HIP TECHNOLOGIES Search Results

2520C

Abstract: 3n3 j 630 HFC-1005C-12N hfc201 FC2520 HFC-2520C HFC-2012F-R27 2012-F
Contextual Info: IHFC SER IES High Freq. W ound C eram ic C hip Ind. / Ferrite C hip Ind. • • • • • • • CUTTING-EDGE TECHNOLOGIES OF EMI/EMC SOLUTIONS FEATURES High frequency applications. Low DC resistance and high allowable DC current. Close tolerance application. 2% tolerence is available for particular inductance values.

4361L1

Abstract: HIP Technologies
Contextual Info: 4361L1/5 Series Red/Green Bi-Color 4361L1/5 Series Red/Green Bi-Color DESCRIPTION AND FEATURES All dimensions in inches. • • • • G R E E N C HIP Dual chip Uniformity of output color Wide viewing angle White diffused R E D C HIP Ø.150±.004 Ø.122±.004

Contextual Info: 4361M1/5 Series Red/Green Bi-Color 4361M1/5 Series Red/Green Bi-Color D E S C R I P T I O N AN D F EAT U R E S G R E E N C HIP .135/.133 • • • • Dual chip Uniformity of output color Wide viewing angle White diffused R E D C HIP .150±.004 Ø.122±.004

lear

Abstract: 7021X1 7021X 7021X3 7021X5
Contextual Info: DESCRIPTION AND FEATURES 3.20 LE D C HIP 1.40 Leading Edge LED Optoelectronic Performance • Consistent high brightness. 1.60 0.10 Surface Mount Technology • Tape and reel packaged for high-speed autoinsertion. • Convection and vapor-phase reflow compatible.

Contextual Info: Production plants – worldwide Espelkamp / Germany – Plant 1 Sales partner – worldwide Argentina Condelectric S.A. Hipólito Yrigoyen 2591 B1640HFY Martínez, Buenos Aires Phone + Fax +54 11 4836-1053 E-Mail: info@condelectric.com.ar Denmark Knud Wexøe A/S

lear

Abstract: 7011X
Contextual Info: DESCRIPTION AND FEATURES 3.00 C AT HODE MAR K Color Combinations: • Red/Yellow • Red/Green • Green/Yellow LE D C HIP #1 Surface Mount Technology • Tape and reel packaged for high-speed autoinsertion. • Convection and vapor-phase reflow compatible.

SMB-403025

Abstract: SMB-302520 SMB-403
Contextual Info: S M B SERIE! CUTTING-EDGETECHNOLOGIES OF EMI/EMC SOLUTIONS Ferrite C hip B eads FEATURES The SMB chips are our high performance wound chip beads. SMB chips are constructed with a wire wound structure and has a higher current capacity than multilayer chip beads.

104-0 vitrohm

Abstract: vitrohm BT TCN32-4 RWN5020 824-560 YCN15 T0850 GP SERIES RESISTORS metallglasurschicht metallschicht
Contextual Info: Inhaltsverzeichnis nach Serien / Contents by Series Typ-Bezeichnungen siehe S eite 4 / for type num bers see p a g e 4 SM D: Seite / pag e R echteck-C hip / R ectan gu la r chip Serie / series RGC Metallglasurschicht / Metalglaze film . 34

Mitsubishi Electric IGBT MODULES

Abstract: transistor free CM600DY-24NF mitsubishi j 170 a ignition module igbt welding machine scheme 37Kw motor CM600DU-12F CM600DY-24A calculation of IGBT snubber CM300DY-24NF
Contextual Info: IGBT Modules Application Note The 5 t h Generation [ CSTBT TM ] IGBT C hip use 12NF/24NF/24A series  Dec. 2007  Notice for Safe Designs •Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is

lear

Abstract: 7018X
Contextual Info: DESCRIPTION AND FEATURES Color Combinations: • Red/Green • Green/Yellow AMB E R LE D C HIP 1.60 Surface Mount Technology • Tape and reel packaged for high-speed autoinsertion. • Convection and vapor-phase reflow compatible. • Compact form enables high density placement.

Contextual Info: MITSUBISHI MICROCOMPUTERS M37736MHBXXXGP „ aW' S°!i'ß S ING LE-C HIP 16-BIT CM O S M IC R O C O M PU TER DESCRIPTION •In te rru p ts . 19 types, 7 levels The M37736MHBXXXGP is a single-chip m icrocomputer using the

7012X5

Abstract: grees 7012X 7012X1 7012X13 7012X7
Contextual Info: DESCRIPTION AND FEATURES ANODE + .031 .043 .0 12 .049 .0 51 .079 7012X Series Bright ★Chips High Brightness SMT LEDs 0805 Package Size 7012X Series Bright★Chips™ High Brightness SMT LEDs 0805 Package Size .051 .047 .005 DIE OFF S E T LE D C HIP

lear

Abstract: CMD11505
Contextual Info: CMD11505 Series Bright ★Angle Right Angle Surface Mount LED CMD11505 Series Bright★Angle™ Right Angle Surface Mount LED DESCRIPTION AND FEATURES All dimensions in mm. LE D C HIP 2.10 0.60 0.10 0.10 1.70 P LAS T IC S UB S T R AT E 1.00 0.50 0.30 0.30

mlb-3216-0120m4-n2

Abstract: MLB-3216-1000M4-N2 MLB3216 DI200 MLB321 MLB-3216-0060M4 100m4
Contextual Info: CUTTING-EDGETECHNOLOGIES OF EMI/EMC SOLUTIONS MLB M -S ER lEj Ferrite C hip B eads For Multi-Line Applications FEATURES CHIP BEADS Multi-line EMI Suppression M-series chip arrays contain four ferrite beads in a single package. This compact design makes the M-series perfect for EMI suppression on multiple-lines.

Contextual Info: lawprofile t 2l COMFATIBLE LEADLESS CHIP CARRIER LOGIC DELAY MODULE T 2 L input and outputs The L C L D M -T T L is offered in 19 delays from 25ns to 500ns Delays stable and precise w ith each module incorporating taps at 20% increments of total Leadless C hip Carrier .2 4 0 high

RAS 0510 SUN HOLD

Abstract: sun hold RAS 0510 8255 PPI Chip 8086 PPI 8255 interface with 8086 82C100 F82C100 8255 programmable peripheral interface 7 SEGMENT DISPLAY 8255 and 8088 ic dma 8237 8088 LA 7840
Contextual Info: «sì:ik uuuui»uu: ADVANC E INFORMATION C in ilP S . 82C 100 IB M T P S /2 M odel 3 0 and S u per X T 71 C o m p atib le C hip M 100% PC/XT compatible * • Build IBM PS/2 Model 30 with XT software compatibility Key superset features: EMS control, dual

vdsl6100

Abstract: PEF22827 cw 7809 sp 201 adsl splitter circuit diagram LA 7673 diagrams sp 201 adsl splitter VDSL splitter solution infineon 7870 5b1c MPS OUTSIDE BOX PACKING SPECIFICATION
Contextual Info: P r e l i m i na r y D at a Sh ee t , R ev . 1. 1 , J a n. 20 0 5 VDSL6100i Int eg ra te d V DSL M ode m-on -C hip PEF 2 282 7, Ve rsio n 1.1 Wire line Co mm unica tion s N e v e r s t o p t h i n k i n g . ABM , ACE®, AOP®, ARCOFI®, ASM®, ASP®, DigiTape®, DuSLIC®, EPIC®, ELIC®,

F82C235

Abstract: 82C235 82C765 82C601 80286 address decoder 7812 LIM EMS 4.0 32.768 khz crystal 14.318MHz crystal 80286 data bus MD 8254 cascading
Contextual Info: •»■■■a ■■ ■■ ■■■■■ mmmmu ■■■■■■■ ■■ ■■ ■■■■■■■■■■■■ ■■ mm I P relim inary 8 2 C 2 35 Single C hip AT 1 In tro d u c tio n The 82C235 is a VLSI device that incorporates m ost of the m otherboard logic required to build a lowcost, highly-integrated, IBM PC AT-compatible computer. It is designed to be used in conjunction with

Hy4C

Contextual Info: TNETE2004 SINGLE-CHIP QuadPHY FOUR 10 BASE-T PHYSICAL LAYER INTERFACES S P W S 023- OCTOBER 1996 S ing le-C hip M u lt i-P H Y Solution: L o o p b a c k M o d e f or T e s t O p e r a t i o n s - Integrated M an ch es ter E n co din g/D e co din g F o u r 10 B a s e - T P h y s i c a l L a y e r I n t e r f a c e s

MLB-160808-0100A-N2

Abstract: MLB321611-0400A MLB321611-0600A MLB-201209-0120A-N4 MLB201209-0600A MLB-160808-0600A-N1 MLB10 MLB321611 MLB-201209-0600A-N2 MLB-201209-0600A-N4
Contextual Info: MLB A -SER IES Ferrite Chip B eads For G eneral Applications CUTTING-EDGE TECHNOLOGIES OF EMI/EMC SOLUTIONS FEATURES Effective EMI Protection A-Series chip beads have a monolithic inorganic material construction that minimizes the effect of electromagnetic interference.

29f040b

Abstract: teradyne catalyst Stacked 4MB Flash and 1MB SRAM WED3C755E8MC FLF14 kyocera 128 cqfp CERAMIC QUAD FLATPACK CQFP 95613 hac 132 BAG PACKAGE TOP MARK tms320c6
Contextual Info: White Electronic Designs Table Of Contents Product Overview . 2 Commitment . 3

MLB-201209-0300P-N2

Abstract: MLB-160808-0600P-N2 MLB-160808-0300P-N2 LB-201209-0010P-N1 MLB321611-0050P-N1 MLB-160808-0025P-N1 MLB-160808-0150P-N2 MLB-201209-0030P-N1 mlb p-series LB 1806
Contextual Info: LB P-SER IES CUTTING-EDGE TECHNOLOGIES OF EMI/EMC SOLUTIONS Ferrite Chip Beads For High Current Applications CHIP BEADS FEATURES Effective EMI Protection P-Series chip beads have a monolithic inorganic material construction that minimizes the effect of electromagnetic interference.

mp4 player circuit diagram

Abstract: usb mp4 player circuit diagram mp4 player device circuit Ultra mini CMOS camera HIP6211 15VZ mp4 player device circuit diagram
Contextual Info: HIP6211 Dual Low Noise LDO in 3mmx3mm MLFTM Description The HIP6211 is a dual CMOS low dropout linear regulator with ultra-low-noise output, very low dropout voltage and very low ground current. The HIP6211 operates from a 2.5V to 5.5V input voltage range and delivers up to 300mA, with low

pedometer

Abstract: SCA3000 accelerometer AN50
Contextual Info: Application Note 50 SCA3000 ACCELEROMETER IN SPEED, DISTANCE AND ENERGY MEASUREMENT Objective Multi-axis acceleration caused by human walking can be measured and converted into speed, distance travelled and energy consumed. This document presents how VTI's sensing technology enables inertia measurement to be