IRGC4050 Search Results
IRGC4050 Datasheets Context Search
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Contextual Info: PD - 95883 IRGC4050 IRGC4050 IGBT Die in Wafer Form l l C 100% Tested at Probe Available in Chip Pack, Unsawn Wafer Sawn on Film 250V VCE on = 1.90V (max.) 6" Wafer G E Key Electrical Characteristics (TO-247 package) Parameter V(BR)CES VCE(ON) VGE(th) |
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IRGC4050 IRGC4050 O-247 |