K-XLBX W3J128M72K-XPBX *ADVANCED 1GB – 128M x 72 DDR3 SDRAM – 1.35V – 375 PBGA Multi-Chip Package FEATURES BENEFITS  DDR3 Data Rate = 800; 1,066; 1,333; 1,600* Mb/s  35%* Space savings vs. FBGA  Packages:  Reduced part count

Contextual Info: REVISIONS LTR DESCRIPTION DATE Prepared in accordance with ASME Y14.24 APPROVED Vendor item drawing REV PAGE REV PAGE REV STATUS OF PAGES REV PAGE PMIC N/A 1 2 3 4 5 6 7 8 9 PREPARED BY CHECKED BY APPROVED BY Thomas M. Hess SIZE A REV AMSC N/A 12 TITLE Phu H. Nguyen

Contextual Info: W3J128M64K-XLBX *PRELIMIINARY 1GB – 128M x 64 DDR3 SDRAM – 375 PBGA Multi-Chip Package FEATURES BENEFITS  DDR3 Data Rate = 800, 1,066, 1333, 1600* Mb/s  31%* Space savings vs. FBGA  Package:  Reduced part count • 375 PBGA, Low profile, 19 mm x 21.5 mm

Contextual Info: W3J128M64G-XLBX *ADVANCED 1GB – 128M x 64 DDR3 SDRAM – 375 PBGA Multi-Chip Package FEATURES BENEFITS  DDR3 Data Rate = 800, 1,066, 1333, 1600* Mb/s  31%* Space savings vs. FBGA  Package:  Reduced part count • 375 PBGA, Low profile, 19 mm x 21.5 mm

Contextual Info: W3J128M64G-XLBX *PRELIMIINARY 1GB – 128M x 64 DDR3 SDRAM – 375 PBGA Multi-Chip Package FEATURES BENEFITS  DDR3 Data Rate = 800, 1,066, 1333, 1600* Mb/s  31%* Space savings vs. FBGA  Package:  Reduced part count • 375 PBGA, Low profile, 19 mm x 21.5 mm

QorIQ P4040 reference manual

Abstract: TX-6-G QorIQ P4080 reference manual flotherm MODEL e500mc P4080 PME P4040EC Data Path Acceleration Architecture freescale P4040 P4080 PCI-E
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data P4040 QorIQ Integrated Processor Hardware Specifications The P4040 QorIQ integrated communication processor combines four Power Architecture processor cores with high-performance data path acceleration logic and network

Contextual Info: P4040 QorIQ Integrated Processor Hardware Specifications Datasheet - Preliminary The P4040 QorIQ integrated communication processor combines four Power Architecture processor cores with high performance data path acceleration logic and network and peripheral bus interfaces required for power intensive

Contextual Info: Freescale Semiconductor Data Sheet: Technical Data P4040 QorIQ Integrated Processor Hardware Specifications The P4040 QorIQ integrated communication processor combines four Power Architecture processor cores with high-performance data path acceleration logic and network

freescale p2040

Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: P2040EC Rev. 2, 02/2013 P2040 P2040 QorIQ Integrated Processor Hardware Specifications The P2040 QorIQ integrated communication processor combines four Power Architecture processor cores with

QorIQ P4080 reference manual

Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: P4080EC Rev. 4, 04/2013 P4080/P4081 QorIQ Integrated Processor Hardware Specifications The P4080/P4081 QorIQ integrated communication processor combines eight Power Architecture processor