HF75E060ACE Search Results

IRGC75B60

Abstract: IRGC75 5646
Contextual Info: PD - 94656 HF75E060ACE Hexfred Die in Wafer Form Features • GEN3 Hexfred Technology • Low VF • Low IRR • Low tRR Benefits • • • • • • Benchmark Efficiency for UPS and Welding Applications Rugged Transient Performance Low EMI Excellent Current Sharing in Parallel Operation