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    IC37N 2204 Search Results

    IC37N 2204 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    61082-204506LF
    		Amphenol Communications Solutions BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 200 Positions. PDF
    77311-122-04LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 04 Positions, 2.54 mm Pitch. PDF
    77315-122-04LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 4 Positions 2.54mm (0.100in) Pitch, Right Angle PDF
    69192-204HLF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 04 Positions, 2.54 mm (0.100in) Pitch. PDF
    68022-204HLF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 4 Positions, 2.54 mm (0.100in)Pitch. PDF

    IC37N 2204 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    1403G4

    Abstract: g4 pc 50 u IC37 IC37N IC37N 2204 1404 yamaichi 1403G 4206-G
    Contextual Info: IC37 Series Dual Inline Package DIP Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Current Rating: Operating Temperature Range: Mating Cycles: 1,000M Ω min. at 500V DC 700V AC for 1 minute


    Original     		/20mV IC37NP) IC37NR) IC37N UL94V-0 1403G4 g4 pc 50 u IC37 IC37N IC37N 2204 1404 yamaichi 1403G 4206-G PDF