HP6632B Search Results
HP6632B Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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Contextual Info: SMD Multilayer Chip Inductor for Choke ASMCI-0805 MSL level: 2 This product is packed with dry packaging Pb RoHS Compliant 2.0 x 1.25 x 0.85mm /2.0 x 1.25 x 1.25mm APPLICATIONS: FEATURES: • Monolithic structure designed for high reliability • Excellent solderability and heat resistance |
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ASMCI-0805 ASMCI-0805Inductance ASMCI-0805-R10 ASMCI-0805-R22 ASMCI-0805-R47 ASMCI-0805-1R0 ASMCI-0805-2R2 ASMCI-0805-4ve | |
ASMPH-0603
Abstract: 20-15C
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ASMPH-0603 ASMPH-0603 20-15C | |
ASMPH-1008Contextual Info: SMD Multilayer Chip Power Inductor ASMPH-1008 RoHS/RoHS II Compliant Pb 2.5 x 2.0 x 0.9mm APPLICATIONS: FEATURES: • High DC bias current due to trench technology • Much lower profile than any other series • Monolithic structure for high reliability • Excellent solderability and heat resistance |
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ASMPH-1008 ASMPH-1008 | |
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Contextual Info: SMD Multilayer Chip Inductor for Choke ASMCI-0603 Pb RoHS 1.60 x 0.8 x 0.8mm Compliant APPLICATIONS: FEATURES: • Monolithic structure designed for high reliability • Excellent solderability and heat resistance • Magnetic shield designed to eliminate cross coupling |
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ASMCI-0603 ASMCI-0603Inductance ASMCI-0603-R10 ASMCI-0603ions. | |
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Contextual Info: SMD Multilayer Chip Power Inductor ASMPH-1008 RoHS/RoHS II Compliant Pb 2.5 x 2.0 x 0.9mm APPLICATIONS: FEATURES: • High DC bias current due to trench technology • Much lower profile than any other series • Monolithic structure for high reliability • Excellent solderability and heat resistance |
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ASMPH-1008 | |
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Contextual Info: SMD Multilayer Chip Power Inductor ASMPH-0806 RoHS/RoHS II Compliant Pb FEATURES: • High DC bias current due to trench technology • Much lower profile than any other series • Monolithic structure for high reliability • Excellent solderability and heat resistance |
Original |
ASMPH-0806 ASMPH-0806Inductance ASMPH-0806-R47 ASMPH-0806-1R0 ASMPH-0806-1R5 ASMPH-0806-2R2 ASMPH-0806-3R3 ASMPH-0806-4R7 | |
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Contextual Info: SMD Multilayer Chip Power Inductor ASMPH-0805 RoHS/RoHS II Compliant Pb FEATURES: • High DC bias current due to trench technology • Much lower profile than any other series • Monolithic structure for high reliability • Excellent solderability and heat resistance |
Original |
ASMPH-0805 ASMPH-0805Inductance ASMPH-0805-R47 ASMPH-0805-1R0 ASMPH-0805-1R5 ASMPH-0805-2R2 ASMPH-0805-3R3 ASMPH-0805-4R7 | |
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Contextual Info: SMD Multilayer Chip Power Inductor ASMPH-0603 Pb FEATURES: • High DC bias current due to trench technology • Much lower profile than any other series • Monolithic structure for high reliability • Excellent solderability and heat resistance • Magnetically shielded structure to eliminate cross coupling |
Original |
ASMPH-0603 ASMPH-0603Inductance ASMPH-0603-R22 ASMPH-0603-R33 ASMPH-0603-R47 ASMPH-0603-R68 ASMPH-0603-1R0 ASMPH-0603-1R5 ASMPH-0603-2R2 | |
0031-0006a
Abstract: HP6632B
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ASMCI-0603 ASMCI-0603Inductance ASMCI-0603-R10 ASMCI-0603-R22 ASMCI-0603-R47 ASMCI-0603-1R0 ASMCI-0603-2R2 ASMCI-0603-4R7 ASMCI-0603-100 0031-0006a HP6632B | |
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Contextual Info: SMD Multilayer Chip Power Inductor ASMPH-1008 RoHS/RoHS II Compliant Pb 2.5 x 2.0 x 0.9mm APPLICATIONS: FEATURES: • High DC bias current due to trench technology • Much lower profile than any other series • Monolithic structure for high reliability • Excellent solderability and heat resistance |
Original |
ASMPH-1008 ASMPH-1008Inductance ASMPH-1008-R47 ASMPH-1008-1R0 ASMPH-1008-1R5 ASMPH-1008-2R2 ASMPH-1008-3R3 ASMPH-1008-4R7 | |
ASMPH-0805Contextual Info: SMD Multilayer Chip Power Inductor ASMPH-0805 RoHS/RoHS II Compliant Pb FEATURES: • High DC bias current due to trench technology • Much lower profile than any other series • Monolithic structure for high reliability • Excellent solderability and heat resistance |
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ASMPH-0805 ASMPH-0805 | |
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Contextual Info: SMD Multilayer Chip Power Inductor ASMPH-0806 RoHS/RoHS II Compliant Pb FEATURES: • High DC bias current due to trench technology • Much lower profile than any other series • Monolithic structure for high reliability • Excellent solderability and heat resistance |
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ASMPH-0806 | |
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Contextual Info: SMD Multilayer Chip Inductor for Choke ASMCI-0603 Pb RoHS 1.60 x 0.8 x 0.8mm Compliant APPLICATIONS: FEATURES: • Monolithic structure designed for high reliability • Excellent solderability and heat resistance • Magnetic shield designed to eliminate cross coupling |
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ASMCI-0603 ASMCI-0603Inductance ASMCI-0603-R10 ASMCI-0603-R22 ASMCI-0603-R47 ASMCI-0603-1R0 ASMCI-0603-2R2 ASMCI-0603-4R7 ASMCI-0603-100 | |
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Contextual Info: SMD Multilayer Chip Inductor for Choke ASMCI-0805 Pb RoHS Compliant 2.0 x 1.25 x 0.85mm /2.0 x 1.25 x 1.25mm APPLICATIONS: FEATURES: • Monolithic structure designed for high reliability • Excellent solderability and heat resistance • Magnetic shield designed to eliminate cross coupling |
Original |
ASMCI-0805 ASMCI-0805Inductance ASMCI-0805-R10 ASMCI-0805-R22 ASMCI-0805-R47 ASMCI-0805-1R0 ASMCI-0805-2R2 ASMCI-0805-4R7 ASMCI-0805-100 | |
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Contextual Info: SMD Multilayer Chip Power Inductor ASMPH-0603 Pb FEATURES: • High DC bias current due to trench technology • Much lower profile than any other series • Monolithic structure for high reliability • Excellent solderability and heat resistance • Magnetically shielded structure to eliminate cross coupling |
Original |
ASMPH-0603 | |
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Contextual Info: SMD Multilayer Chip Inductor for Choke ASMCI-0805 Pb RoHS 2.0 x 1.25 x 0.85mm /2.0 x 1.25 x 1.25mm Compliant APPLICATIONS: FEATURES: • Monolithic structure designed for high reliability • Excellent solderability and heat resistance • Magnetic shield designed to eliminate cross coupling |
Original |
ASMCI-0805 ASMCI-0805Inductance | |
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Contextual Info: SMD Multilayer Chip Power Inductor ASMPH-0805 RoHS/RoHS II Compliant Pb FEATURES: • High DC bias current due to trench technology • Much lower profile than any other series • Monolithic structure for high reliability • Excellent solderability and heat resistance |
Original |
ASMPH-0805 | |