HI1566 Search Results

Contextual Info: HI-1565, HI-1566 MIL-STD-1553 / 1760 5V Monolithic Dual Transceivers April 2007 DESCRIPTION PIN CONFIGURATIONS To minimize the package size for this function, the transmitter outputs are internally connected to the receiver inputs, so that only two pins are required for connection to

ablebond 84-3J

Abstract: SUMITOMO g600f CRM-1151 ablebond 8006ns sumitomo EME G600 sumitomo crm ablebond ablestik 8006ns 84-3j hi-1579psm SUMITOMO CRM-1151
Contextual Info: MIL-STD-1553 Bus Transceivers Plastic SOIC Package Transfer Product Change Notice PCN1201 v1.0 January 20, 2012 Overview The purpose of this notification is to describe the changes to the 20 Pin Plastic Small Outline ESOIC-WB packages for the MIL-STD-1553 family of devices.

HI-3593

Abstract: HI-3717 arinc 825 QR114 QR-1140 HI-3113 HI-8593 HI-6131
Contextual Info: Addition of Greatek Electronic, Taiwan for QFN, TQFP, TSSOP & SOIC Package Assembly Product Change Notice PCN1101 v1.0 December 01, 2011 Overview The purpose of this notification is to announce the addition of Greatek Electronic, Taiwan assembly facility for QFN, TQFP,

1565p

Contextual Info: HI-1565, HI-1566 MIL-STD-1553 / 1760 5V Monolithic Dual Transceivers May 2014 DESCRIPTION PIN CONFIGURATIONS The receiver section of each bus converts the 1553 bus biphase differential data to complementary CMOS / TTL data suitable for input to a Manchester decoder. Each receiver

Contextual Info: HI-1565, HI-1566 MIL-STD-1553 / 1760 5V Monolithic Dual Transceivers August 2013 DESCRIPTION PIN CONFIGURATIONS The receiver section of each bus converts the 1553 bus biphase differential data to complementary CMOS / TTL data suitable for input to a Manchester decoder. Each receiver

HI-1574CDI

Abstract: HI1573CDM hi-1573cdm HI-8382CM-21 HI-3282CD 6010CM-10 QR-8050 HI-1573CDI
Contextual Info: New Assembly Supplier: Criteria Labs Austin, Texas Product Change Notice PCN0810 v1.0 December 02, 2008 Overview The purpose of this notice is to announce the addition of Criteria Labs in Austin, Texas as a qualified assembly supplier for ceramic side-brazed DIP package for both ARINC 429 and MIL-STD 1553 family of devices.

power supply 5 Volt

Abstract: HI-1565PSI TQ1553 TQ1553-2 HI-1565 HI-1566 TL1553-45 1566C Holt Applications Note AN-500
Contextual Info: HI-1565, HI-1566 MIL-STD-1553 / 1760 5V Monolithic Dual Transceivers August 2006 DESCRIPTION PIN CONFIGURATIONS To minimize the package size for this function, the transmitter outputs are internally connected to the receiver inputs, so that only two pins are required for connection to

1565p

Abstract: hi-1565psi 1566p
Contextual Info: HI-1565, HI-1566 MIL-STD-1553 / 1760 5V Monolithic Dual Transceivers April 2007 DESCRIPTION PIN CONFIGURATIONS To minimize the package size for this function, the transmitter outputs are internally connected to the receiver inputs, so that only two pins are required for connection to

Contextual Info: HI-1565, HI-1566 MIL-STD-1553 / 1760 5V Monolithic Dual Transceivers September 2008 DESCRIPTION PIN CONFIGURATIONS The receiver section of each bus converts the 1553 bus biphase differential data to complementary CMOS / TTL data suitable for inputting to a Manchester decoder. Each

TQ1553

Abstract: TL1553-45 TQ1553-2 HI-1565 HI-1566 DS1565 Holt Applications Note AN-500
Contextual Info: HI-1565, HI-1566 MIL-STD-1553 / 1760 5V Monolithic Dual Transceivers July 2009 DESCRIPTION PIN CONFIGURATIONS The receiver section of each bus converts the 1553 bus biphase differential data to complementary CMOS / TTL data suitable for inputting to a Manchester decoder. Each

HI-1579CDM

Abstract: HI-1573CDM HI-8482CM HI-1574CDI HI-1573CDI
Contextual Info: Assembly Location Addition for Ceramic Side-Brazed DIP Package Product Change Notice PCN1206 v1.0 November 01, 2012 Overview The purpose of this notice is to describe an addition to the location of assembly of ceramic packages for the ceramic sidebrazed DIP package for both ARINC 429 and MIL-STD 1553 family of devices.

arinc 825

Abstract: HI-3113 HI-1573 HI-3583A
Contextual Info: Addition of SPEL Semiconductor, India for QFN, TSSOP & SOIC Package Assembly Product Change Notice PCN1202 v1.0 January 20, 2012 Overview The purpose of this notification is to announce the addition of SPEL Semiconductor, India assembly facility for QFN, TSSOP

ms103

Abstract: HI-1573PST HI1574PSM MS-103 hi-1579psm HI-1573PSMF 1581PSM hi-1565psi HI-1573PSIF HI-1574PSM
Contextual Info: MIL-STD-1553 Bus Transceivers Plastic SOIC Package Change Product Change Notice PCN1005 v1.0 June 22, 2010 Overview The purpose of this notification is to announce that Holt Integrated Circuits is making a change to the lead standoff for the 20 Pin Plastic Small Outline ESOIC-WB packages assembled at CEI, Thailand.

PM-DB2725EX

Abstract: PM-DB2745S PM-DB2762 PM-DB2745L PM-DB2727 PM-DB2725 PM-DB2745D PM-DB2791 HI-6121 SMD code sa
Contextual Info: Miltary Selector Guide 2012_R2:Layout 1 1/12/12 5:46 PM Page 1 IC PACKAGES 6 Package Material SMD QFN-44 Plastic Y I, T, M 0.276 x 0.276 x 0.039 7.0 x 7.0 x 1.0 ESOIC-20 Plastic Y I, T, M 0.504 x 0.407 x 0.0975 (12.79 x 10.325 x 2.481) 2 3 Dimensions in inches7