J1331 Search Results

LRS1381

Contextual Info: PRELIMINARY PRODUCT SPECIFICATIONS Integrated Circuits Group LRS1381 Stacked Chip 32M Flash and 4M SRAM Model No.: LRS1381 Spec No.: MFM2-J13318 Issue Date: March 16, 2001 sharp L R S1 3 8 1 • Handle this document carefully for it contains material protected by international copyright law.

Contextual Info: fiST SCS-THOMSON ^ 7 / . »»EILllgTOW Bgg_ AM81720-012 RF & MICROWAVE TRANSISTORS COMMUNICATIONS APPLICATIONS • i ■ ■ ■ ■ > REFRACTORY/GOLD METALLIZATION EMITTER SITE BALLASTED RUGGIZED VSWR oo:1 LOW THERMAL RESISTANCE INPUT/OUTPUT MATCHING

Contextual Info: SGS1H0MS0N 57. AM82731-012 ;IL11 ¥ M [ RF & MICROWAVE TRANSISTORS S-BAND RADAR APPLICATIONS P R E LIM IN AR Y DATA i R E F R A C T O R Y /G O L D M ETA LL IZA TIO N • E M IT T E R S ITE BALLASTED ■ LO W T H E R M A L R E S IS T A N C E ■ IN P U T /O U T P U T M A T C H IN G

Contextual Info: SGS-THOMSON AM82731-050 1H[ RF & MICROWAVE TRANSISTORS S-BAND RADAR APPLICATIONS REFRACTORY/GOLD METALLIZATION EMITTER SITE BALLASTED RUGGEDIZED VSWR 3:1 @ 1 dB OVER­ DRIVE LOW THERMAL RESISTANCE INPUT/OUTPUT MATCHING OVERLAY GEOMETRY METAL/CERAMIC HERMETIC PACKAGE

Contextual Info: 5 7 . SGS-THOMSON AM80912-030 m RF & MICROWAVE TRANSISTORS SPECIALITY AVIONICS/JTIDS APPLICATIONS REFRACTORY/GOLD METALLIZATION EMITTER SITE BALLASTED 15:1 VSWR CAPABILITY LOW RF THERMAL RESISTANCE INPUT/OUTPUT MATCHING OVERLAY GEOMETRY METAL/CERAMIC HERMETIC PACKAGE

Contextual Info: SGS-TH O M SO N ;[L1 § T M 1 § „„ A M 8 1 4 1 6 -0 2 0 RF & MICROWAVE TRANSISTORS COMMUNICATIONS APPLICATIONS • ■ . ■ ■ ■ REFRACTORY/GOLD METALLIZATION EMITTER SITE BALLASTED INPUT/OUTPUT MATCHING OVERLAY GEOMETRY METAL/CERAMIC HERMETIC PACKAGE

DB3n

Abstract: DA5P DA7p Db1n db3p J13-43 DA10N DA5N DB11P BDB06
Contextual Info: 19-4018; Rev 0; 3/06 MAX1217/MAX1218/MAX1219 Evaluation Kits The MAX1217/MAX1218/MAX1219 evaluation kits EV kits are fully assembled and tested circuit boards that contain all the components necessary to evaluate the performance of the MAX1217/MAX1218/MAX1219 dual, 12-bit,

Contextual Info: SCS-THOMSON AM0608-020 !H [ RF & MICROWAVE TRANSISTORS AVIONICS APPLICATIONS PRELIM INARY DATA . REFRACTORY/GOLD METALLIZATION • INTERNAL INPUT MATCHING ■ METAL/CERAMIC HERMETIC PACKAGE • P out = 20 W MIN. WITH 9.0 dB GAIN PIN CONNECTION DESCRIPTION

Contextual Info: / = 7 SGS-THOMSON A 7 /. M gfô@ lLi(glKi(M []igg_ A M 8 0 8 1 4 -0 2 5 RF & MICROWAVE TRANSISTORS _ L-BAND RADAR APPLICATIONS P R E LIM IN AR Y DATA • ■ ■ . > ■ ■ REFRACTORY/GOLD METALLIZATION EMITTER SITE BALLASTED

Contextual Info: S G S -1H 0M S 0N ^ 7 #. oain g^ i[Li(gTnRiis iiaoig§_ A M 8 0 8 1 4 -0 0 5 RF & M I C R O W A V E T R A N S I S T O R S L-BAND RADAR A P P L I C A T I O N S • R EFR AC TO R Y/G O LD M ETALLIZATION ■ EM ITTER SITE BALLASTED ■ 5:1 VSW R CAPABILITY

j1337

Abstract: MAX1436EVKIT SLVS 400 j1120 bd6p MAX1434EVKIT MAX1437ECQ MAX1437EVKIT MAX1438EVKIT j922
Contextual Info: 19-3741; Rev 1; 8/10 MAX1434/MAX1436/MAX1437/MAX1438 Evaluation Kits The MAX1434/MAX1436/MAX1437/MAX1438 evaluation kits EV kits are fully assembled and tested circuit boards that contain all the components necessary to evaluate the performance of this family of octal 10-/12bit analog-to-digital converters (ADCs). These ADCs

Contextual Info: 5 7 . SGS-IHOMSON AM83135-030 M. RF & M I C R O W A V E T R A N S I S T O R S S - B A N D RADAR A P P L I C A T I O N S P R E LIM IN AR Y DATA R E F R A C T O R Y /G O L D M E TA LLIZA TIO N E M IT T E R S ITE BALLASTED LO W TH E R M A L R E S IS T A N C E

XC18V01S020

Abstract: SLVS MAX1434EVKIT MAX1436EVKIT MAX1437ECQ MAX1437EVKIT MAX1438EVKIT C74 8pin BD5N C139
Contextual Info: 19-3741; Rev 0; 6/05 MAX1434/MAX1436/MAX1437/MAX1438 Evaluation Kits The MAX1434/MAX1436/MAX1437/MAX1438 evaluation kits EV kits are fully assembled and tested circuit boards that contain all the components necessary to evaluate the performance of this family of octal 10-/12bit analog-to-digital converters (ADCs). These ADCs

Contextual Info: SGS-THOMSON A M 8 1 2 1 4 -0 3 0 RF & MICROWAVE TRANSISTORS L-BAND RADAR APPLICATIONS REFRACTORY/GOLD METALLIZATION EM ITTER SITE BALLASTED RUG G EDIZED VSW R oo:1 LOW THERMAL RESISTANCE IN PU T/O U TPU T MATCHING OVERLAY G EO M ETRY METAL/CERAMIC HERMETIC PACKAGE

Contextual Info: r * 71 . = 7 S G S - T H O M S O N 0MD glE3lS i[Li« M(gi AM81214-015 RF & M I C R O W A V E T R A N S I S T O R S L-B A N D RADAR A P P L IC A T IO N S • REFRACTO RY/G O LD M ETALLIZATION ■ EM ITTER SITE BALLASTED ■ 5:1 VSW R CAPABILITY ■ LOW TH ER M AL RESISTANCE

Contextual Info: /= 7 SGS-THOMSON * 7 # . IMígia@HlL[l TO@iDigl_ AM82731-025 RF & MICROWAVE TRANSISTORS _ _ S-BAND RADAR APPLICATIONS I LOW PARASITIC, DOUBLE LEVEL MET­ AL DESIGN » REFRACTORY/GOLD METALLIZATION . EM ITTER SITE BALLASTED •

MSC1002

Abstract: AVIA c cube IC CD 4440 amplifier circuit diagram
Contextual Info: TABLE OF CONTENTS INTRODUCTION ALPHANUMERICAL INDEX Page 4 7 PRODUCTS GUIDE 11 -SYM BO LS -SELECTION GUIDE -C R O S S REFERENCE 13 14 37 DATASHEETS 45 INTRODUCTION SGS-THOMSON MICROELECTRONICS, RF PRODUCTS GROUP RF & MICROWAVE COMPONENTS DATABOOK, 2nd Edition

44t transistor

Abstract: AM1011-055
Contextual Info: /= 7 SGS-THOMSON * 7 / . HDW HlLig¥MD gi AM1011-055 RF & MICROWAVE TRANSISTORS L-BAND AVIONICS APPLICATIONS P R E L IM IN A R Y D A TA . REFRACTORY/GOLD METALLIZATION • EMITTER SITE BALLASTED ■ 10:1 VSWR CAPABILITY . LOW THERMAL RESISTANCE . INPUT/OUTPUT MATCHING