INTEL 48 TSOP Search Results

Contextual Info: PA48-40-1TS Data Sheet 48 pin TSOP socket/40 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction The PA48-40-1TS adapter converts the pinout of Intel E28F200CV/400CV flash memories in 48 pin TSOP packages to a 40 pin DIP footprint for use on several programmers.

enplas

Abstract: 28F001BX 28F002BC 28F002BX 28F010 28F020
Contextual Info: SOCKETS TESCO INTERNATIONAL ENPLAS TSOP Type I • ■ ■ ■ ■ Supports Intel Flash memory components 32, 40, and 48 pin TSOP PROM programming and test socket Ideal for automation/burn-in Zero insertion force Low profile number of moving parts, which provides

PLUS48

Abstract: sprint sms
Contextual Info: PROM PROGRAMMERS SMS SPRINT PLUS48 • ■ ■ ■ ■ ■ ■ ■ Supports all Intel Flash memory components Universal programming of memory, microprocessor and logic devices Easy-to-use operating interface via PC parallel port Standard 48-pin DIP socket

PLUS48

Abstract: 48-pin TSOP I flash memory tsop 48 PIN SOCKET 28F001BX 28F002BC 28F002BX 28F010 28F020
Contextual Info: PROM PROGRAMMERS SMS SPRINT PLUS48 • ■ ■ ■ ■ ■ ■ ■ Supports all Intel Flash memory components Universal programming of memory, microprocessor and logic devices Easy-to-use operating interface via PC parallel port Standard 48 pin DIP socket

TSOP 48 socket

Contextual Info: SOCKETS/SOCKET TOOLS TESCO INTERNATIONAL ENPLAS TSOP Type I • ■ ■ ■ ■ Supports Intel Flash memory components 32, 40, and 48 pin TSOP PROM programming and test socket Ideal for automation/burn-in Zero insertion force Low profile ENPLAS’ open-top TSOP Type I series

Contextual Info: Page 1 of 26 IA80152 Preliminary Data Sheet UNIVERSAL COMMUNICATIONS CONTROLLER FEATURES • Form, Fit, and Function Compatible with the Intel 80152 • Two-Channel DMA With Multiple Transfer Modes • Packaging options available − 48 Pin Plastic or Ceramic DIP

GA27-3093-04

Abstract: c8051 microcontroller 48-Pin TSOP Type 1, CPL C8051 48-Pin TSOP - Type 1, CPL 8051 opcode hexadecimal with mnemonic sheet IA82510 GA27-3093 80C152JA IA80C152
Contextual Info: Page 1 of 32 IA80C152 Preliminary Data Sheet UNIVERSAL COMMUNICATIONS CONTROLLER FEATURES • Form, Fit, and Function Compatible with the Intel 80C152 • Two-Channel DMA With Multiple Transfer Modes • Packaging options available − 48 Pin Plastic or Ceramic DIP

SLG8SP513V

Abstract: LE82GM965 NH82801HBM R5C833 NH82801HB r433a 78H24 ITE8512 LE82GM965-SLA5T-MM isl62371
Contextual Info: 1 2 3 4 5 6 7 8 FM6B Hepburn Intel UMA VER : 3B FM6B M/B PCB A A FAN & THERMAL Merom or Penryn POWER SYSTEM RESET CIRCUIT BATT CHARGER AC/BATT CONNECTOR PG 54 SMSC1423 478 Micro-FCPGA PG 3,4 SLG8SP513V (QFN-64) +3.3V_SUS/+5V_SUS CPU VR PG 48 REGULATOR PG 17

TSOP 32 socket

Abstract: Yamaichi socket adapters Intel 48 TSOP Yamaichi SSOP socket adapters wand intel manual TSOP 48 socket
Contextual Info: SOCKETS/SOCKET TOOLS INTEL TSOP Precision Vacuum Wand • ■ ■ ■ ■ ■ ■ Reduces bent leads Increases process throughput time Minimizes handling Utilizes guide pins Eliminates manual alignments Works with Yamaichi* TSOP sockets and Intel TSOP trays

48pin flash programmer circuit

Abstract: intel manual PLCC 68 intel INTEL 56BALL
Contextual Info: PROM PROGRAMMERS INTEL Intel Flash Memory Programmer • ■ ■ ■ ■ Advanced-capability engineering programmer – Support capability below 5V logic levels – Extremely fast programming performance – 56-lead TSOP socket module supports all lead counts

am29ma16

Abstract: AM29M16 AM29M16 PLD atmel 404 93c46 29f512 gal18v8 ATMEL 24C32A COP8622C atmel 93C46 AT27040
Contextual Info: Ironwood Electronics Programming Adapters PR.1 Programming Adapters allow the programming of PROM, PLD, EPROM, EEPROM or PAL devices on programmers or ATE equipment with DIP sockets. We support PLCC, LCC, PGA, SOIC including TSOP , FP, BGA and QFP packages.

dap013

Abstract: DAP011 free pdf download P55 MOSFET P55 MOSFET mosfet d38 equivalent am2 SOCKET PIN LAYOUT b30 c250 rp633 LA185 2N3904 A35
Contextual Info: A 4 3 2 B 1 INDEX 2 CPU SOCKET 7 3 CLOCK GENERATOR 4 MTXC HOST INTERFACE 5 MTXC SYSTEM INTERFACE 6 CACHE 1 7 CACHE 2 8 DIMM 1 9 DIMM 2 10 SYSTEM BIOS, TSOP 11 PIIX4 1 12 PIIX4 2 13 IDE INTERFACE 14 ULTRA IO CONTROLLER 15 PARALLEL PORT 16 KB, FLOPPY, & COM PORTS

PLCC 44 intel package dimensions

Abstract: SmartDie 28F008B3 28F008C3 28F016B3 28F032B3 28F032C3 28F160B3 28F160F3 28F320B3
Contextual Info: Flash Memory Quick Reference Guide ion 6 Vers ’99 Jan. Intel package lineup Intel Package Lineup • Software Builder–Application software for Intel Flash memory products. • Online Utilities–Understand how Intel® Flash memory products will perform in your application in regards to cycling time/duration and power

Contextual Info: 8Mx72 bits PC100/PC133 SDRAM Unbuffered DIMM based on 8Mx8 SDRAM with LVTTL, 4 banks & 4K Refresh GMM2739233ETG Description The GMM2739233ETG is a 8M x 72bits Synchronous Dynamic RAM MODULE which is assembled 9 pieces of 8M x 8bits Synchronous DRAMs in 54 pin TSOP II

IMC016FLSC

Abstract: 28F320C3 IMC008FLSC PLCC 44 intel package dimensions 28F800C3a 28f800b5 3 Volt Intel StrataFlash Memory 28F160S5 28F400B5 28F008B3
Contextual Info: Flash Memory Quick Reference Guide ion 9 Vers ’99 April Intel package and tools lineup Intel Package and Tools Lineup • Software Builder–Application software for Intel Flash memory products. • Online Utilities–Understand how Intel® Flash memory products will

Migration Guide for Intel StrataFlash Memory J

Abstract: Intel StrataFlash Memory j3 Intel Stacked CSP 1997 28F008B3 28F008S5 28F016B3 28F128W18 28F160B3 28F320B3 28F800B3
Contextual Info: PRODUCT SELECTION MATRIX P Intel 1.8V Wireless Flash W18/W30 R O D Intel StrataFlash® Memory (J3) U C T S Synchronous Intel StrataFlash® Memory (K3/K18) Advanced+ Boot Block (C3) X8 Organization X16 8 Mb 16 Mb 32 Mb Density 64 Mb 128 Mb 256 Mb Burst

Contextual Info: 16Mx72 bits PC100/PC133 SDRAM Registered DIMM based on 8Mx8 SDRAM with LVTTL, 4 banks & 4K Refresh GMM27316230ETG Description The GMM27316230ETG is a 16M x 72bits Synchronous Dynamic RAM MODULE which is assembled 18 pieces of 16M x 4bits Synchronous DRAMs in 54 pin TSOP II, 2

SmartDie

Abstract: 28F008B3 28F016B3 28F032B3 28F032C3 28F160B3 28F160F3 28F320B3 28F400B3 28F800B3
Contextual Info: Flash Memory Quick Reference Guide ion 5 Vers ’98 Aug. Intel package lineup Intel Package Lineup Refer to Intel’s World Wide Web Site for Additional Flash Information Development Tools/Electronic Tools Catalog http://developer.intel.com/design/flash/swtools/

HME DRAM

Contextual Info: 8Mx72 bits PC100/PC133 SDRAM Registered DIMM based on 8Mx8 SDRAM with LVTTL, 4 banks & 4K Refresh GMM2739230EPTG Description Features The GMM2739230EPTG is a 8M x 72bits Synchronous Dynamic RAM MODULE which is assembled 9 pieces of 8M x 8bits Synchronous DRAMs in 54 pin TSOP II

28F640J5a

Abstract: iMC016FLSG 28F160B3 IMC016FLSC 9021b iMC008FLSC flash memory 5v 16m SmartDie 28F016B3 28F160F3
Contextual Info: Flash Memory Quick Reference Guide ion 4 Vers ’98 June Flash Memory Components for New Designs New designs should be based on Intel’s “components for new designs” shown in bold text in this guide. For information on our full product line, including extended temperature products, contact your Intel Sales representative/distributor or refer to our linecard available on Intel’s Web site.

PC133-SDRAM

Abstract: GMM27316233ENTG-7K
Contextual Info: 16Mx72 bits PC100/PC133 SDRAM Unbuffered DIMM based on 8Mx8 SDRAM with LVTTL, 4 banks & 4K Refresh GMM27316233ENTG Description The GMM27316233ENTG is a 16M x 72bits Synchronous Dynamic RAM MODULE which is assembled 18 pieces of 8M x 8bits Synchronous DRAMs in 54 pin TSOP II

Contextual Info: VS26417801B,VS46417801B 2M,4MX64-Bit SDRAM Module VIS Description The VS26417801B and VS46417801B are 2M x 64 - bit and 4M x 64 - bit dual - in - line synchronous dynamic RAM module DIMM . It is mounted with 8/16 pieces of 2M x 8 synchronous DRAM(VG3617801BT), and each in a standard 44 pin TSOP package. The VS26417801B and

vanguard

Contextual Info: VS26417801C,VS46417801C 2M,4MX64-Bit SDRAM Module VIS Description The VS26417801C and VS46417801C are 2M x 64 - bit and 4M x 64 - bit dual - in - line synchronous dynamic RAM module DIMM . It is mounted with 8/16 pieces of 2M x 8 synchronous DRAM(VG3617801CT), and each in a standard 44 pin TSOP package. The VS26417801C and

intel packaging

Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays
Contextual Info: 2 1 Introduction 1/20/97 6:22 PM CH01WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 1 INTRODUCTION 1.1. OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power.Today’s products can feature more than