IC ITLSI Search Results

Contextual Info: MLL5913 thru MLL5956 Microsemi Corp. ? A-IV/I tub ftotiti experts 1V4 f t SCO rrSD ALE , 4 / h>i im*ie information call (61 2) 941-6300 D E S C R IP T IO N / F E A T U R E S LEADLESS GLASS ZENER DIODES • LEADLESS PACKAGE FOR SURFACE MOUNT TECHNOLOGY • IDEAL FOR HIGH DENSITY MOUNTING

mtx m1

Abstract: P243G man1 E52283
Contextual Info: 5/16-18 X 1 5/8STUD TYP 1. 17 4.40 1. MATERIAL COMPOSITION AND RATING: BASE - THERMOPLASTIC HARDWARE - PLATED COPPER ALLOY NOTES: UNLESS OTHERWISE SPECIFIED «V ECO IM TC uo 11/92 00 2/94 BY o o a u rrm UNRELEASED RELEASED oc BM GO fio U L P/N VOLTS FILE NO.

C520D

Abstract: D347D D147d information applikation D348D Halbleiterbauelemente DDR "halbleiterwerk frankfurt" lt 8216 diode "Mikroelektronik" Heft applikation heft
Contextual Info: E n n f lk ln lä B lQ Information Applikation l- C tS n o r T ik Autoren: Dipl.-Ing. Siegfried Güldner Dipl.-Ing. Henning Zinke Redaktion und Layout: Heinz Schulz Pmachlag: Peter Hoffmann Redakt ionakommi aaion: Heinz Schulz, Vorsitzender Dipl.-Ing. Egbert Knopke

k2740

Abstract: K-2740 G00174S
Contextual Info: T R I T Q Q U I N T S E M I C O N D U C T O R , I N C g i GA9104 200 MBaud ESCON ENDEC Features The state-of-the-art CMOS ENDEC chip, GA9104, implements the data and control encoding functions of the physical link of the ESCON standard. In addition, it perform s 16-bit CRC and parity