HC981 Search Results
HC981 Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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Contextual Info: REV. jim i^ ^ m M I . | IIM| — 55.9 APPD. ECN. ND. A HC981305 S. B HC981815 _eo C H C981936 S. LU Chen LU H C982461 D S. L U NDTESi HC982479 E A MATERIALI C D V E R AND BA SE HOUSING« L C P , UL 94V -0,CO LO RiN A TU R A L. CAM ACTUATDRi P P S , UL94V-0,CDLDRiBRDW N . |
OCR Scan |
HC981815 HC981305 C981936 C982461 HC982479 UL94V-0 PGA370 | |
HC981Contextual Info: / REV. NO TES: 1 MATERIALS OF AND © ECN. NO. A H C 96434 B HC981 8 47 APPD. C. CHEN 0 3 -1 6 -9 6 D ick Lee 7/1 5 98 ARE SHOWN ON DRAWING NO. 3 0 7 - 0 0 0 0 - 7 8 8 . A POSITION NO. FOR REFERENCE ONLY. A H L 13 N N N — □ □ □ DRAWING NO. 3 0 7 - 0 0 0 0 - 2 9 7 . |
OCR Scan |
HC981 HL131 HC98709 HC96434 | |
Contextual Info: ITRM DESCRIPTION 1 HOUSING 2 CONTACT Q'TY MATERIAL TREATMENT 1 HIGH TEMPERATURE THERMOPLASTIC, UL94V-0 RATED MOLDED BLACK SAME AS NO. OF POSITION. SEE BELOW REMARK 50u" MIN. NICKEL UNDER PLATING, lOOu" MIN. TIN/LEAD PLATING ON TAILS, CONTACT AREA PLATING SEE BELOW. |
OCR Scan |
UL94V-0 MIL-STD-202F, HC990483 | |
foxconn dimmContextual Info: ITEM DESCRIPTIO N Q'TY MATERIAL TREATMENT 1 HOUSING 1 2 CONTACT SAME AS NO. OF POSITION SEE BELOW PHOSPHOR BRONZE 50 ¡1" MIN. NICKEL UNDER PLATING, 100 n " MIN. TIN/LEAD PLATING AT TAIL. (SEE BELOW FOR CONTACT AREA PLATING) 3 METAL SPRING 2 COPPER ALLOY |
OCR Scan |
500VDC. MIL-STD-208F, IL-STD-1344A IL-STD-202F HC992352 HC98399 HC97164 AS0A12 foxconn dimm | |
T6083
Abstract: foxconn motherboard HC96227 8484 au mc 14003
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OCR Scan |
HC96334 EH260S» L9603 E35G3 T6083 foxconn motherboard HC96227 8484 au mc 14003 | |
307-070
Abstract: foxconn SJ05
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OCR Scan |
UL94V-0 HC990797 HC981629 HC98746 HC961280 09-NDING HC990799 307-070 foxconn SJ05 | |
Contextual Info: REV I C CN . NO CIS'W 1 NOTES: 1. DIMENSIONS SMALL BE INTERPRETED PER ANSI Y14.5M-1982 0 \ . 6 «0 . 1S 0. 22 10.05 t I «> 1 0 . 1 0 |X |Y |Z © i' | IId o o o o o o d e : : □ H t y oii ooc : : i d o o o o i o o o I PQ5. 1 _ B / i » io .i© H |
OCR Scan |
5M-1982 | |
Contextual Info: REMARK TTRKf DESCRIPTION Q’ TY MATERIAL TREATMENT 1 HOUSING 1 HIGH TEMPERATURE THERMOPLASTIC, UL94V-0 RATED MOLDED BLACK 2 CONTACT SAME AS NO. OF POSITION. SEE BELOW 50u" MIN. NICKEL UNDER PLATING, 100u" MIN. TIN/LEAD PLATING ON TAILS, CONTACT AREA PLATING SEE BELOW. |
OCR Scan |
UL94V-0 HC981840 HC983061 HC990456 eb/24 | |
M3876
Abstract: EH023 C0365 94v0 ys
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OCR Scan |
HC981883 M3876 EH023 C0365 94v0 ys | |
Contextual Info: P. 3/ 3 SPECIFICATIONS: 1. PHYSICAL: 1-1. HOUSING: THERMOPLASTIC, NYLON 6.6 , UL94 V-2 RATING. 1-2. CONTACT: COPPER ALLOY. 2. ELECTRICAL CHARACTERISTICS: 2-1. CONTACT CURRENT RATING: 10 AMPERES PER CONTACT. 2-2. DIELECTRIC WITHSTANDING VOLTAGE: 1500V VRMS AT SEA LEVEL. |
OCR Scan |
MIL-STD-208F, HC981555 | |
ic nn 5198 k
Abstract: ic nn 5198 r nn 5198 k HC1103 SC 8582 HC1138 HC1105 I R 8836 HC1108 HC1118
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OCR Scan |
HIL-STO-206F. 105t3. HC95573 ic nn 5198 k ic nn 5198 r nn 5198 k HC1103 SC 8582 HC1138 HC1105 I R 8836 HC1108 HC1118 | |
20080-DC
Abstract: HM2006
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OCR Scan |
UL94V-0 HC961889 HC96936 HC96257 MIL-STD-208F, Feb/28/ 20080-DC HM2006 | |
C2402
Abstract: iw 1688 KT 8030 ic 8287 Class 5.6 C1535
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OCR Scan |
HC972249 C2402 iw 1688 KT 8030 ic 8287 Class 5.6 C1535 |