UL1439
Abstract: intel mark 164997 intel marking 00C863501A
Contextual Info: gX 58.6 47 NDTESi FULL ROUND- \ / D n s \ A X ;e e d e t a il b EE DETAIL A 1. THIS DRAWING TD BE USED IN CONJUNCTION WITH SUPPLIED 31] DATABASE FILE. ALL DIMENSIONS AND TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE AND ARE APPLICABLE AT PART FREE, UNCONSTRAINED STATE UNLESS
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6063-t5ul143900c863501aintel mark 164997+1intel marking
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intel mark 164997
Abstract: TDP 245 Y
Contextual Info: NOTES' 1. CLIP MUST STAY ATTACHED TD HEATSINK 2. CLIP SHDULD BE ABLE TD ROTATE 360 DEGREES AFTER CRIMPING PROCESS. 3. CRIMPING FEATURES SHDULD BE EQUAL DISTANCE FROM CENTERLINE DF HEATSINK. Ld I- 1 1 1 3 2 1 TDP 335C872401A 334C872401A 333C872401A 00C872401
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335c872401a334c872401a333c872401a00c872401+6pcm45f20x2000c872401a334c87e401aintel mark 164997tdp 245 y
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intel mark 164997
Abstract: PCM45F c623 marking UL1439
Contextual Info: NOTES: 1, CLIP MUST STAY ATTACHED TD HEATSINK 2. CLIP SHDULD NDT BE ABLE TD ROTATE 360 DEGREES AFTER CRIMPING PRDCESS, 3. CRIMPING FEATURES SHDULD BE EQUAL DISTANCE FRDM CENTERLINE DF HEATSINK, 4, TD LERANCEi U N LESS OTHERW ISE S P E C IF IE D Ld IC PI >m
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335c877001a334c877001a333c877001apcm45f+3intel mark 164997c623 markingul1439
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intel g31 chipset motherboard
Abstract: BB17 foxconn motherboard ls 36 Motherboard Foxconn LS 36 AY21 intel marking STD 164997 AC4 honeywell g31 motherboard g31 Chipset Platform Design Guide AJ33 AJ34 AJ35 AJ36 AJ37 AJ38 AJ39 AJ40 AJ41 AJ42
Contextual Info: Intel G35 Express Chipset Thermal and Mechanical Design Guidelines — For the Intel® 82G35 Graphics and Memory Controller Hub GMCH August 2007 Document Number: 317609-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR
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82g35oth97d29081intel g31 chipset motherboard+9bb17foxconn motherboard ls 36motherboard foxconn ls 36ay21intel marking std 164997ac4 honeywellg31 motherboardg31 chipset platform design guideaj33 aj34 aj35 aj36 aj37 aj38 aj39 aj40 aj41 aj42
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foxconn g41
Abstract: g2100c888 Motherboard Foxconn LS 36 BTX 82G41 foxconn motherboard ls 36 Motherboard Foxconn LS 36 TIM-PCM45F intel g41 82Q45 3EE77-002
Contextual Info: Intel 4 Series Chipset Thermal and Mechanical Design Guidelines September 2008 Document Number: 319972-004 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT
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d29081foxconn g41g2100c888motherboard foxconn ls 36 btx+782g41foxconn motherboard ls 36motherboard foxconn ls 36tim-pcm45fintel g4182q453ee77-002
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d9258
Abstract: d92580 Loctite 7452 82X38 AVC cool indium paste TT-T-36 5SRTC-TT-T36-72 FLUKE 79 42SN
Contextual Info: Intel X38 Express Chipset Thermal and Mechanical Design Guidelines — For the Intel® 82X38 Memory Controller Hub MCH September 2007 Revision -001 Document Number: 317612-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR
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82x38d9258d92580loctite 7452+6avc coolindium pastett-t-365srtc-tt-t36-72fluke 7942sn
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E11663-001
Abstract: Loctite 7452 honeywell pcm45 DDR2-667 DDR2-800 PCM45F FLUKE 79 intel chipset g 41 motherboard no display chipset dual core intel BGA heatsink compressive force
Contextual Info: Intel 3210 and 3200 Chipset Thermal/Mechanical Design Guide November 2007 Reference Number: 318465 Revision: 001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS
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5m-1994e11663-001loctite 7452honeywell pcm45+7ddr2-667ddr2-800pcm45ffluke 79intel chipset g 41 motherboard no displaychipset dual core intelbga heatsink compressive force
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