HEAT TRACE Search Results

SPRING Controller TYCO

Abstract: relay 28.12 855010 Heat Trace Triac soft start MONI-RTD-200 "SPRING Controller" TYCO 8550101
Contextual Info: 910 Series Single-point heat-trace controller Product overview The DigiTrace 910 is a compact, full-featured microprocessor-based single-point heat trace controller. The 910 provides control and monitoring of electrical heat-tracing circuits for both freeze protection and temperature

Contextual Info: 8 7 6 5 4 3 2 D 1 REVISIONS AMPHENOL PART NUMBER CONFIGURATION U90 - C 1 X 1 - 1 X 0 X PACKAGING HEAT SINK OPTION 1 = TRAY PACKAGING, HEAT SINK IN SEPARATE TRAY IF ORDERED 0 = NO HEAT SINK OPENING A = TRAY PACKAGING W/ HEAT SINK ASSEMBLED 1 = NO HEAT SINK OR CLIP SHIPPED

Contextual Info: 8 7 4 5 6 3 2 REVISIONS AMPHENOL PART NUMBER CONFIGURATION U90 - A 1 X 1 - 1 X 0 X HEAT SINK OPTION PACKAGING 0 = NO HEAT SINK OR CLIP SHIPPED, CLOSE TOP 1 = TRAY PACKAGING W/ HEAT SINK IN SEPARATE TRAY 1 = NO HEAT SINK OR CLIP SHIPPED, OPEN TOP A = TRAY PACKAGING W/ HEAT SINK ASSEMBLED

Contextual Info: FEATURES Š High efficiency: 92.3% @ 3.3V/60A Š Size: 58.4x22.8x10.9mm 2.30”x0.90”x0.43” (Without heat-spreader) 58.4x22.8x12.7mm (2.30”x0.90”x0.50”) (With heat-spreader) Š Industry standard footprint Š Heat dissipation enhancement pinout

E48SP3R360

Abstract: IEC60950-1999
Contextual Info: FEATURES Š High efficiency: 92.3% @ 3.3V/60A Š Size: 58.4x22.8x10.9mm 2.30”x0.90”x0.43” (Without heat-spreader) 58.4x22.8x12.7mm (2.30”x0.90”x0.50”) (With heat-spreader) Š Industry standard footprint Š Heat dissipation enhancement pinout

Contextual Info: FEATURES Š High efficiency: 92.3% @ 3.3V/60A Š Size: 58.4x22.8x10.9mm 2.30”x0.90”x0.43” (Without heat-spreader) 58.4x22.8x12.7mm (2.30”x0.90”x0.50”) (With heat-spreader) Š Industry standard footprint Š Heat dissipation enhancement pinout

INF-8438

Contextual Info: 7 8 6 5 3 4 1 2 REVISIONS REV. AMPHENOL PART NUMBER CONFIGURATION U90 - G 4X1 - 1XXX HEAT SINK OPTION 1 = NO HEAT SINK OR CLIP SHIPPED 5 = PIN STYLE HEAT SINK AND CLIP H1=15.1; H2=6.5; SAN HEIGHT 6 = PIN STYLE HEAT SINK AND CLIP (H1=12.8; H2=4.2; PCI HEIGHT)

raychem s1125

Abstract: raychem s1125 adhesive RT876 rt-876 S1125 RT876 raychem RK6619 raychem JOINT KIT ADHESIVE s1125 raychem s1125 adhesive application
Contextual Info: Raychem S1125 High performance, chemical and heat resistant adhesive Service temperature range -75oC to +150oC Raychem S1125 high performance adhesive has been developed to match the superior chemical and heat resistance properties of DR-25 heat-shrinkable

BH 3852 S

Contextual Info: 7 8 6 5 3 4 1 2 REV - DESCRIPT - DATE - APPRVD AMPHENOL PART NUMBER CONFIGURATION U90 - G 3X1 - 1XXX HEAT SINK OPTION 1 = NO HEAT SINK OR CLIP SHIPPED 5 = PIN STYLE HEAT SINK AND CLIP H1=15.1; H2=6.5; SAN HEIGHT 6 = PIN STYLE HEAT SINK AND CLIP (H1=12.8; H2=4.2; PCI HEIGHT)

Contextual Info: 8 7 6 5 4 1 2 3 REVISIONS REV. U92 - A2X0 - 1X0X - XX F HEAT SINK OPTION 1 - NO HEAT SINK, NO CLIP 2 - FIN STYLE HEAT SINK BLACK OXIDE WITH CLIP 3 - FIN STYLE HEAT SINK (NICKEL PLATED) WITH CLIP D E F G H J K DESCRIPTION DATE PART # CORRECTED IN ISO VIEWS

Contextual Info: SPECIFYING OMEGALUX HEAT CABLE For Piping Systems HEAT LOSS CALCULATIONS CALCULATING HEAT LOSSES FROM INSULATED METAL PIPES STEP 1. OBTAIN NECESSARY INFORMATION A. Desired pipe maintenance temperature in °F TM . B. Minimum expected ambient temperature in °F (TA).

JESD51-7

Abstract: JESD51-1 JESD-51 G30-88 JESD-51-1 JESD51 JESD51-5 TB379 thermal resistance standards
Contextual Info: Thermal Characterization of Packages for ICs Technical Brief December 1999 TB379.1 Author: Michael Colquitt Introduction Any operating semiconductor device will produce heat as a by-product. Because heat can have significant effects on circuit performance and reliability, the management of heat

Contextual Info: 8 7 5 6 4 3 2 D 1 REVISIONS AMPHENOL PART NUMBER CONFIGURATION U90 - T 1 X 1 - 1 X X X PACKAGING HEAT SINK OPTION 5 = PIN STYLE HEAT SINK NICKEL PLATED AND CLIP (H=6.5mm; SAN HEIGHT) 1 = TRAY PACKAGING W/ HEAT SINK IN SEPARATE TRAY 6 = PIN STYLE HEAT SINK (NICKEL PLATED) AND CLIP (H=4.2mm; PCI HEIGHT)

raychem termination kit installation instructions

Abstract: raychem catalog termination kit raychem termination kit raychem catalog for 33 kV cable termination kit raychem TERMINATION CABLE 36 KV tyco lug raychem heat shrink terminations IXSU-F raychem termination kit 24 kv raychem outdoor termination kit
Contextual Info: Energy Division Raychem heat-shrinkable medium voltage terminations IXSU-F/OXSU-F Raychem heat-shrinkable medium voltage terminations IXSU-F/OXSU-F for indoor and outdoor applications for polymeric cables up to 42 kV Raychem heat-shrinkable medium voltage terminations IXSU-F/OXSU-F

EN50343

Abstract: afnor nf 16-101 E1042 din 5510-2 AS81531 6853 HX-SCE-1K T-20019 TTDS-108 BS6853
Contextual Info: Wire and Harness ID Products Heat-Shrink/Cable Markers HX-SCE Low fire hazard heat-shrinkable wire identification sleeves Thin wall, zero-halogen, low smoke, low toxicity, radiation crosslinked, UV stabilised polyolefin heat-shrinkable tubing, assembled as cut sleeves organized in a ladder format.

231-75PAB-14V

Abstract: 251-62AB 216-40CTT wakefield engineering 67 c 945 p 239 c MO-184 REF-10 Wakefield Engineering EIA-481-3 MS-013
Contextual Info: BOARD LEVEL HEAT SINKS BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS D 2PAK, TO-220, SOL-20 Surface Mount Heat Sinks 216 SERIES Standard P/N 216-40CT 216-40CTT 216-40CTR Height Above PC Board .390 in. 9.9 .390 in. (9.9) .390 in. (9.9) Package Format Bulk Tube

A25Y

Abstract: HSTTV12-48-Q
Contextual Info: PAN -SHRINK Catalog SA# 101N48F-AIS DRY -S HRINK ™ , DAMP-SHRINK ™ and WET-SHRINK ™ Heat Shrink and Abrasion Protection Products Contents Heat Shrink Products Type Polyolefin, General Purpose Tubing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . HSTT . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Contextual Info: FEATURES High efficiency: 92% @ 12V/8A Š Size: Š 58.4mmx22.8mmx8.4mm 2.30”x0.90”x0.33” (Without heat-spreader) 58.4mmx22.8mmx12.7mm (2.30”x0.90”x0.50”) (With heat-spreader) Š Standard footprint Š Industry standard pin out Š Fixed frequency operation

Contextual Info: FEATURES Š High efficiency: 84% @ 1.0V/50A Š Size: 33.0x22.8x9.5mm 1.30”x0.90”x0.37” ( W/O heat-spreader ) 33.0x22.8x12.7mm (1.30”x0.90”x0.50”) ( With heat-spreader ) Š Industry standard footprint and pinout Š Fixed frequency operation Š

Contextual Info: FEATURES  High efficiency: 92% @ 12V/8A  Size: 58.4mmx22.8mmx8.4mm 2.30”x0.90”x0.33” (Without heat-spreader) 58.4mmx22.8mmx12.7mm (2.30”x0.90”x0.50”) (With heat-spreader)  Standard footprint  Industry standard pin out  Fixed frequency operation

dc to dc converter 48v to 12v 10a diagram

Contextual Info: FEATURES Š High efficiency: 87% @ 1.2V/35A Š Size: 33.0x22.8x9.5mm 1.30”x0.90”x0.37” ( W/O heat-spreader ) 33.0x22.8x12.7mm (1.30”x0.90”x0.50”) ( With heat-spreader ) Š Industry standard footprint and pinout Š Fixed frequency operation Š

DSP56301

Abstract: DSP56301PW66
Contextual Info: Design Considerations Heat Dissipation Considerations Power, Ground, and Noise Design Considerations Heat Dissipation Considerations The average chip-junction temperature, TJ, in °C can be obtained from: TJ = TA + PD x ΘJA (1) Where: TA = Ambient Temperature, °C

V48SH05017

Contextual Info: FEATURES Š High efficiency: 91.5% @ 5V/17A Š Size: 33.0x22.8x9.5mm 1.30”x0.90”x0.37” ( W/O heat-spreader ) 33.0x22.8x12.7mm (1.30”x0.90”x0.50”) ( With heat-spreader ) Š Industry standard footprint and pinout Š Fixed frequency operation Š

Contextual Info: FEATURES Š Š High efficiency: 85% @ 1.0V/35A Size: 33.0x22.8x9.5mm 1.30”x0.90”x0.37” ( W/O heat-spreader ) 33.0x22.8x12.7mm (1.30”x0.90”x0.50”) ( With heat-spreader ) Š Industry standard footprint and pinout Š Fixed frequency operation Š