HLLGA68R Search Results

Contextual Info: PC board footprint NXP Semiconductors Footprint for reflow soldering of HLLGA68R package SOT858-2 10.50 0.65 15.50 13.30 13.00 0.35 0.55 0.35 4.10 1.80 1.65 0.30 0.60 3.80 solder lands 0.05 0.40 8.00 8.10 solder paste 0.65 0.75 Detail: stencil thickness: 0.1 - 0.125 mm

Contextual Info: Package outline HLLGA68R: plastic thermal enhanced low profile land grid array package; 68 lands; resin based; body 10 x 10 x 1.4 mm D SOT838-1 A B land 1 index area E e1 L1 L v w b e 18 M M y1 C C A B C A C y 34 35 17 e e2 Eh 1 land 1 index area 51 68 52

Contextual Info: Package outline HLLGA68R: plastic thermal enhanced low profile land grid array package; 68 lands; resin based; body 10 x 15 x 1.3 mm D B SOT858-1 A land 1 index area E A detail X C e1 e L1 v w b 34 22 L M M y y1 C C A B C 35 21 e e2 Eh Eh1 1 land 1 68 index area

Contextual Info: Package outline HLLGA68R: plastic thermal enhanced low profile land grid array package; 68 lands; resin based; body 10 x 15 x 1.25 mm D B SOT858-2 A land 1 index area E A detail X C e1 e L1 v w b 34 22 L M M y y1 C C A B C 35 21 e e2 Eh Eh1 1 land 1 68 index area