IC SHIPPING TRAY Search Results

4x13

Contextual Info: DEVICE PACKING 1. SHIPPING CONTAINERS AND HANDLING 1.1 SHIPPING CONTAINER FORMS Figures 1 and 2 illustrate the shipping container forms for ordinary IC devices. Within the outer corrugated cardboard carton there are one or more inner cartons. These inner carton contain

Contextual Info: DEVICE PACKING 1 . SHIPPING CONTAINERS AND HANDLING 1 .1 SHIPPING CONTAINER FORMS Figures 1 and 2 illustrate the shipping container forms for ordinary IC devices. Within the outer corrugated cardboard carton there are one or more inner cartons. These inner carton contain

CP-52

Contextual Info: DEVICE PACKING 1 . SHIPPING CONTAINERS AND HANDLING 1 .1 SHIPPING CONTAINER FORMS Figures 1 and 2 illustrate the shipping container forms for ordinary IC devices. Within the outer corrugated cardboard carton there are one or more inner cartons. These inner carton contain

56mm carrier tape

Abstract: 28 pin ic TM 1628
Contextual Info: u Chapter 13 Packing Methods and Labels CHAPTER 13 PACKING METHODS AND LABELS Introduction Quality Pack Program Packing for Tubes Packing for Trays Packing for Tape and Reels Packing for Jewel Boxes Box Labeling Packages and Packing Publication Revision A 3/1/03

92HP61B7X5

Abstract: cxd9872 92HD73 stac9227x5 stac9228x5 ND07071 PEAK tray drawing 92HD73C1X5PRGXC1X TQFP Shipping Trays 92hd73c1x5
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: TB0812-05 DATE: 1/27/2009 Product Affected: 7 mm x 7 mm TQFP-48 shipped in tray Date Effective: Contact: Title: Phone #: Fax #:

PEAK MPPO PP6

Abstract: TRAY MPPO DAEWON tray drawing CABGA-208 daewon PEAK tray drawing IDT70V659S10BFG idt89h DAEWON drawing IDT70V657S12BFI
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: TB0812-03 DATE: 1/27/2009 Product Affected: 15 mm x 15 mm CABGA-196 & 208 shipped in tray Date Effective: Contact: Title: Phone #:

WNF008

Abstract: code res pack 8 SO3016 UNE008 spansion tray
Contextual Info: ‹ Chapter 10 Packing Methods and Labels CHAPTER 10 PACKING METHODS AND LABELS Introduction Quality Pack Program Packing for Tubes Packing for Trays Packing for Tape and Reels Box Labeling Packages and Packing Methodologies Handbook 1 March 2008 10-1 ‹ Chapter 10 Packing Methods and Labels

Side Brazed Ceramic Dual-In-Line Packages

Abstract: intel packaging databook Side Brazed Ceramic Dual-In-Line Packages 28 outline of the heat slug for JEDEC 64 CERAMIC LEADLESS CHIP CARRIER LCC 68 pin plcc socket view bottom BGA and QFP Package BGA package tray 64 tray tsop 1220 gate count
Contextual Info: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than nineteen million transistors, and device count is expected to increase to 100 million by the year

xn 1203

Contextual Info: 4 | THIS bftAVM IS UNMJBUSHE6. COPYRIGHT - I RELEASED PAR PUBUSATIiW B Y TYCO ELECTRONICS CORPORATION. ^ 3 I “T — . LOC R E V IS IO N S DW RIGHTS R E SER V E D - 4.30 c o REVISED ECR—08—016575 00.7 TE LOGO Sc DATE CODE J— 1_ o o [ 0 8 0 ] NOTES :

CERAMIC CHIP CARRIER LCC 68 socket

Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration
Contextual Info: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a

Contextual Info: THIS DRAWING IS UNPUBLISHED. COPYRIGHT - -, RELEASED FOR PUBLICATION ALL RIGHTS RESERVED. BY - REVISIONS LOC DW DESCRIPTION LTR c GROUNDING REVISED PER DWN DATE RK HMR 1APR 1 EC O -1 1-005301 APVD PANEL 14.no TE LOGO & DATE CODE 4.00 0 0 .7 0 DETAIL A S C A LE

TSOP 56 socket

Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817
Contextual Info: CHAPTER 1 INTRODUCTION OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex electronics designers are challenged to fully harness their computing power Today’s products can feature more than three million transistors and device count is expected to increase to one hundred million by the

intel packaging

Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays
Contextual Info: 2 1 Introduction 1/20/97 6:22 PM CH01WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 1 INTRODUCTION 1.1. OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power.Today’s products can feature more than

1734866-1

Contextual Info: 4 THIS DRAWING IS UNPUBLISHED. COPYRIGHT - RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. REVISIONS LOC ALL RIGHTS RESERVED. DW LTR DESCRIPTION B1 30.82i0.3fi DATE DWN SC WK 090CT08 REVISED ECR—08—024967 APVD D D 31.6±0.38 12.55 # 4 -4 0 SCREW

Contextual Info: 4 THIS DRAWING IS UNPUBLISHED. COPYRIGHT 3 | RELEASED BY TYCO ELECTRONICS CORPORATION. FOR PUBLICATION 2 AUG .20 06. 1 LOC ALL RIGHTS RESERVED. R E V IS IO N S DW P LTR DESCRIPTION B2 GROUNDING PANEL OPTION TE LOGO & DATE CODE 12.80 DATE OWN 09APR09 E C R —0 9 —0 0 1 6 1 2

990pc

Contextual Info: THIS DRAWING IS UNPUBLISHED. COPYRIGHT RELEASED FOR PUBLICATION ALL RIGHTS RESERVED. BY - REVISIONS LOC DW DESCRIPTION LTR A1 REVISED PER ECO- DATE 07MAR11 -005301 DWN APVD RK HMR NOTES: 1. M ATERIAL : 3 0 .8 0 + 0 . 1.1 HOUSING: TH ER M O P LA STIC , U L 9 4 V - 0

Contextual Info: T H IS D R A W IN G IS C O P Y R IG H T U N P U B L IS H E D . 2003 BY ^ C O RELEASED E L E C T R O N IC S FO R ALL C O R P O R A T IO N . P U B L IC A T IO N R IG H T S APR ,2 0 0 3 . R E V IS IO N S RESERVED. NOTES: 1. MATERIAL HOUSING : CONTACTS : SHELL :

d connector screw lock torque

Abstract: 60JU L465 3-1634218-2
Contextual Info: T H IS D R A W IN G IS C O P Y R IG H T U N P U B L IS H E D . 2003 BY ^ C O RELEASED E L E C T R O N IC S C O R P O R A T IO N . FO R ALL P U B L IC A T IO N R IG H T S APR ,2 0 0 3 . R E V IS IO N S RESERVED. E LTR NOTES: F 1. MATERIAL HOUSING : CONTACTS :

Contextual Info: 4 3 THIS DRAWING IS UNPUBLISHED. COPYRIGHT RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. LOC AUG ,2006. ALL RIGHTS RESERVED. R E V IS IO N S DW p LTR DESCRIPTION B D DATE DWN B.W s .c 1 1 FEB09 REVISED ECR—0 9 - 0 0 2 8 2 1 APVD D NOTES:

Contextual Info: T H IS D R A W IN G C O P Y R IG H T IS U N P U B L IS H E D . 2003 BY ^ C O REUEASED EU E C TR O N IC S C O R P O R A T IO N . FO R AUU P U B U IC A T IO N R IG H T S APR ,2 0 0 3 - R E V IS IO N S RESERVED. E LTR F NOTES: 1. MATERIAL HOUSING : CONTACTS :

Contextual Info: 4 3 THIS DRAWING IS UNPUBLISHED. COPYRIGHT RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. AUG ,2006. LOC ALL RIGHTS RESERVED. REVISIONS DW p LTR DESCRIPTION B DATE DWN 11FEB09 REVISED ECR— 0 9 - 0 0 2 8 2 1 APVD B.W s.c D D NOTES: ROHS 2 0 0 2 /9 5 /E C

Contextual Info: REVISION HISTORY Ky NOTES! U N LESS OTHERWISE SPECIFIED 1. TRAYS MUST MEET ALL REQUIREMENTS OF AMKOR/ANAM § 01 -04-31 - 2 2 B 3 PROCUREMENT SPE C FOR SHIPPING TRAY. 2. BAKEABLE TRAYS ARE INTENDED TO BE CONTINUOUSLY 3. TOTAL USABLE CELL COUNT IS 490. 4. TRAY VACUUM PICKUP METHOD REQUIRES A 28XZ8m m

Contextual Info: THIS DRAWING IS UNPUBLISHED. COPYRIGHT RELEASED FOR PUBLICATION AUG .2006. L0C ALL RIGHTS RESERVED. BY TYCO ELECTRONICS CORPORATION. R E V IS IO N S DW p LTR DESCRIPTION A REVISED ECR—0 8 —0 1 1 7 2 1 DATE DWN APVD 08M AR08 SH WK 12.00 D D 16.1 13.1

HU 20001

Abstract: PBT 30gf
Contextual Info: 4 3 THIS DRAWING IS UNPUBLISHED. COPYRIGHT 2 RELEASED FOR PUBLICATION ALL RIGHTS RESERVED. BY - REVISIONS LOC DW DESCRIPTION LTR REVISED PER ECO- 07MAR11 -005301 D o o C 14.5 PIN 1 1 7.50 APVD RK HMR D 00.90 + 0.08 DIM A 13.10 DWN DATE L0 G 0& DATE CODE