ICK PGA Search Results

Heatsinks

Contextual Info: Hola1 H A H Heatsinks for PGAs and BGAs art. no. B ICK BGA 35 x 35 WLF . 35 x 35 art. no. C D ICK BGA 35 x 35 x 10 WLF . 35 x 35 art. no. E F ICK BGA 40 x 40 WLF . 40 x 40 art. no. G ICK BGA 40 x 40 x 10 WLF . 40 x 40 art. no. H I ICK BGA 42,5 x 45

Heatsinks

Contextual Info: Hola1 H A H Heatsinks for PGA art. no. B C ICK PGA 18 x 18 WLF . 45 x 45 art. no. D ICK PGA 19 x 19 WLF . 19 x 19 art. no. E F ICK PGA 19 x 19 x 12 WLF . 47 x 47 art. no. G H ICK PGA 20 x 20 WLF . 50 x 50 art. no. I K ICK PGA 20 x 20 K WLF . 50 x 50

15X15

Abstract: Heatsinks 43X43 WLFT 405
Contextual Info: Hola1 H A H Heatsinks for PGA art. no. B C ICK PGA 15 x 15 WLF . 37 x 38 art. no. D ICK PGA 16 x 16 x 8 WLF . 40 x 40 art. no. E F ICK PGA 16 x 16 x 12 WLF . 40 x 40 art. no. G H ICK PGA 17 x 17 WLF . 43 x 43 art. no. I K ICK PGA 17 x 17 x 8 WLF . 43 x 43

WLFT 404

Abstract: ick pga 14x14
Contextual Info: Hola1 H A H Heatsinks for PGA B C art. no. D ICK PGA 9 x 9 WLF . 24 x 24 art. no. E F ICK PGA 11 x 11 WLF . 24 x 27 art. no. G H ICK PGA 11 x 11 x 12 WLF . 24 x 27 art. no. I K ICK PGA 14 x 14 WLF . 31 x 34 art. no. L ICK PGA 14 x 14 x 12 WLF . 36 x 36

Heatsinks

Abstract: 23X23
Contextual Info: Hola1 H A H Heatsinks for PGAs and BGAs art. no. B ICK BGA 23 x 23 WLF . 23 x 23 art. no. C D ICK BGA 23 x 23 x 10 WLF . 23 x 23 art. no. E F ICK BGA 27 x 27 WLF . 27 x 27 art. no. G ICK BGA 27 x 27 x 10 WLF . 27 x 27 art. no. H I ICK BGA 31 x 31 WLF . 31 x 31

20-Polig

Abstract: 1416L
Contextual Info: ICK … L Dissipateurs spéciaux pour CI-DIL 1 L 6,3 Art. Nr. Art. No. Art. n° ICK 6 8L ICK 14 16 L ICK 20 L 4,8 4,8 ICK … B 1 L 19 Gehäuse for case pour boîtiers Maße/ Dimensions [mm] L RW [K/W] Art. Nr. Art. No. Art. n° Polzahl No. of contacts Nbr. de contacts

Sepa MFB 40 D 12

Abstract: intel 80486 ic 4570 Sepa MFB 40 D 05 SEPA MFB LA 4570 SEPA Sepa MFB 50 FAN 3792 pentium 200 mmx
Contextual Info: Hola1 H A H Active heatsinks for processors B C art. no. LA LA LA LA D ICK ICK ICK ICK 15 17 18 21 x x x x 15 17 18 21 please indicate: E Rth [K/W] suitable for processor type 2.3 1.6 1.5 1.4 universal universal universal universal . . . . A 37.92

Heatsinks

Abstract: Socket-370
Contextual Info: Hola1 H A H Heatsinks for PGA art. no. B C ICK PGA 20 x 20 x 8 WLF . 50 x 50 art. no. D E ICK PGA 20 x 20 x 8 K WLF . 50 x 50 art. no. F with fixing clamp for socket 7 and socket 370 G ICK PGA 20 x 20 x 12 WLF . 50 x 50 art. no. H I K ICK PGA 20 x 20 x 12 K

Contextual Info: Heatsinks for PGA art. no. ICK PGA 20 x 20 x 8 W L F . 5 0 x 5 0 art. no. ICK PGA 2 0 x 2 0 x 8 K W L F . 5 0 x 5 0 with fixing clam p for socket 7 and socket 3 7 0 art. no. ICK PGA 2 0 x 2 0 x 1 0 W L F . 4 8 x 4 8 art. no. ICK PGA 2 0 x 2 0 x 1 2 W L F . 5 0 x 5 0

pc cooler fan

Abstract: intel 80486 k6-2 500 intel pentium mmx 80486 pentium mmx PENTIUM k6III pentium 200 mmx Pentium MMX MODULE
Contextual Info: Hola1 H A H Passive heatsinks for processors B art. no. Rth [K/W] suitable for processor type 6.1 4.5 DEC Alpha-AXP DEC Alpha-AXP ICK A 10 ICK A 20 C dim. [mm] A 10 20 D E art. no. Rth [K/W] suitable for processor type 8.1 Power PC ICK PPC 51 F fixing method:

14x14

Contextual Info: Hola1 H A H Heatsinks for PGAs and BGAs B C – particularly suited for Ball Grid Arrays – heatsink dimensions match the respective BGA-type – can be glued directly on the BGA component D art. no. E ICK BGA 10 x 10 WLF . 10 x 10 art. no. F ICK BGA 10 x 10 x 10

Heatsinks

Abstract: BGA16
Contextual Info: Dissipateurs pour BGA 6 RW [K/W] 31 31 1,8 ICK BGA 31 x 31 WLF … 31 x 31 Heatsinks for BGA’s 20 16 12 8 4 1 2 3 4 5 6 V [m/s] 10 RW 31 31 [K/W] 20 16 12 1,8 ICK BGA 31 x 31 x 10 WLF … 31 x 31 8 4 1 2 3 4 5 6 V [m/s] 6 RW [K/W] 35 35 1,8 ICK BGA 35 x 35

Contextual Info: Dissipateurs pour BGA RW [K/W] 31 31 1,8 ICK BGA 31 x 31 WLF … 31 x 31 Heatsinks for BGA’s 6 Kühlkörper für BGA’s 20 16 12 8 4 1 2 3 4 5 6 V [m/s] 10 RW 31 31 [K/W] 20 16 12 1,8 ICK BGA 31 x 31 x 10 WLF … 31 x 31 8 4 1 2 3 4 5 6 V [m/s] 6 RW [K/W]

Contextual Info: ADVANCED INTERCONNECTIONS Molded Standoff for LIF PGA Sockets 5 Energy Way, P.O. Box 1019, West Warw ick, Rl 02893 • Tel. 401 -823-5200 • FAX 401-823-8723 Molded Standoff for LIF PGA Sockets Standard Sockets SOS or SIS - Standard Molded Standoff Sockets

Contextual Info: ADVANCED INTERCONNECTIONS Tape Sealed PGA Sockets 5 Energy Way, P.O. Box 1019, West Warw ick, Rl 02893 • Tel. 401-8 2 3 -5 20 0 • FAX 401-823-8723 Tape Sealed PGA Sockets Features: Terminal Information • Removable tape seal protects plated contact in harsh environments.

footprint 8M1-A

Contextual Info: ADVANCED INTERCONNECTIONS PGA Footprints 5 Energy Way, P.O. Box 1019, W e st Warw ick, Rl 02893 • Tel. 4 0 1 -8 2 3 -5 20 0 • FAX 401-823-8723 PGA Socket and Adapter Footprints 8 Pins Footprint Number 8" _J ^ 9 Pins Footprint Num ber 9* L .300 Sq. f 7.62

Heatsinks

Contextual Info: Kühlkörper für BGA’s Dissipateurs pour BGA – convient particulièrement pour les Ball Grid Arrays – dimensions du dissipateur correspondent au type de BGA respectif – à coller directement sur le composant BGA RW 35 [K/W] 30 10 10 25 1,8 ICK BGA 10 x 10

rtv 159

Abstract: textool socket TE zip socket rtv 157 TEXTOOL
Contextual Info: Table of Contents ADVANCED INTERCONNECTIONS 5 Energy Way, P.O. Box 1019, W est Warw ick, Rl 02893 • Tel. 4 0 1 -823-5200 • FAX 401-823-8723 D I P S e c t i o n Pages 8 through 43 Description Open Frame DIP Sockets . S e rie s . Page #

fc pga

Abstract: Intel Mendocino
Contextual Info: Passive heatsinks for processors Rth [K/W] suitable for processor type PEN 38 F 4.0 Intel Pentium®/ M M X /A M D ® K6-2/ AM D ® Kó-lll/ IDT C 6 / ID T W 2 A 4 9.5 4 9.5 38 5.0 ICK PEN 38 K 4.0 Intel® Pentium®/ M M X /A M D ® K6-2/ AM D ® Kó-lll/ IDT C 6 / ID T W 2 A

ICKS 45

Abstract: MMX intel fc pga SLOT PGA 370
Contextual Info: Heatsinks for IC processor a rt. n o . page ^th [K/W ] dissipation m ounting method socket suitable fo r processor type conductive fo il/ cond. adhesive conductive fo il/ cond. adhesive universal universal universal universal loss IC K P G A 6 x 6 x 1 4 B 10

we dsp32

Abstract: xlxxx DSP32C FZL 101 DSP32C-SL pir 815
Contextual Info: WE DSP32C Digital Signal Processor Description The WE DSP32C Digital Signal Processor is a 32-bit, high-speed, programmable integrated circuit. The CMOS device is packaged in a standard 133-pin square pin-grid-array PGA package. Two execution units, the control arithmetic

74 hc 59581

Abstract: b768 transistor transistor smd 661 752 8 pin ic base socket round pin type lead 652B0082215-002 MM5231 702 transistor smd code LA9100 LGA 1155 Socket PIN diagram smd transistor w16
Contextual Info: 717 Technical portal and online community for Design Engineers - www.element-14.com Semiconductor Hardware & Thermal Management Page Page 727 725 725 732 739 732 749 736 725 724 723 723 724 721 720 722 726 752 728 751 Crystal Oscillator Sockets . . . . . . . . . . . . . . . . . .

processor 80486

Abstract: ick pga ventilateur
Contextual Info: IM i« dektfonik S 3 Lüfter unterstützte IC-Kühlkörper Dissipateurs ventilés pour Cl Fan-cooled IC Heatsinks UÜULILIULIUÜLILIÜ UUUUUUUUUÜÜ o K 1 •particularly high quality version ■inserted fan, thus particularly low height ■ Pin matrix 17 x 17, suitable for processor

dsp16

Contextual Info: Advance Data Sheet WE DSP16 Digital Signal Processor for Military Applications Description The WE DSP16 Digital Signal Processor is a 16-bit high-speed programmable integrated circuit. The device is fabricated in low-power CMOS technology and is available in a