ICE65L08 Search Results

Contextual Info: R DiePlus Advantage iCE65L08F-TCS110I SiliconBlue November 24, 2010 1.0 Preliminary Data Sheet Supplement New package Supplement for CS110 4.35mm x 4.77 mm WLCSP (see iCE65 L-Series Data Sheet for Electrical and Architecture Characteristics) Figure 1: iCE65L08 WLCSP

Contextual Info: R iCE65 Ultra Low-Power mobileFPGA™ Family SiliconBlue November 12, 2009 2.0.1 Data Sheet Figure 1: iCE65 Family Architectural Features  First high-density, ultra low-power singlechip, SRAM mobileFPGA family specifically designed for hand-held applications and

Contextual Info: R DiePlus Advantage SiliconBlue January 25, 2011 2.0.6 Data Sheet DiePlus Advantage is SiliconBlue’s focused program to provide designers with an optimal device mounting solution for mobile handheld applications. This data sheet provides detailed information regarding DiePlus

ICE65L04F

Abstract: ICE65L01F d flip flop 7475 sublvds lvds d flip flop 7475 circuit diagram ice65l04 ICE65 442-665 ICE65L04F-L 48948
Contextual Info: iCE65 Ultra Low-Power mobileFPGA™ Family March 30, 2012 2.42 Data Sheet  First high-density, ultra low-power Figure 1: iCE65 Family Architectural Features single-chip, SRAM mobileFPGA family specifically designed for hand-held applications and long battery life

ICE65L04F

Abstract: sublvds lvds 65L02 Y20150 38448 337 BGA footprint mini din pcb mount 442-665 7475 D flip-flop ice65l04
Contextual Info: Handheld iCE: iCE65 Ultra Low-Power Programmable Logic Family R SiliconBlue March 25, 2009 1.4.4 Preliminary (SUBJECT TO CHANGE) First high-density, ultra low-power programmable logic family specifically designed for hand-held applications and long battery life