JEDEC DIP PROFILE Search Results

12010C

Contextual Info: _CYM1465 = ^ SEMICONDUCTOR Features • High-density 4-megabit SRAM module • High-speed CMOS SRAMs — Access time of 85 ns • Low active power — 605 mW max. • JEDEC-compatible pinout • 32-pin, 0.6-inch-wide DIP package

TRUEFFS

Abstract: M-Systems diskonchip 2000 diskonchip qnx M-Systems diskonchip M-Systems EPROM M-Systems pSOS msystems Disk Pioneers Japan Diskonchip
Contextual Info: DiskOnChip 2000 The Industry-Standard Local Storage Solution • Single-chip flash disk • 4-288 Mbyte capacities Future capacities: 576 Mbytes and up • Easy to use interface • 32-pin DIP JEDEC standard • EPROM/FLASH compatible electrical interface

27C220

Abstract: 27C210 27C220-150V10 N27C220-200V10 P27C220-200V10 29021
Contextual Info: irrte* 27C220 2M 128K x 16 CHMOS EPROM Fast Programming — Quick-Pulse Programming^ Algorithm — Programming Times As Fast As 15 Seconds Surface Mount Packaging Available Complete Upgrade to Higher Densities JEDEC Approved EPROM Pinouts -40-P in DIP -44-P in PLCC

EM 5135 diode

Abstract: 27C020-150V10 27C020 PLCC 27C020
Contextual Info: « y ß Ä « ? 27C020 2M 256K x 8 CHMOS EPROM • JEDEC Approved EPROM Pinouts -3 2 -P in DIP, 32-Pin PLCC — Simple Upgrade from Lower Densities ■ Complete Upgrade Capability to Higher Densities ■ Versatile EPROM Features — CMOS and TTL Compatibility

intel 27C010

Abstract: P27C010-200V10 27C010 27C010 uv 27C010-200V10 A12C LD27C010 p27c010-150v10 N27C010-200V10
Contextual Info: in tei 27C010 1M 128K x 8 CHMOS EPROM • JEDEC Approved EPROM Pinouts — 32-Pin DIP, 32-Pln PLCC — Simple Upgrade from Lower Densities ■ Complete Upgradfe Capability to Higher Densities ■ Versatile EPROM Features — CMOS and TTL Compatibility — Two Line Control

i27c010

Abstract: intel 5113 eprom
Contextual Info: in te i 27C010 1M 128K x 8 CHMOS EPROM JEDEC Approved EPROM Pinouts -3 2 -P in DIP, 32-Pin PLCC — Simple Upgrade from Lower Densities Fast Programming — Qulck-Pulse ProgrammingTM Algorithm — Programming Time as Fast as 15 Seconds Complete Upgrade Capability to Higher

intel 27C010

Abstract: 27C010-120V10 27C010-200V10 27C010 27C010-150V10 LD27C010 P27C010-150V10 27C0T0
Contextual Info: intei 27C010 1M 128K x 8 CHMOS EPROM • JEDEC Approved EPROM Pinouts — 32-Pin DIP, 32-Pln PLCC — Simple Upgrade from Lower Densities ■ Complete Upgradfe Capability to Higher Densities ■ Fast Programming — Qufck-Pulse Programming Algorithm — Programming Time as Fast as 15

PPS-GF30-FR

Abstract: 5408803217400
Contextual Info: PRECI-DIP SA - Page 1 of 2 PGA / BGA / PLCC - PLCC SURFACE MOUNT Series 540 PGA / BGA / PLCC - PLCC surface mount PLCC Socket for Plastic Leaded Chip carrier PLCC , Surface mount PLCC sockets with SMT terminations come with square sizes for IC-packages according to JEDEC MO-047,

Contextual Info: CYM1465 if CYPRESS Features • High-density 4-megabit SRAM module • High-speed CMOS SRAMs — Access time o f 70 ns • Low active power — 605 mW max. • 2V data retention (L Version) • JEDEC-compatible pinout • 32-pin, 0.6-inch-wide DIP package

27C210-120V10

Abstract: 27C210-150V10 27C210 27C210-200V10 N27C210-150V10 N27C210-200V10 P27C210-150V10 P27C210-200V10
Contextual Info: inte! 27C210 1M 64K x 16 CHMOS EPROM • JEDEC Approved EPROM Pinouts — 40-Pin DIP — 44-Pin PLCC ■ Complete Upgrade to Higher Densities ■ Versatile EPROM Features — CMOS and TTL Compatibility — Two Line Control ■ High-Performance — 120 ns ± 10% VCc

540-88-068-17-400

Abstract: 540-88-032-17-400 PPS-GF30-FR MO-047 MO-052 540-88-084-17-400
Contextual Info: PRECI-DIP SA ● Home Series 540 ● About Us ● Products Technical Assistance ● PGA / BGA / PLCC - PLCC surface mount PLCC Socket for Plastic Leaded Chip carrier PLCC , Surface mount PLCC sockets with SMT terminations come with square sizes for IC-packages according to JEDEC MO-047,

648E2

Abstract: CYM1465 CYM1465PD-150C
Contextual Info: CYM1465 ^ CYPRESS Features • High-densitv 4-megabit SRAM module • High-speed CMOS SRAMs — Access time o f 70 ns • Low active power — 605 mW max. • 2V data retention (L Version) • JEDEC-compatible pinout • 32-pin, 0.6-inch-wide DIP package

27C020

Abstract: 27C020 PLCC 27C020-150V10 27C020-200V10 A12C N27C020-200V10 P27C020-200V10
Contextual Info: P R B O M O K IA IIW in te i 27C020 2M 256K x 8 CHMOS EPROM • JEDEC Approved EPROM Pinouts — 32-Pin DIP, 32-Pln PLCC — Simple Upgrade from Lower Densities ■ Complete Upgrade Capability to Higher Densities ■ Fast Programming — Quick-Pulse ProgrammingTM

A12C

Abstract: A14C CYM1464 cs 2502
Contextual Info: YPRESS SEMICONDUCTOR Mb E \ T -4 6 -2 3 -1 4 CYPRESS SEMICONDUCTOR Features Hlgh-density 4-megabit SRAM module High-speed CMOS SRAMs — Access time of 20 ns Low active power — 1.93VV max. JEDEC-compatible pinout 32-pln, 0.6-inch-ttide DIP package TTL-compatible inputs and outputs

CYM1464

Abstract: CYM1464PD-30C
Contextual Info: CYM1464 w m f CYPRESS 512K x 8 Static RAM Module Features Functional Description • High-density 4-megabit SRAM module • High-speed CMOS SRAMs — Access time o f 20 ns • Low active power — 1.93W max. • JEDEC-compatible pinout • 32-pin, 0.6-inch-wide DIP package

intel i3 block diagram

Abstract: 27C220-200V10 intel PLD 27C220-150V10
Contextual Info: INTEL CORP MEMORY/PL] / 44E D H 4fl2bl7b 0 Ü 7 1 7 0 0 b BITL5 27C220 2M (128K x 16) CHMOS EPROM Fast Programming — Quick-Pulse ProgrammlngTM Algorithm — Programming Times As Fast As 15 Seconds JEDEC Approved EPROM Pinouts - 4 0 - P in DIP — 44-Pin PLCC

27C210

Abstract: 27C210-150V10 27C210-200V10 N27C210-150V10 N27C210-200V10 P27C210-150V10 P27C210-200V10
Contextual Info: intei 27C210 1M 64K X 16 CHMOS EPROM JEDEC Approved EPROM Pinouts -4 0 -P in DIP -4 4 -P in PLCC Complete Upgrade to Higher Densities Versatile EPROM Features — CMOS and TTL Compatibility — Two Line Control High-Performance — 120 ns ± 10% Vcc — 50 mA Ice Active

CYM1465

Abstract: 648E2
Contextual Info: CYM1465 CYPRESS Features • High-densitv 4-megabit SRAM module • High-speed CMOS SRAMs — Access time o f 70 ns • Low active power — 605 mW max. • 2V data retention (L Version) • JEDEC-compatible pinout • 32-pin, 0.6-inch-wide DIP package • TTL-compatible inputs and outputs

27c220

Abstract: 27C210 27C220-150V10 N27C220-200V10 P27C220-200V10 27C220-200V10 29021
Contextual Info: m m w m M intel 27C220 2M 128K x 16 CHMOS EPROM Fast Programming JEDEC Approved EPROM Pinouts — 40-Pin DIP -4 4 -P in PLCC — Q uick-Pulse Program m ing Algorithm — Programming Times As Fast As 15 Seconds Surface Mount Packaging Available Complete Upgrade to Higher Densities

27C210-120V10

Contextual Info: in t e i 27C210 1M 64K x 16 CHMOS EPROM • JEDEC Approved EPROM Pinouts -4 0 -P in DIP -4 4 -P in PLCC ■ High-Performance — 120 ns ± 10% VCc — 50 mA Icc Active ■ Complete Upgrade to Higher Densities ■ Fast Programming — Quick-Pulse Programming

27C020

Abstract: 27C020-150V10 A10-A17 GPIA30R 27C020-200V10 N27C020-200V10 P27C020-200V10 29022
Contextual Info: P IR S O M O K IA R W ir r t e ! 27C020 2M 256K x 8 CHMOS EPROM • JEDEC Approved EPROM Pinouts — 32-Pin DIP, 32-Pln PLCC — Simple Upgrade from Lower Densities ■ Complete Upgrade Capability to Higher Densities ■ Fast Programming — Qulck-Puise P r o g r a m m i n g

AK616256D

Contextual Info: AK616256D 262,144 x 16 Bit CMOS/BiCMOS Static Random Access Memory ACCUTEK MICROCIRCUIT CORPORATION DESCRIPTION The Accutek AK616256D SRAM Module consists of four fast high performance SRAMs mounted on a low profile 48 pin DIP Board. The module utilizes four 28 pin 256K x 4 SRAMs in SOJ packages

Contextual Info: B U R R -B R O W N n ^ DCP0115 Series n Miniature 15V Input, 1W Isolated UNREGULATED DC/DC CONVERTERS FEATURES DESCRIPTION • STANDARD JEDEC PLASTIC PACKAGE • LOW PROFILE: 0.15" 3.8mm • SYNCHRONIZABLE The DCP0115 family is a series of high efficiency,

TPH20SST

Abstract: TTD18 TCC44B 84 pin plcc ic base TSD28 TPH32SST TCC32PSM2 ttd28 TTD16 TTD08
Contextual Info: CONNECTORS IC SOCKETS, Formed TAICOM type TSD DUAL IN-LINE DIL Open frame dual in-line IC sockets with large entry, dual wipe, stamped and formed contacts which offer high reliability at low cost. Black UL94V-0 low profile moulded bodies have closed based design and are end and side stackable. Pin spacing 2.54mm (0.1in) except