HSC8 Search Results

Contextual Info: F-207 0 ,80mmHI-SPEED SOCKET SERIES M ates with: 1,6mm thick cards, EEDP, HSC8 HSEC8 I POSITIONS 1 I PER ROW SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?HSEC8 Insulator Material Black Liquid Crystal Polymer Contact:

Contextual Info: S P E C IFIC A TIO N S For complete specifications see www.samtec.com?HSC8 Conductor: 'h oz Copper Contact Area: Hard Gold Plated Insulator: FR-4 Impedance Mismatch: -S E : 50Q ± 10% -D P : 100fi ± 10% Frequency Rating: -S E : 2.5 GHz -D P : 3.5 GHz Near End Crosstalk:

Contextual Info: MICRO EDGE-CARD SOCKET S P E C IFIC A TIO N S For complete specifications see www.samtec.com?M EC8-RA Right Angle Vertical and Edge Mount configuration available Mates with: (1,00mm) .0394" or (1,60mm) .062" thick cards, HSC8, EEDP Insulator Material: Black LCP

Contextual Info: F-203 0,80mm HI-SPEED JUMP CARD SPECIFICATIONS For complete specifications see www.samtec.com?HSC8 Conductor: 1 /2 oz Copper Contact Area: Hard Gold Plated Insulator: FR-4 Impedance Mismatch: –SE: 50Ω ± 10% –DP: 100Ω ± 10% Frequency Rating: –SE: 2.5 GHz

Contextual Info: F-203 MICRO EDGE - CARD SOCKET SPECIFICATIONS For complete specifications see www.samtec.com?MEC8-DV Mates with: 1,00mm .0394" or (1,60mm) .062" thick cards, HSC8 Insulator Material: Black LCP Contact Material: Phosphor Bronze Operating Temp Range: -65°C to +125°C

HSEC8

Abstract: pci expres card
Contextual Info: F-210-1 HSC8–040–02–25–DP 0,80mm .0315" RU8–140–25–SE–S–DV–BL RU8, HSC8 SERIES HIGH SPEED RISER CARD KIT • Board lock option SPECIFICATIONS RU8 For complete specifications and recommended PCB layouts see www.samtec.com?RU8 POSITIONS

Contextual Info: F-210 HSC8–040–02–25–DP 0,80mm .0315" RU8–140–25–SE–S–DV–BL RU8, HSC8 SERIES HIGH SPEED RISER CARD KIT SPECIFICATIONS RU8 For complete specifications and recommended PCB layouts see www.samtec.com?RU8 1 POSITIONS PER ROW Note: Some lengths,

Contextual Info: F-209 HSC8–040–02–25–DP RU8–140–25–SE–S–DV–BL 0,80mm RISER CARD KIT SPECIFICATIONS RU8 For complete specifications and recommended PCB layouts see www.samtec.com?RU8 1 POSITIONS PER ROW Note: Some lengths, styles and options are non-standard,

Contextual Info: F-206 0,80mmCARD SOCKETS S P E C IF IC A T IO N S Insu lator Material: 1,6mm thick cards, EEDP, HSC8 hukoeiiisw PLATING OPTION I M ates with: Liquid C rystal Polym er Contact: BeCu P lating: Au or Sn over POSITIONS PER ROW HSEC8 For com plete specifications and

Contextual Info: F-203 0,80mm HI-SPEED SOCKET SPECIFICATIONS HSEC8 –EM SERIES Mates with: 1,6mm thick card, HSC8 For complete specifications see www.samtec.com?HSEC8-EM Insulator Material: Liquid Crystal Polymer Contact: BeCu Current Rating: Testing Now! Operating Temp:

Contextual Info: F-211-1 HSC8–050–02–25–DP RU8–160–25–SE–L–DV–BL 0,80mm .0315" RU8, HSC8 SERIES HIGH SPEED RISER CARD KIT • Board lock option SPECIFICATIONS RU8 For complete specifications and recommended PCB layouts see www.samtec.com?RU8 POSITIONS

Contextual Info: H S C 8 -0 5 0 -0 1 —25—S E F -2 0 4 m samTec E ,8 SPECIFICATIONS For complete specifications see www.samtec.com?HSC8 Conductor: 'h oz Copper Contact Area: Hard Gold Plated Insulator: FR-4 Impedance Mismatch: -S E : 50Q ± 10% -D P : 100Q ± 10% Frequency Rating:

Contextual Info: F-207 ,80mmHI-SPEED SOCKET SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com? HSEC8 BO AR D -TO -B O AR D A P P L IC A T IO N S J|D|fi|[" Mates with: 1,6mm thick cards, " JR EEDP, HSC8, HSF8 n ^ HSEC8 SERIES T p •1 c

Contextual Info: F-209-2 DSEC–30–01–S–07.0–2–RA DSEC–50–01–L–07.0–2–RA DSEC SERIES DUAL STACK EDGE CARD SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?DSEC Mates with: 1,60mm .062" thick cards, HSC8, HSF8

Contextual Info: F-208-1 HSC8–040–02–25–DP HSEC8–160–01–S–DV–A HSEC8, HSC8 SERIES 0,80mm HI-SPEED SOCKET Mates with: 1,6mm thick cards, EEDP, HSC8 HSEC8 POSITIONS PER ROW 1 CARD THICKNESS PLATING OPTION DV OTHER OPTION A SPECIFICATIONS For complete specifications and

Contextual Info: F-211 HSC8–050–02–25–DP RU8–160–25–SE–L–DV–BL 0,80mm .0315" RU8, HSC8 SERIES HIGH SPEED RISER CARD KIT • Board lock option SPECIFICATIONS RU8 For complete specifications and recommended PCB layouts see www.samtec.com?RU8 POSITIONS PER ROW

HSC88

Contextual Info: HSC88 Silicon Schottky Barrier Diode for Various Detector, Mixer ADE-208-826 Z Rev 0 Nov. 1999 Features • Low capacitance. (C = 0.8pF max) • Low forward voltage. • Ultra small F lat P ackage (UFP) is suitablefor high density surface mounting and high speed assembly.

Contextual Info: HSC88 Silicon Schottky Barrier Diode for Various Detector, Mixer REJ03G0624-0100 Previous: ADE-208-826 Rev.1.00 Apr 12, 2005 Features • Low capacitance. (C = 0.8 pF max) • Low forward voltage. • Ultra small Flat Lead Package (UFP) is suitable for surface mount design.

Contextual Info: F-212 HSC8–050–02–25–DP RU8–160–25–SE–L–DV–BL 0,80mm .0315" RU8, HSC8 SERIES HIGH SPEED RISER CARD KIT • Board lock option SPECIFICATIONS RU8 For complete specifications and recommended PCB layouts see www.samtec.com?RU8 1 POSITIONS

PCB-100256-RU8-060-25-DP

Abstract: PCB-100256-RU8-040-25-DP
Contextual Info: TABLE 3 TABLE 2 No OF POS -SE SIGNAL TRACE QUANTITY -DP SIGNAL TRACE QUANITY -040 -050 -060 40 20 PER SIDE 50 (25 PER SIDE) 60 (30 PER SIDE) 26 (13 PER SIDE) 32 (16 PER SIDE) 38 (19 PER SIDE) HSC8 PART NUMBER PCB NUMBER HSC8-040-02-25-SE HSC8-040-02-25-DP

Contextual Info: TABLE 3 TABLE 2 -S E S IG N A L TR A C E -D P S IG N A L TR A C E Q U A N TITY Q U A N TITY No O F P O S -050 -070 50 25 P E R S ID E 70 (35 P E R S ID E ) 32 (16 P E R S ID E ) 46 (23 P E R S ID E ) HSC8 PART NUMBER PCB NUMBER HSC8-050-01-25-SE HSC8-050-01-25-DP

HSC88

Abstract: Hitachi DSA0047
Contextual Info: HSC88 Silicon Schottky Barrier Diode for Various Detector, Mixer ADE-208-826 Z Rev. 0 Nov. 1999 Features • Low capacitance. (C = 0.8pF max) • Low forward voltage. • Ultra small Flat Package (UFP) is suitablefor high density surface mounting and high speed assembly.

Contextual Info: F-206 I^ E T C I ,80 HI-SPEED OC UA UA W SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?HSEC8 HSEC8 SERIES Mates with 1,60mm .062" cards Mates with: 1,6mm thick cards, EEDP, HSC8 Insulator Material Black Liquid

Contextual Info: F-206 M EC8-110-02-L-D-RA1 M EC8-140-02-L-D-RA1 EDGE-CARD SOCKET sI riesA SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?MEC8-RA Mates with: 1,60mm .062" thick cards, EEDP, HSC8 APPLICATIONS Insulator Material: