HPND Search Results

Contextual Info: • 4 M M 7 5 Ô 4 G D O T b ñ ? OTO ■ H P A HEWLETT-PACKARD/ CMPNTS blE D m HEW LETT PACKARD Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 HPND-0003 Features • Thermocompression/ Thermosonically Bondable

hpnd pin 0.01 pF

Abstract: HPND-4001 HPND-4050 HPND4050 IN-4001 diodes ratings hPND
Contextual Info: COMPONENTS HPND-4001 HPND - 4050 LOW SERIES RESISTANCE 1.30 Typical LOW CAPACITANCE 0.07 pF Typical FAST SWITCHING 2 ns Typical RUGGED CONSTRUCTION 4 Grams Minimum Lead Pull .i _ L . * T 60 [2.4 40 1.6) Description /Applications O utline 07 The HPND-4001 and -4050 are beam lead PIN diodes designed

hughes welder

Abstract: beam lead pin diode
Contextual Info: X !ñ BEAM LEAD PIN DIODE HEWLETT PACKARD HPND-4005 HPND-4005TXV Features HIGH BREAKDOWN VOLTAGE 120V Typical LOW CAPACITANCE 0.017 pF Typical LOW RESISTANCE 4.70 Typical RUGGED CONSTRUCTION 4 Grams Minimum Lead Pull 7 Z O /M .3 \ NITRIDE PASSIVATED 1 t i

Contextual Info: Wljm SMALL SIGNAL RF PIN DIODE CHIPS FOR HYBRID INTEGRATED CIRCUITS HEW LETT PACKARD wLEM HPND-0001 HPND-0002 HPND-0003 T E C H N IC A L DATA M ARCH 1988 Features THERMOCOMPRESSION/THERMOSONICALLY BON DAB LE IDEAL FOR HYBRID INTEGRATED CIRCUITS GOLD METALLIZATION

Contextual Info: heüjlett- p a c k a r d 44^7584 -. "sa cmpnts HEWLETT-PACKARD» m dëT J CMPNTS 4447504 0002=14: 58C 02941 HIGH RELIABILITY BEAM LEAD PIN DIODES HEW LETT PACKARD D TXVP-4001 TXVP-4050 Generic HPND-4001/-4050 Features QUALITY PERFORMANCE TESTED Test Program Patterned After MIL-S-19500

DIODE 4005

Abstract: TXV-P
Contextual Info: HEWLETT-PACKARD-, 4447584 Sñ CMPNTS H EW L E T T - P A C K A R D » m » T | m 4M7SÖ4 CMPNTS 58C DOOS^ 02943 HIGH RELIABILITY BEAM LEAD PIN DIODE HEW LETT PACKARD 3 DT*Ô7*J5” TXVP-4005 Generic HPND-4005 Features QUALITY PERFORMANCE TESTED Test Program Patterned After MIL-S-19500

Contextual Info: • 44475A4 DDDTbTT Ô12 HH-IPA HEWLETT-PACKARD/ CMPNTS blE D Wha% HEWLETT PACKARD Low L oss B eam Lead PIN D iod es Technical Data HPND-4050 Features • Low S eries R esistan ce 1.3 £2 Typical • Low C ap acitan ce 0.07 pF Typical • F a s t S w itch in g

HPND-4038

Abstract: beam lead pin diode
Contextual Info: HPND-4038 SILICON BEAM LEAD PIN DIODE DESCRIPTION: The HPND-4038 is a Beam Lead Pin Diode Designed for High Switching Applications Up to 18 GHz. PACKAGE STYLE BIC FEATURES INCLUDE: • Low CT - 0.06 pF Typical • Low RS - 2.0 Max. @ 10 mA • High Speed - τ = 45 nS Typical

HPND-4018

Contextual Info: fh p\ HEWLETT mL'fiM PACKARD Beam Lead PIN Diodes Reliability Data HPND-4005 HPND-4018 HPND-4028 HPND-4038 HPND-4050 Description For applications requiring com­ ponent reliability estim ation, H ew lett-Packard provides reliability d ata for all fam ilies of

Contextual Info: Whp\ HEWLETT mL'HM PA CKA RD Beam Lead PIN Diodes for Phased Arrays and Switches Technical Data HPND-4018 HPND-4028 HPND-4038 Features 680 27 • L ow C a p a c ita n c e 0.025 pF Maximum a t 1 MHz G uaranteed Min./Max. • F a s t S w itc h in g 2.0 nsec

Contextual Info: Whpl H E W LE T T mL'rtà PA C K A R D PIN Diodes Reliability Data 1N5719 5082-3001 5082-3002 5082-3039 5082-3077 HPND-4165 HPND-4166 Description Applications For applications requiring component reliability estima­ tion, Hewlett-Packard provides reliability data for all families of

Contextual Info: HPND4165 SILICON PIN DIODE CURRENT CONTROLLED RF RESISTOR DESCRIPTION: The HPND4165 is a Silicon PIN Diode Designed for Attenuator Applications Requiring Tightly Controlled RS Characteristics. PACKAGE STYLE 15 FEATURES INCLUDE: • Guaranteed RS vs. Bias Slope

DIODE 4005

Abstract: hpnd pin 0.01 pF HPND-4005 HPND4005 beam lead pin diode
Contextual Info: Beam Lead PIN Diode Technical Data HPND-4005 Features • High Breakdown Voltage 120 V Typical • Low Capacitance 0.017 pF Typical GOLD LEADS S1O2/Si3N4 PASSIVATION CATHODE 130 5.1 110 (4.3) 110 (4.3) 80 (3.1) 130 (5.1) 110 (4.3) • Low Resistance 4.7 Ω Typical

DOD-HDBK-1686

Abstract: HPND-4028 4038 HPND-4005 HPND-4038
Contextual Info: Beam Lead PIN Diodes Reliability Data HPND-4005 HPND-4028 HPND-4038 Description Applications For applications requiring component reliability estimation, Agilent Technologies provides reliability data for all families of devices. Data is initially compiled

Ultrasonic welding circuit

Abstract: DIODE 4005 hpnd pin 0.01 pF handling of beam lead diodes beam lead PIN diode Ablestik diode led ir Led-Diode data phase shift resistance welding HPND4005
Contextual Info: HPND- 4005 Beam Lead PIN Diode Data Sheet Description Features The HPND-4005 planar beam lead PIN diode is ­constructed to offer exceptional lead strength while achieving excellent elec­tri­cal performance at high ­frequencies. High beam strength offers users superior

HP 5082-3081

Abstract: diode 5082-3168 HPND-4165 HP 5082-3168 vhf antenna mtbf hp 3042 1N5767 5082-3168 diode 5082-3001 5082-3042
Contextual Info: H E W L E T T P A CK A RD COMPONENTS 5082 3001/02 HPND-4165/66 5082-3039 1N5719 5082-3042/43 5082-3077 5082-3080 (1N5767) 5082-3081 5082-3168/88 PIN DIODES FOR RF SWITCHING AND ATTENUATING Features LOW HARMONIC DISTORTION LARGE DYNAMIC RANGE LOW SERIES RESISTANCE

HPND-4028 pin diode

Contextual Info: What mLliM HEWLETT* PACKARD Beam Lead PIN Diodes for Phased Arrays and Switches Technical Data HPND-4018 HPND-4028 HPND-4038 Features • Low Capacitance 0.025 pF Maximum at 1 MHz Guaranteed Min./Max. • Fast Switching 2.0nsec • Low Resistance at Low Bias

Contextual Info: W ß%H EW L E T T 1“KM PA CK A R D Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 Features Description • Thermocompression/ ThermosonicaUy Bondable These PIN/NIP diode chips are specifically designed for hybrid

HPND0003

Abstract: HPND-0003
Contextual Info: W fipi H E W LE T T mL'HM P A C K A R D Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 HPND-0003 F eatures • Thermocompression/ Thermosonically Bondable • Ideal for Hybrid Integrated Circuits • Gold Metallization

Ic D 1708 ag

Contextual Info: warn HEWLETT %SKM PA CK A R D Beam Lead PIN Diodes for Phased Arrays and Switches Technical Data HPND-4018 HPND-4028 HPND-4038 Features • Low C apacitance 0.025 pF Maximum a t 1 MHz G uaranteed Min./Max. • F ast Sw itching 2.0 nsec • Low R esistan ce a t Low B ias

HPND-4018

Abstract: gs 05 HPND-4028 HPND-4005 4028 4038 HPND-4038 HPND 4028 HPND4028
Contextual Info: Beam Lead PIN Diodes Reliability Data HPND-4005 HPND-4018 HPND-4028 HPND-4038 Description Applications For applications requiring component reliability estimation, Hewlett-Packard provides reliability data for all families of devices. Data is initially compiled

Contextual Info: HPND4165 SILICON PIN DIODE CURRENT CONTROLLED RF RESISTOR DESCRIPTION: The HPND4165 is a Silicon PIN Diode Designed for Attenuator Applications Requiring Tightly Controlled RS Characteristics. PACKAGE STYLE 15 FEATURES INCLUDE: • Guaranteed RS vs. Bias Slope

HPND-4028 pin diode

Contextual Info: Beam Lead PIN Diodes for Phased Arrays and Switches Technical Data HPND-4028 HPND-4038 690 27 650 (26) Features • Low Capacitance 0.025 pF Maximum at 1 MHz Guaranteed Min./Max. • Fast Switching 2.0 nsec 330 (13) 260 (10) 220 (9) 180 (7) 180 (7) 160 (6)

diode LN 4001

Abstract: HPND-4050TXV HPND4050
Contextual Info: HEWLETT-PACKARD-. CMP NT S EGE D C l 44475A4 0005723 LOW LOSS BEAM LEAD PIN DIODES ÉfyCvrl H E W L E T T PACKARD 4 E3 HPNQ-4001 HPND-4001TXV HPND-4050 HPND-4050TXV Features 725 29 600(23) LOW SER IES RESISTANCE 1.30 Typical LOW CAPACITANCE 0.07 pF Typical