HLQFP208 Search Results

Contextual Info: Package outline HLQFP208: plastic thermal enhanced low profile quad flat package: 208 leads; body 28 x 28 x 1.4 mm; exposed die pad SOT1313-1 c y exposed die pad X A Dh 156 157 105 104 ZE A2 A e A3 A1 θ Lp Eh E HE detail X L pin 1 index 208 53 52 1 bp e v

FSQ510 Equivalent

Abstract: BTA12 6008 bta16 6008 ZIGBEE interface with AVR ATmega16 Precision triac control thermostat thyristor t 558 f eupec gw 5819 diode transistor a564 A564 transistor BSM25GP120 b2
Contextual Info: SEMICONDUCTORS MCU/MPU/DSP Atmel. . . . . . . . . 167, 168, 169, 170, 171, 172 Blackhawk. . . . . . . . . . . . . . . . . . . . . . . . . 173 Cyan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174 Cypress. . . . . . . . . . . . . . . 175, 176, 177, 178