HS6664RH PROGRAMMING Search Results

Contextual Info: fS Ì HS-6664RH H A F R F R IS S E M I C O N D U C T O R Radiation Hardened 8K X 8 CMOS PROM September 1995 Features Pinouts 28 LEAD CERAMIC SBDIP CASE OUTLINE D28.6 MIL-STD-1835, CDIP2-T28 TOP VIEW • 1.2 Micron Radiation Hardened Bulk CMOS • Total Dose 3 x 105 RAD Si

A7 SMD TRANSISTOR

Abstract: SMD Transistor A12 smd transistor A11 A9 transistor SMD SMD a7 Transistor smd transistor A7 smd transistor A8 5962F9562601VYC SMD A8 Transistor smd a10
Contextual Info: HS-6664RH TM Data Sheet August 2000 File Number Radiation Hardened 8K x 8 CMOS PROM Features The Intersil HS-6664RH is a radiation hardened 64K CMOS PROM, organized in an 8K word by 8-bit format. The chip is manufactured using a radiation hardened CMOS process,

A7 SMD TRANSISTOR

Abstract: SMD A8 Transistor smd transistor A8 smd transistor A11 SMD Transistor A12 smd transistor a9 A12 SMD TRANSISTOR smd transistor A7 smd transistor A6 SMD a7 Transistor
Contextual Info: HS-6664RH TM Data Sheet August 2000 File Number Radiation Hardened 8kx8 CMOS PROM Features The Intersil HS-6664RH is a radiation hardened 64k CMOS • Electrically Screened to SMD # 5962-95626 [ /Title PROM, organized in an 8k word by 8-bit format. The chip is

Contextual Info: a HS-6664RH HARRIS SEMICONDUCTOR PRELIMINARY Radiation Hardened 8K x 8 CMOS PROM January 1994 Features Pinouts 1.2 Micron Radiation Hardened Bulk CMOS Total Dose 3 x 10s RAD Si Transient Output Upset >1 x 10 RAD (Siys Single Event Upset < 1 x 10*1° Errors/Bit-Day

Contextual Info: HS-6664RH HARRIS S E M I C O N D U C T O R Radiation Hardened 8K x 8 CMOS PROM August 1994 Features Pinouts 28 LEAD CERAMIC SBDIP CASE OUTLINE D28.6 MIL-STD-1835, CDIP2-T28 TOP VIEW • 1.2 Micron Radiation Hardened Bulk CMOS • Total Dose 3 x 10s RAD Si

Contextual Info: HS-6664RH Semiconductor Radiation Hardened 8K X 8 CMOS PROM September 1995 Pinouts • 1.2 Micron Radiation Hardened Bulk CMOS 28 LEAD CERAM IC SBDIP CASE O UTLINE D28.6 MIL-STD-1835, CDIP2-T28 TOP VIEW • Transient Output Upset >5 x 10s RAD Si /s NC | T

Decoder 8 to 256 single ic

Abstract: PROM 64k rad hardened cmos prom HS-6664RH
Contextual Info: f ü H U U S E M I C O N D U C T O R A J R R HS-6664RH IS Radiation Hardened 8K X 8 CMOS PROM ADVANCE INFORMATION December 1992 Features Pinouts • 1.2 Micron Radiation Hardened Bulk CMOS 28 PIN CERAMIC DIP CASE OUTLINE D10, CONFIGURATION 3 TOP VIEW • Total Dose 3 x 10s RAD Si

HS6664RH programming

Abstract: HS9-6664RH CDFP3-F28 D-10 HS1-6664RH HS-6664RH HS-6664 hs1-6664
Contextual Info: HS-6664RH Radiation Hardened 8K x 8 CMOS PROM September 1995 Features Pinouts • 1.2 Micron Radiation Hardened Bulk CMOS 28 LEAD CERAMIC SBDIP CASE OUTLINE D28.6 MIL-STD-1835, CDIP2-T28 TOP VIEW 5 • Total Dose 3 x 10 RAD Si • Transient Output Upset >5 x 108 RAD (Si)/s

CDFP3-F28

Abstract: D-10 HS1-6664RH HS-6664RH HS9-6664RH HS-6664RH Application Note
Contextual Info: HS-6664RH S E M I C O N D U C T O R Radiation Hardened 8K x 8 CMOS PROM September 1995 Features Pinouts • 1.2 Micron Radiation Hardened Bulk CMOS 28 LEAD CERAMIC SBDIP CASE OUTLINE D28.6 MIL-STD-1835, CDIP2-T28 TOP VIEW 5 • Total Dose 3 x 10 RAD Si • Transient Output Upset >5 x 108 RAD (Si)/s

ali 3511

Abstract: CDIP2-T28 HS6664RH programming PROM 64k rad hardened 108RAD ali 3511 A HS6664RH
Contextual Info: HS-6664RH Semiconductor Radiation Hardened 8K X 8 CMOS PROM September 1995 Features Pinouts • 1.2 Micron Radiation Hardened Bulk CMOS 28 LEAD CERAM IC SBDIP CASE OUTLINE D28.6 MIL-STD-1835, CDIP2-T28 TOP VIEW • Total Dose 3 x 105 RAD Si • Transient Output Upset >5 x 10s RAD (Si)/s

HS6664RH programming

Contextual Info: HS-6664RH S3 «a« ADVANCE INFORMATION Radiation Hardened 8K X 8 CMOS PROM December 1992 Pinouts 28 PIN CERAMIC DIP CASE OUTLINE D10, CONFIGURATION 3 • Total Dose 3 x 10® RAD SI • • • • TOP VIEW Transient Output Upset >1 x 10® RAD (Si)/s

5962-95626

Abstract: QML-38535 two transistor SMD marks to OH1 CDFP3-F28 HS-6664RH QML-38534
Contextual Info: 1. SCOPE 1.1 Scope. This drawing forms a part of a one part - one part number documentation system see 6.6 herein . Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a

QML-38535

Abstract: 5962-95626 CDFP3-F28 HS-6664RH hs1-6664
Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED Changes in accordance with NOR 5962-R044-96. 96-01-24 M. A. Frye Changes in accordance with NOR 5962-R460-97. 97-09-22 Raymond Monnin Updated boilerplate for class "T" changes. - gig 98-12-02 Raymond Monnin

QML-38535

Abstract: 5962-95626 CDFP3-F28 HS-6664RH 6664RH 5962F9562601QXC radiation hardened prom HS1-6664RH-Q F-1192 5962F9562601
Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Changes in accordance with NOR 5962-R044-96. 96-01-24 M.A. Frye B Changes in accordance with NOR 5962-R460-97. 97-09-22 Raymond Monnin C Update boilerplate for class “T” changes. - glg 98-12-02 Raymond Monnin