HTQFP32 Search Results

L-932

Contextual Info: PDF: 2000 Feb 02 Philips Semiconductors Package outline HTQFP32: plastic, heatsink thin quad flat package; 32 leads; body 5 x 5 x 1.0 mm SOT547-1 c y heathsink side X Dh 24 17 25 A 16 ZE e E HE Eh A 3 A A2 A1 w M θ bp pin 1 index Lp L 9 32 detail X 1 8

sot547

Contextual Info: PDF: 1999 Jun 15 Philips Semiconductors Package outline HTQFP32: plastic, heatsink thin quad flat package; 32 leads; body 5 x 5 x 1 mm SOT547-2 c y heathsink side X Dh 24 17 25 A 16 ZE e E HE Eh A 3 A A2 A1 w M θ bp Lp pin 1 index 32 L 9 detail X 1 8 ZD

SOT547

Contextual Info: PDF: 2003 Apr 07 Philips Semiconductors Package outline HTQFP32: plastic thermal enhanced thin quad flat package; 32 leads; body 5 x 5 x 1 mm; exposed die pad SOT547-1 c y exposed die pad side X Dh 24 17 25 A 16 ZE e E HE Eh A 3 A A2 A1 w M θ bp pin 1 index

Contextual Info: PDF: 2000 Feb 02 Philips Semiconductors Package outline HTQFP32: plastic, heatsink thin quad flat package; 32 leads; body 5 x 5 x 1.0 mm SOT547-2 c y heathsink side X Dh 24 17 25 A 16 ZE e E HE Eh A 3 A A2 A1 w M θ bp Lp pin 1 index 32 L 9 detail X 1 8

sot547

Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline HTQFP32: plastic, heatsink thin quad flat package; 32 leads; body 5 x 5 x 1 mm SOT547-1 c y heathsink side X Dh 24 17 25 A 16 ZE e E HE Eh A 3 A A2 A1 w M θ bp pin 1 index Lp L 9 32 detail X 1 8 ZD

R114426

Abstract: BLM11P300S dipsw_4 232270296001 433003036301 Philips 2322-702-96001 BLM11P300 AN99071 STM16 TP97036
Contextual Info: APPLICATION NOTE OM5808 demoboard negative supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package AN99071 TP97036.2/F5.5 Philips Semiconductors OM5808 demoboard negative supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package Application Note AN99071 Abstract

HTQFP100

Abstract: LQFP48 HBCC32 DB4042 CGY2110 TZA3001 TZA3013 TZA3023 TZA3031 TZA3033
Contextual Info: MSD818 Philips Semiconductors Input Fiber Optic Interface ICs Line Card Part number Datarate Mb/s Package Type Bare Die TRANSIMPEDANCE AMPLIFIERS TZA3033 TZA3023 TZA3043 TZA3013 CGY2102 CGY2110 CGY2140 155 622 1250 2488 3250 10700 39813 SO8 SO8 SO8 HVQFN24

8b 10b m-phy

Abstract: cgy2141 LQFP32 LQFP48 QFP64 TSSOP16 TZA3014 TZA3034 TZA3044 BARE die
Contextual Info: Chip sets for optical networking Delivering the broadband revolution Introduction: As a result of the Internet revolution in communications infrastructure the demand for data transmission bandwidth is expanding tenfold each year. Fiber optic transmission is the

2222916

Abstract: B45196H1107M9 AN99072 OC48 STM16 TP97036 TZA3014 TZA3019 TZA3019A AN9907
Contextual Info: APPLICATION NOTE OM5809 demoboard positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package AN99072 TP97036.2/F5.5 Philips Semiconductors OM5809 demoboard positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package Application Note AN99072 Abstract

SOT411

Abstract: SnAg25Sb10 zirconium acetate AgCu28 Transistors smd mark code CuZn15 QFP100 Quad Flat Pack dimensions 271 Ceramic Disc Capacitors SOT538 smd led 5050
Contextual Info: Environmental Information ENVIRONMENTAL SAFETY Offering maximum benefit – minimum impact New technologies result in shared benefits for you our customers, balancing maximum technological benefits with minimum environmental impact. This starts with clever chip designs, which

MGT028

Abstract: TZA3019 TZA3019AHT TZA3019AVH TZA3019BHT TZA3019BVH TZA3019CHT TZA3019CVH
Contextual Info: INTEGRATED CIRCUITS DATA SHEET TZA3019 2.5 Gbits/s dual postamplifier with level detectors and 2 x 2 switch Product specification Supersedes data of 2000 Apr 10 File under Integrated Circuits, IC19 2001 Jun 25 Philips Semiconductors Product specification

TZA3019

Abstract: TZA3019AHT TZA3019AV TZA3019BHT TZA3019BV TZA3019CHT TZA3019CV INV137 MGT028
Contextual Info: INTEGRATED CIRCUITS DATA SHEET TZA3019 2.5 Gbits/s dual postamplifier with level detectors and 2 x 2 switch Preliminary specification File under Integrated Circuits, IC19 2000 Apr 10 Philips Semiconductors Preliminary specification 2.5 Gbits/s dual postamplifier with level

GAC 928

Abstract: TZA3014 TZA3014HT TZA3014U TZA3014VH
Contextual Info: INTEGRATED CIRCUITS DATA SHEET TZA3014 2.5 Gbits/s postamplifier with level detector Product specification Supersedes data of 2000 Aug 09 File under Integrated Circuits, IC19 2001 Jun 25 Philips Semiconductors Product specification 2.5 Gbits/s postamplifier with level detector

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JEDEC TRAY DIMENSIONS

Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
Contextual Info: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors

CGY2144

Abstract: CGY2141 Ultrafast Photodiode InGaAs MSD828 photodiode germanium STM-64 for FTTH LQFP32 QFP64 TZA3005 TZA3047
Contextual Info: Network Infrastructure Delivering the broadband revolution Philips Semiconductors More information, interaction and better quality of service.These are the challenges that face us with today’s Internet-driven broadband revolution.To meet these challenges,

Wavelength Converter

Contextual Info: INTEGRATED CIRCUITS DATA SHEET TZA3014 2.5 Gbits/s postamplifier with level detector Preliminary specification File under Integrated Circuits, IC19 2000 Aug 09 Philips Semiconductors Preliminary specification 2.5 Gbits/s postamplifier with level detector TZA3014