JEDEC QFN TAPE Search Results

Contextual Info: DATA SHEET SMP1345-087LF: Surface Mount PIN Diode Applications • Switches • Attenuators Features • Low-series resistance: 2 Ω maximum @ 10 mA • Low total capacitance: 0.2 pF maximum @ 5 V • QFN 2 x 2 mm package (MSL1, 260 °C per JEDEC J-STD-020)

56QN50T18080

Abstract: Senju MO-220-compliant Theta JA of 64-pin BGA 56RGQ senju solder paste MO-220 SN74SSTV16859 IPC-9701 qfn jc jb
Contextual Info: Application Report SCEA032 - March 2003 56-Pin Quad Flatpack No-Lead Logic Package Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-Lead (QFN) 56-terminal package complies with JEDEC standard MO-220, allows for board miniaturization, and holds several advantages

Contextual Info: DATA SHEET SMP1325-087LF: Surface Mount PIN Diode Applications • Switches • Attenuators Features • Low-series resistance: 0.55 Ω maximum @ 100 mA • Low total capacitance: 0.6 pF maximum @ 20 V • QFN 2 x 2 mm package (MSL1, 260 °C per JEDEC J-STD-020)

SE2432L

Contextual Info: DATA SHEET • Small QFN 24-pin, 3 x 4 mm package (MSL1, 260 °C per JEDEC-J-STD-020) Skyworks Green products are compliant with all applicable legislation and are halogen-free. For additional information, refer to Skyworks Definition of Green™, document number

Contextual Info: DATA SHEET • SMP1371-087LF DIODE DATA SHEET SMP1371-087LF: Surface Mount PIN Diode Applications • Switches Features • Low-series resistance: 0.5 Ω maximum @ 10 mA • Low total capacitance: 1.2 pF maximum @ 20 V • QFN 2 x 2 mm package (MSL1, 260 °C per JEDEC J-STD-020)

Solder bar of Senju M705

Abstract: senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile 16QN50T23030 JESD 51-7, ambient measurement qfn 32 land pattern Senju paste 7100
Contextual Info: Application Report SCBA017D – February 2004 Quad Flatpack No-Lead Logic Packages Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241, allow for board miniaturization, and hold

Contextual Info: DATA SHEET SE2611T: 2.4 GHz High Efficiency Wireless LAN/BT Front End Applications • Simultaneous WLAN and Bluetooth receive mode  Direct connection to battery with 3.3 V nominal supply  Lead-free, halogen-free, ROHS compliant QFN 20-pin, 3  3  0.6 mm package (MSL1, 260 C per JEDEC J-STD020)

SMP1345-087

Abstract: SKY1345-087LF SMP1345-087LF
Contextual Info: DATA SHEET SMP1345-087LF: Surface Mount PIN Diode Applications • Switches • Attenuators Features • Low-series resistance: 2 Ω maximum @ 10 mA • Low total capacitance: 0.2 pF maximum @ 5 V • Excellent thermal resistance: 40 °C/W typical • QFN 2 x 2 mm package (MSL1, 260 °C per JEDEC J-STD-020)

smp1345-087lf

Contextual Info: DATA SHEET SMP1345-087LF: Surface Mount PIN Diode Applications • Switches • Attenuators Features • Low-series resistance: 2 Ω maximum @ 10 mA • Low total capacitance: 0.2 pF maximum @ 5 V • Excellent thermal resistance: 40 °C/W typical • QFN 2 x 2 mm package (MSL1, 260 °C per JEDEC J-STD-020)

pin diode application

Contextual Info: DATA SHEET SMP1324-087LF: Surface Mount PIN Diode Applications • Switches • Attenuators Features • Low-series resistance: 0.75 Ω maximum @ 50 mA • Low total capacitance: 1.5 pF maximum @ 30 V • Excellent thermal resistance: 40 °C/W typical • QFN 2 x 2 mm package (MSL1, 260 °C per JEDEC J-STD-020)

RS10

Abstract: RS100 SMP1325-087LF
Contextual Info: DATA SHEET SMP1325-087LF: Surface Mount PIN Diode Applications • Switches • Attenuators Features • Low-series resistance: 0.55 Ω maximum @ 100 mA • Low total capacitance: 0.6 pF maximum @ 20 V • Excellent thermal resistance: 40 °C/W typical • QFN 2 x 2 mm package (MSL1, 260 °C per JEDEC J-STD-020)

Contextual Info: DATA SHEET SMP1325-087LF: Surface Mount PIN Diode Applications • Switches • Attenuators Features • Low-series resistance: 0.55 Ω maximum @ 100 mA • Low total capacitance: 0.6 pF maximum @ 20 V • Excellent thermal resistance: 40 °C/W typical • QFN 2 x 2 mm package (MSL1, 260 °C per JEDEC J-STD-020)

SMP1325-087LF

Contextual Info: DATA SHEET SMP1325-087LF: Surface Mount PIN Diode Applications • Switches • Attenuators Features • Low-series resistance: 0.55 Ω maximum @ 100 mA • Low total capacitance: 0.6 pF maximum @ 20 V • Excellent thermal resistance: 13.6 °C/W typical • QFN 2 x 2 mm package (MSL1, 260 °C per JEDEC J-STD-020)

Contextual Info: DATA SHEET SMP1324-087LF: Surface Mount PIN Diode Applications • Switches • Attenuators Features • Low-series resistance: 0.75 Ω maximum @ 50 mA • Low total capacitance: 1.5 pF maximum @ 30 V • Excellent thermal resistance: 40 °C/W typical • QFN 2 x 2 mm package (MSL1, 260 °C per JEDEC J-STD-020)

smp1345-087lf

Contextual Info: DATA SHEET SMP1345-087LF: Surface Mount PIN Diode Applications • Switches • Attenuators Features • Low-series resistance: 2 Ω maximum @ 10 mA • Low total capacitance: 0.2 pF maximum @ 5 V • Excellent thermal resistance: 75 °C/W typical • QFN 2 x 2 mm package (MSL1, 260 °C per JEDEC J-STD-020)

Contextual Info: DATA SHEET SMP1325-087LF: Surface Mount PIN Diode Applications • Switches • Attenuators Features • Low-series resistance: 0.55 Ω maximum @ 100 mA • Low total capacitance: 0.6 pF maximum @ 20 V • Excellent thermal resistance: 40 °C/W typical • QFN 2 x 2 mm package (MSL1, 260 °C per JEDEC J-STD-020)

Contextual Info: DATA SHEET SMP1324-087LF: Surface Mount PIN Diode Applications • Switches • Attenuators Features • Low-series resistance: 0.75 Ω maximum @ 50 mA • Low total capacitance: 1.5 pF maximum @ 30 V • Excellent thermal resistance: 40 °C/W typical • QFN 2 x 2 mm package (MSL1, 260 °C per JEDEC J-STD-020)

16L-QFN

Abstract: 263 qfn EIA 481 QFN ALF sot-23-5
Contextual Info: REV: 0909-0707-01 Part Ⅰ Package Outline Drawing Part Ⅱ Carrier Tape Outline Drawing Part Ⅲ Reel Outline Drawing 1 Table of Contents Part Ⅰ - Package Outline Drawing DIPDIP-8 PACKAGE OUTLINE DRAWING - Ⅰ-1

QFN "100 pin" PACKAGE

Abstract: JEDEC qfn tape QFN 3x4 SOT23 JEDEC standard orientation MP transistor SOIC16 SOIC24 SOIC28 TSSOP16 TSSOP28
Contextual Info: Tape & Reel Packaging for Automated Handling The Future of Analog IC Technology General Overview Surface mount products are available in Tape & Reel packaging. Below is a table of standard Tape & Reel configurations. These packages conform to EIA-481-1/2/3 and JEDEC standards. All products are lead

EL5825

Abstract: EL5825IL EL5825IL-T13 EL5825IL-T7 EL5825ILZ EL5825ILZ-T13 EL5825ILZ-T7 EL5825IR QFN-24 lcd G42-88
Contextual Info: EL5825 Data Sheet June 24, 2005 • Rail-to-rail capability • Pb-Free plus anneal available RoHS compliant Applications • TFT-LCD drive circuits • Reference voltage generators Pinouts 2 SDO ENA 23 3 OSC OUTA 22 TAPE & REEL PKG. DWG. # EL5825IL 24-Pin QFN

ATMEL 740

Abstract: atmel 830 ATMEL Tape and Reel drawing LQFP-44 ATMEL shipping label atmel 0635 ATMEL Tape and Reel QFN-64 QFN-64 atmel 1030 pj 54 diode
Contextual Info: Packaging and Packing Information Packaging according to IEC 60286-3 for Tape and Reel, and IEC 60286-4 for tube packing. 1. Labels In general, on products coming out of Atmel ’s Heilbronn Germany location, two labels are on the inner cardboard: Atmel's standard bar code label and a customer

AX5488

Abstract: MAX5488EUD T
Contextual Info: 19-3478; Rev 3; 1/07 KIT ATION EVALU E L B AVAILA Dual, 256-Tap, Nonvolatile, SPI-Interface, Linear-Taper Digital Potentiometers Features The MAX5487/MAX5488/MAX5489 dual, linear-taper, digital potentiometers function as mechanical potentiometers with a simple 3-wire SPI -compatible digital

EL5825

Abstract: EL5825IL EL5825IL-T13 EL5825IL-T7 EL5825IR EL5825IR-T13 EL5825IR-T7
Contextual Info: EL5825 Data Sheet • Digital supply 3.3V to 5V • Low supply current of 8mA • Rail-to-rail capability Applications • TFT-LCD drive circuits • Reference voltage generators Pinouts ENA 23 3 OSC OUTA 22 TAPE & REEL PKG. NO. 4 VSD OUTB 21 EL5825IL 24-Pin QFN

jedec footprint MO-220 VHHD-2

Abstract: qfn 44 PACKAGE footprint QFN 64 9x9 footprint 32 pins qfn 5x5 footprint jedec package MO-220 64 9x9 WAN0118 WAN_0118 QFN footprint IPC-A-610D QFN 56 7x7 footprint
Contextual Info: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the